Abstract: Examples include a fluid ejection device comprising a molded panel, an ejection die molded in the molded panel, and an integrated circuit molded in the molded panel. The ejection die comprises ejection nozzles to selectively dispense printing material. The integrated circuit receives nozzle data and controls the selective dispensation of printing material by the ejection nozzles based at least in part on the nozzle data. The molded panel has a fluid communication channel formed therethrough and fluidly connected to the ejection die.

Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.

Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.

Abstract: A method of adhering a cover layer to a substrate includes forming an array of nano-structures on a substrate. A flowable material is applied to the substrate, the flowable material substantially enveloping the nano-structures on the substrate. The flowable material is solidified to form a cover layer on the substrate, the cover layer being anchored to the substrate via the nano-structures.

Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.

Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.

Abstract: A method of forming a micro-structure involves forming a multi-layered structure including i) an oxidizable material layer on a substrate and ii) another oxidizable material layer on the oxidizable material layer. The oxidizable material layer is formed of an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. The method further involves forming a template, including a plurality of pores, from the other oxidizable material layer, and growing a nano-pillar inside each pore. The nano-pillar has a predefined length that terminates at an end. A portion of the template is selectively removed to form a substantially even plane that is oriented in a position opposed to the substrate. A material is deposited on at least a portion of the plane to form a film layer thereon, and the remaining portion of the template is selectively removed to expose the nano-pillars.

Abstract: A method of forming a micro-structure involves forming a multi-layered structure including i) an oxidizable material layer on a substrate and ii) another oxidizable material layer on the oxidizable material layer. The oxidizable material layer is formed of an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. The method further involves forming a template, including a plurality of pores, from the other oxidizable material layer, and growing a nano-pillar inside each pore. The nano-pillar has a predefined length that terminates at an end. A portion of the template is selectively removed to form a substantially even plane that is oriented in a position opposed to the substrate. A material is deposited on at least a portion of the plane to form a film layer thereon, and the remaining portion of the template is selectively removed to expose the nano-pillars.

Abstract: In an example of a method for making a nano-structure, an aluminum layer is partially anodized to form a porous anodic alumina structure. The aluminum layer is positioned on an oxidizable material layer. The porous anodic alumina structure is exposed to partial anisotropic etching to form tracks within the porous anodic alumina structure. A remaining portion of the aluminum layer is further anodized to form paths where the tracks are formed. The oxidizable material layer is anodized to from an oxide, where the oxide grows through the paths formed within the porous anodic alumina structure to form a set of super nano-pillars.

Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.

Abstract: An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic.

Abstract: A nano-structure includes an oxidized layer, and at least two sets of super nano-pillars positioned on the oxidized layer. Each of the at least two sets of super nano-pillars includes a plurality of super nano-pillars, where each set is separated a spaced distance from each other set.

Abstract: A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.

Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

Abstract: A method of forming capped nano-pillars on a substrate includes forming a template on the substrate, the template defining nano-pores having a first width. The nano-pores are partially filled to define nano-pillar stem portions of a first thickness corresponding to the first width. The nano-pores are re-shaped to define re-shaped nano-pore sections having a second width different than the first width. The re-shaped nano-pore sections are at least partially filled to define nano-pillar cap portions of a second thickness corresponding to the second width. The method further includes removing the template.

Abstract: Nano-scale structures are provided wherein nano-structures are formed on a substrate surface and a base material is applied between the nano-structures.

Abstract: A method of forming a nano-structure involves forming a multi-layered structure including an oxidizable material layer established on a substrate, and another oxidizable material layer established on the oxidizable material layer. The oxidizable material layer is an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. Anodizing the other oxidizable material layer forms a porous anodic structure, and anodizing the oxidizable material layer forms a dense oxidized layer and nano-pillars which grow through the porous anodic structure into pores thereof. The porous structure is selectively removed to expose the nano-pillars. A surface (I) between the dense oxidized layer and a remaining portion of the oxidizable material layer is anodized to consume a substantially cone-shaped portion of the nano-pillars to form cylindrical nano-pillars.

Abstract: Nano-structure includes a substrate and a non-oxidized portion of a metal layer (having an expansion coefficient, during oxidation, that is more than 1) on the substrate. An oxide layer is formed on the non-oxidized portion. A plurality of metal oxide nano-pillars is grown from the oxide layer. Each nano-pillar is grown through a plurality of pores defined in a template. A space is defined between adjacent nano-pillars. A continuous metal oxide cap layer is over the nano-pillars and over, but not in, the space between adjacent nano-pillars. The cap layer is formed from end portions of the nano-pillars that merge together over a template surface. The cap layer is in contact with all of the nano-pillars. The oxide layer, the nano-pillars, and the oxide cap layer are formed from anodization of portions of the metal layer.

Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.