Abstract: A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

Abstract: Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

Abstract: A dual-sided module can include a redistribution layer having first and second sides, and a first-side portion implemented on the first side of the redistribution layer and including a first component mounted on the first side of the redistribution layer, and a first mold structure implemented to at least partially encapsulate the first component. The dual-sided module can further include a second-side portion implemented on the second side of the redistribution layer and including a second component mounted on the second side of the redistribution layer, a plurality of conductive mounting structures, and a second mold structure implemented to at least partially encapsulate the second component. The second mold structure can further encapsulate the conductive mounting features while providing respective exposed mounting surfaces of the conductive mounting features.

Abstract: A molded package module has a substrate, and multiple interconnect members attached to a bottom side of the substrate. A mold surrounds and extends between the interconnect members. The interconnect members can be electrically and thermally conductive and include a first post portion adjacent the substrate and a second portion adjacent the first post portion so that the first post portion is interposed between the second portion and the substrate. The second portion includes a solderable material. The molded package module can be mounted via a solderable surface at a distal end of the second portion to a motherboard.

Abstract: A packaging substrate can include a first surface having a first mounting region of a first electronic module region and a second mounting region of a second electronic module region, the second electronic module region being adjacent to the first electronic module region. The packaging substrate can include a second opposing surface having a first electrical contacts region of the first electronic module region and a second electrical contacts region of the second electronic module region. A saw street region can extend between the first and second electronic module regions, and a saw street feature can be formed on the second opposing surface within at least a portion of the saw street region, the saw street feature comprising a solder mask layer over a metal layer and being spaced from the first and second electronic module regions.

Abstract: Devices and methods related to metallization of ceramic substrates for shielding applications. In some embodiments, a ceramic assembly includes a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features along the boundary, each conductive feature extending into the first region and the second region such that when the first region and the second region are separated to form their respective side walls, each side wall includes exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer.

Abstract: In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and implementing a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Abstract: Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.

Abstract: A packaging substrate can include a first surface and a second opposing surface, the first surface including a first mounting region of a first electronic module region and the second opposing surface including a first electrical contacts region of the first electronic module region. The packaging substrate can include a saw street region with at least a portion that surrounds the first electronic module region, and a saw street feature formed on the second opposing surface within at least a portion of the saw street region, the saw street feature being a solder mask layer over a metal layer.

Abstract: A packaged radio-frequency device can include a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The packaging substrate may include a first component mounted on the first side and a first overmold structure implemented on the first side, the first overmold structure substantially encapsulating the first component. The packaging substrate may further include a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement a redundant ground pad or a redundant portion of a ground pad, and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a multi-mode power amplifier circuit in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

Abstract: Shielded module fabrication methods and devices. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

Abstract: Methods are disclosed for manufacturing electronic packages and electronic assemblies. A method of manufacture can include encapsulating electrically conductive through-mold connections with a mold structure and removing a portion of the mold structure to expose the electrically conductive through-mold connections. The electrically conductive though-mold connections can have a higher melting point than solder connections that can connect the electrically conductive through-mold connections to a circuit board. Related electronic packages, electronic assemblies, electronic devices, and methods of mounting an electronic package to a circuit board are disclosed.

Abstract: Methods are disclosed for mounting an electronic package to a circuit board are disclosed. The electronic package can be mounted to the circuit board by use of intermediate solder portions such that each intermediate solder portion couples a corresponding through-mold connection of the electronic package to the circuit board. The through-mold connections can have a melting point in excess of a melting point of the intermediate solder portions. Related electronic packages, electronic assemblies, electronic devices, and methods of manufacturing electronic packages are disclosed.

Abstract: An electronic package is provided. The electronic package includes a substrate configured to receive one or more electronic modules, a first electronic module mounted to a first side of the substrate, a first mold structure extending over at least part of the first side of the substrate; and a group of electrically conductive through-mold connections provided on the first side of the substrate. The first mold structure substantially encapsulates the group of through-mold connections. The group of through-mold connections is exposed through the first mold structure. The group of through-mold connections is configured to couple to a circuit board by a corresponding group of intermediate solder portions. The through-mold connections can have a melting point in excess of a melting point of the intermediate solder portion. Related electronic assemblies, electronic devices, and methods of manufacturing and/or mounting an electronic package are provided.

Abstract: An integrated device package is disclosed. The integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency signal. The electromagnetic interference shield layer has a thickness in a range between 2 ?m and 6 ?m. A surface of the electromagnetic interference shield layer includes an ink mark that has a thickness in a range between 5 ?m and 15 ?m, or a laser mark that has a depth in a range between 1 ?m and 2 ?m.

Abstract: An integrated device package is disclosed. the integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. At least a portion of the shield layer is in contact with the electronic component. The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency signal. A surface of the electromagnetic interference shield layer includes an ink mark or a laser mark.

Abstract: A dual-sided packaged radio-frequency (RF) module comprises a packaging substrate having a first surface with at least one RF circuit component mounted thereon and a second surface opposite to the first surface with at least one circuitry component mounted thereon, at least one contact feature attached to the second surface of the packaging substrate, a vertical extension of the at least one contact feature being larger than a distance between a bottom surface of the at least one circuitry component and the second surface of the packaging substrate, an underside molding encapsulating the at least one circuitry component and the at least one contact feature, a bottom surface of the underside molding being flush with the bottom surface of the at least one circuitry component, and a trench structure formed in the underside molding around the at least one contact feature.

Abstract: A packaging substrate can include a first surface and a second opposing surface, the first surface including a first mounting region of a first electronic module region and the second opposing surface including a first electrical contacts region of the first electronic module region. The packaging substrate can include a saw street region with at least a portion that surrounds the first electronic module region, and a saw street feature formed on the second opposing surface within at least a portion of the saw street region, the saw street feature being a solder mask layer over a metal layer.

Abstract: Devices for fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.