Abstract: Subject of the invention is a nonwoven, wherein the nonwoven fibers are organic polymer fibers, and wherein the nonwoven is consolidated with an aqueous binder, wherein the binder comprises protein and a polyphenolic compound from natural origin. Preferably, the nonwoven carrier is highly suitable for producing bituminous membranes. Subject of the invention are also uses, methods, bituminous membranes, binders and building materials, which are related to the nonwoven carrier.

Abstract: An optical synapse comprises a memristive device for non-volatile storage of a synaptic weight dependent on resistance of the device, and an optical modulator for volatile modulation of optical transmission in a waveguide. The memristive device and optical modulator are connected in control circuitry which is operable, in a write mode, to supply a programming signal to the memristive device to program the synaptic weight and, in a read mode, to supply an electrical signal, dependent on the synaptic weight, to the optical modulator whereby the optical transmission is controlled in a volatile manner in dependence on programmed synaptic weight.

Abstract: An approach to provide a semiconductor structure for a resistive switch device. The resistive switch device includes a bottom electrode, a dielectric material over the bottom electrode, and a metal oxide material on a portion of the dielectric material connecting to a portion of a top electrode where the metal oxide material has a controlled volume. Additionally, the approach includes a plurality of the resistive switch devices in a crossbar. The crossbar array includes the plurality of resistive switch devices on more than one bottom electrode and at least one top electrode connecting to the plurality of resistive switch devices.

Abstract: An electrical memristive device has a layer structure. The later structure comprises two electrodes and a bilayer material arrangement that connects the two electrodes. The bilayer material arrangement may, for example, be sandwiched by the two electrodes, in direct contact therewith. The bilayer material arrangement includes an HfOy layer, where 1.3±0.1?y<1.9±0.1, as well as a WOx layer in direct contact with the HfOy layer, where 2.5±0.1?x<2.9±0.1. The bilayer arrangement involves sub-stoichiometric layers of HfOy and WOx, where the WOx layer may advantageously have a polycrystalline structure in the monoclinic phase, while the HfOy layer is preferably amorphous.

Abstract: An electrochemical device includes an electrochemical cell and an electric circuit. The electrochemical cell comprises a first solid component and a second solid component. The two solid components comprise same chemical elements but have different concentrations of at least one type of the chemical elements. A solid electrolyte is arranged between the two solid components. The solid electrolyte is a dielectric material. The electric circuit is connected to the electrochemical cell. The electrochemical cell may be operated according to a redox process, so as to exchange chemical elements of the at least one type between the first solid component and the second solid component and thereby change an electrical conductance of each of the two solid components.

Abstract: An optical synapse comprises a memristive device for non-volatile storage of a synaptic weight dependent on resistance of the device, and an optical modulator for volatile modulation of optical transmission in a waveguide. The memristive device and optical modulator are connected in control circuitry which is operable, in a write mode, to supply a programming signal to the memristive device to program the synaptic weight and, in a read mode, to supply an electrical signal, dependent on the synaptic weight, to the optical modulator whereby the optical transmission is controlled in a volatile manner in dependence on programmed synaptic weight.

Abstract: An electrochemical device includes an electrochemical cell and an electric circuit. The electrochemical cell comprises a first solid component and a second solid component. The two solid components comprise same chemical elements but have different concentrations of at least one type of the chemical elements. A solid electrolyte is arranged between the two solid components. The solid electrolyte is a dielectric material. The electric circuit is connected to the electrochemical cell. The electrochemical cell may be operated according to a redox process, so as to exchange chemical elements of the at least one type between the first solid component and the second solid component and thereby change an electrical conductance of each of the two solid components.

Abstract: Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip also includes a deflector arranged on top of the lens element and configured for deflecting light collimated through the latter toward the optical waveguide. The lens element includes electrical conductors connected to the electro-optical component. The electrical conductors of the lens element may for instance include one or more through vias, one or more bottom electrical lines on a bottom side of the lens element (facing the electro-optical component), and at least one top electrical line.

Abstract: An optical sensor includes an interaction region configured to comprise an analyte and an illumination source configured to illuminate the interaction region with an optical input signal. The optical sensor further includes an optical coupling structure configured to collect transmitted parts of the optical input signal from the interaction region and an optical neuromorphic network that is directly optically coupled to the optical coupling structure and is configured to receive and process the transmitted parts of the optical input signal in the optical domain. The invention further concerns a related method for analyzing an analyte by an optical sensor.

Abstract: An optical sensor includes an interaction region configured to comprise an analyte and an illumination source configured to illuminate the interaction region with an optical input signal. The optical sensor further includes an optical coupling structure configured to collect transmitted parts of the optical input signal from the interaction region and an optical neuromorphic network that is directly optically coupled to the optical coupling structure and is configured to receive and process the transmitted parts of the optical input signal in the optical domain. The invention further concerns a related method for analyzing an analyte by an optical sensor.

Abstract: An optical sensor includes an interaction region configured to comprise an analyte and an illumination source configured to illuminate the interaction region with an optical input signal. The optical sensor further includes an optical coupling structure configured to collect transmitted parts of the optical input signal from the interaction region and an optical neuromorphic network that is directly optically coupled to the optical coupling structure and is configured to receive and process the transmitted parts of the optical input signal in the optical domain. The invention further concerns a related method for analyzing an analyte by an optical sensor.

Abstract: An optical sensor includes an interaction region configured to comprise an analyte and an illumination source configured to illuminate the interaction region with an optical input signal. The optical sensor further includes an optical coupling structure configured to collect transmitted parts of the optical input signal from the interaction region and an optical neuromorphic network that is directly optically coupled to the optical coupling structure and is configured to receive and process the transmitted parts of the optical input signal in the optical domain. The invention further concerns a related method for analyzing an analyte by an optical sensor.

Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.

Abstract: Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip also includes a deflector arranged on top of the lens element and configured for deflecting light collimated through the latter toward the optical waveguide. The lens element includes electrical conductors connected to the electro-optical component. The electrical conductors of the lens element may for instance include one or more through vias, one or more bottom electrical lines on a bottom side of the lens element (facing the electro-optical component), and at least one top electrical line.

Abstract: The present invention is directed to an optical assembly that comprises a coupler and a connecting structure. The coupler comprises first optical waveguides, a male alignment feature and optical connection means. The first optical waveguides extend parallel from a first end to a second end and form a planar end portion at the level of the second end. The male alignment feature, to which said planar end portion is secured, protrudes transversally to an average plane of the planar end portion, at the level of said planar end portion. The optical connection means are arranged at the level of said first end. The connecting structure comprises second optical waveguides that extend parallel to said plane and a female alignment feature, which is configured to receive said male alignment feature, and extends transversally to said plane at the level of the planar end portion.

Abstract: Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip also includes a deflector arranged on top of the lens element and configured for deflecting light collimated through the latter toward the optical waveguide. The lens element includes electrical conductors connected to the electro-optical component. The electrical conductors of the lens element may for instance include one or more through vias, one or more bottom electrical lines on a bottom side of the lens element (facing the electro-optical component), and at least one top electrical line.

Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

Abstract: A device for propagating light is described, comprising: a substrate having a semiconductor material, an insulating layer, wherein the insulating layer is arranged on the substrate, a recess reaching through the insulating layer and into the substrate, wherein the recess is at least partially filled with a filler material, and a waveguide arranged in or on the filler material.

Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.

Abstract: The invention relates to a wafer prober including an optical waveguide, the optical waveguide having a first optical coupling end segment with a first optical coupling surface being devoid of cladding. The first optical coupling end segment being configured to provide an adiabatic optical coupling to a second optical coupling end segment of a second optical waveguide of a photonic integrated circuit on a semiconductor wafer when the optical waveguide is aligned with respect to the semiconductor wafer according to a set of alignment requirements. The second optical coupling end segment having a second optical coupling surface that is devoid of cladding. The second optical coupling surface is parallel to a wafer surface of the semiconductor wafer. An alignment system configured to align the optical waveguide with respect to the semiconductor wafer according to the set of alignment requirements.