Abstract: A system for exhaust gas routing and aftertreatment in a motor vehicle includes a first exhaust gas duct element, which has an inlet opening and an outlet opening, and a second exhaust gas duct element, which has a transfer pipe having a longitudinal axis and having a sleeve surface and a first closed end. An intake opening is provided in the sleeve surface adjacent to the closed end. The transfer pipe projects into the outlet opening and is accommodated in the first exhaust gas duct element by its closed end and the intake opening, so that exhaust gas flowing in through the inlet opening in a first direction can flow through the intake opening and into the transfer pipe and flow—viewed in the direction of the longitudinal axis of the transfer pipe—in the transfer pipe through the outlet opening out of the first exhaust gas duct element.

Abstract: An engine block arrangement includes an engine block and an exhaust gas system. The exhaust gas system, viewed in the flow direction of an exhaust gas flow, includes an exhaust gas turbocharger, an oxidation catalytic converter, a feed device for a urea-water solution, a particle filter, and an SCR catalytic converter arranged one behind the other. The exhaust gas turbocharger, the oxidation catalytic converter, the feed device for the urea-water solution, the particle filter, and the SCR catalytic converter are situated together on the engine block along one side thereof, the side being oriented essentially perpendicularly with respect to an output side of the engine block.

Abstract: An exhaust gas system includes a reducing agent preparation section having a first cylindrical exhaust gas line pipe section opening approximately perpendicularly into a second exhaust gas line pipe section via an opening in a cylinder lateral surface of the second exhaust gas line pipe section. An injector unit for introducing the reducing agent into the exhaust gas is situated at the first exhaust gas line pipe section, upstream from the opening. The opening in the cylinder lateral surface of the second exhaust gas line pipe section has a larger extension in the direction of the longitudinal extent of the second exhaust gas line pipe section than transversely thereto. In a method using the reducing agent preparation section a rotating exhaust gas flow is formed within the second exhaust gas line pipe section.

Abstract: A system for exhaust gas routing and aftertreatment in a motor vehicle includes a first exhaust gas duct element, which has an inlet opening and an outlet opening, and a second exhaust gas duct element, which has a transfer pipe having a longitudinal axis and having a sleeve surface and a first closed end. An intake opening is provided in the sleeve surface adjacent to the closed end. The transfer pipe projects into the outlet opening and is accommodated in the first exhaust gas duct element by its closed end and the intake opening, so that exhaust gas flowing in through the inlet opening in a first direction can flow through the intake opening and into the transfer pipe and flow—viewed in the direction of the longitudinal axis of the transfer pipe—in the transfer pipe through the outlet opening out of the first exhaust gas duct element.

Abstract: An exhaust gas system includes a reducing agent preparation section having a first cylindrical exhaust gas line pipe section opening approximately perpendicularly into a second exhaust gas line pipe section via an opening in a cylinder lateral surface of the second exhaust gas line pipe section. An injector unit for introducing the reducing agent into the exhaust gas is situated at the first exhaust gas line pipe section, upstream from the opening. The opening in the cylinder lateral surface of the second exhaust gas line pipe section has a larger extension in the direction of the longitudinal extent of the second exhaust gas line pipe section than transversely thereto. In a method using the reducing agent preparation section a rotating exhaust gas flow is formed within the second exhaust gas line pipe section.

Abstract: An engine block arrangement includes an engine block and an exhaust gas system. The exhaust gas system, viewed in the flow direction of an exhaust gas flow, includes an exhaust gas turbocharger, an oxidation catalytic converter, a feed device for a urea-water solution, a particle filter, and an SCR catalytic converter arranged one behind the other. The exhaust gas turbocharger, the oxidation catalytic converter, the feed device for the urea-water solution, the particle filter, and the SCR catalytic converter are situated together on the engine block along one side thereof, the side being oriented essentially perpendicularly with respect to an output side of the engine block.

Abstract: A method is disclosed for providing electrical connections to electronic elements within a multilayer module. The method includes providing first and second active layers having first and second edges, respectively. Each active layer includes a flexible, polymer substrate and at least one electronic element formed within the substrate. Electrically-conductive traces provide electrical connections from the first and second edges to the electronic elements. An adhesive is applied to at least one of a top surface of the first active layer and a bottom surface of the second active layer and the top surface of the first active layer is adhered to the bottom surface of the second active layer. The first edge and the second edge are aligned with each other thereby forming a side of the multilayer module. Electrically-conductive lines are applied along the side of the multilayer module to provide electrical connections to the traces.

Abstract: A pre-formed integrated circuit chip is encapsulated into an electronic package, by forming an interconnect assembly separately from the pre-formed integrated circuit chip. If the interconnect assembly tests good it is bonded to the prepared integrated circuit chip. The interconnect assembly is flip bonded to the chip. The interconnect assembly and chip are passivated or potted into an integral structure to provide the electronic package. At least one test pad is defined in an interconnect layer, which test pad can be accessed and electrically connected on opposing sides of the test pad. The chip is underfilled with an insulating material to remove all voids between the chip and the interconnect assembly. The integrated circuit chip is then thinned. The test pad is accessed to test the chip. A plurality of interconnect assemblies and chips are bonded together to form a corresponding plurality of electronic packages.

Abstract: A pre-formed integrated circuit chip is encapsulated into an electronic package, by forming an interconnect assembly separately from the pre-formed integrated circuit chip. If the interconnect assembly tests good it is bonded to the prepared integrated circuit chip. The interconnect assembly is flip bonded to the chip. The interconnect assembly and chip are passivated or potted into an integral structure to provide the electronic package. At least one test pad is defined in an interconnect layer, which test pad can be accessed and electrically connected on opposing sides of the test pad. The chip is underfilled with an insulating material to remove all voids between the chip and the interconnect assembly. The integrated circuit chip is then thinned. The test pad is accessed to test the chip. A plurality of interconnect assemblies and chips are bonded together to form a corresponding plurality of electronic packages.

Abstract: A multilayer module includes a first active layer with a first edge and second active layer with a second edge. Each active layer includes a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces which provide electrical connection from the respective edge to the electronic element of the active layer. The second active layer is adhered to the first active layer so that the first edge and second edge are aligned with each other thereby forming a side of the multilayer module. The multilayer module further includes a plurality of electrically-conductive lines along the side of the multilayer module, the lines providing electrical connection to the traces.

Abstract: Each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a substrate therein. The plurality of multilayer modules includes a first multilayer module including a first layer and a second multilayer module including a second layer each having a top side and bottom side. The first layer and second layer each includes a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further includes a heat-separating layer disposed between the top side of the first layer and the bottom side of the second layer. The first multilayer module is adhered to the second multilayer module and the first multilayer module can be detached from the second multilayer module by applying heat to the heat-separating layer.

Abstract: A multilayer module includes a first active layer with a first edge and second active layer with a second edge. Each active layer includes a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces which provide electrical connection from the respective edge to the electronic element of the active layer. The second active layer is adhered to the first active layer so that the first edge and second edge are aligned with each other thereby forming a side of the multilayer module. The multilayer module further includes a plurality of electrically-conductive lines along the side of the multilayer module, the lines providing electrical connection to the traces.

Abstract: A pre-formed integrated circuit chip is encapsulated into an electronic package, by forming an interconnect assembly separately from the pre-formed integrated circuit chip. If the interconnect assembly tests good it is bonded to the prepared integrated circuit chip. The interconnect assembly is flip bonded to the chip. The interconnect assembly and chip are passivated or potted into an integral structure to provide the electronic package. At least one test pad is defined in an interconnect layer, which test pad can be accessed and electrically connected on opposing sides of the test pad. The chip is underfilled with an insulating material to remove all voids between the chip and the interconnect assembly. The integrated circuit chip is then thinned. The test pad is accessed to test the chip. A plurality of interconnect assemblies and chips are bonded together to form a corresponding plurality of electronic packages.

Abstract: A stack of multilayer modules has a segmentation layer disposed between neighboring multilayer modules. The segmentation layer facilitates the separation of neighboring multilayer modules. The stack of multilayer modules includes a first multilayer module and a second multilayer module. Each multilayer module includes a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The second multilayer module is disposed to be neighboring the first multilayer module with at least one segmentation layer between the first and second multilayer modules. The segmentation layer includes a metal layer and at least one thermoplastic adhesive layer. When heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.

Abstract: A pre-formed integrated circuit chip is encapsulated into an electronic package, by forming an interconnect assembly separately from the pre-formed integrated circuit chip. If the interconnect assembly tests good it is bonded to the prepared integrated circuit chip. The interconnect assembly is flip bonded to the chip. The interconnect assembly and chip are passivated or potted into an integral structure to provide the electronic package. At least one test pad is defined in an interconnect layer, which test pad can be accessed and electrically connected on opposing sides of the test pad. The chip is underfilled with an insulating material to remove all voids between the chip and the interconnect assembly. The integrated circuit chip is then thinned. The test pad is accessed to test the chip. A plurality of interconnect assemblies and chips are bonded together to form a corresponding plurality of electronic packages.

Abstract: A method fabricates multilayer modules with flexible substrates. The method includes stacking a plurality of active layer sheets and a plurality of segmentation layer sheets with adhesive between the layer sheets, thereby assembling an arrayed module pre-form. Each segmentation layer sheet includes a thermally-conductive material. The method further includes stacking a plurality of arrayed module pre-forms with at least one segmentation layer sheet between each pair of arrayed module pre-forms and with a thermoplastic adhesive material applied to the segmentation layer sheets. The method further includes laminating the active layer sheets and the segmentation layer sheets together, cutting the stack of arrayed multilayer modules, forming electrically-conductive lines along at least one side of the stack of multilayer modules, and segmenting the stack of multilayer modules into individual multilayer modules.

Abstract: A stack of multilayer modules has a segmentation layer disposed between neighboring multilayer modules. The segmentation layer facilitates the separation of neighboring multilayer modules. The stack of multilayer modules includes a first multilayer module and a second multilayer module. Each multilayer module includes a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The second multilayer module is disposed to be neighboring the first multilayer module with at least one segmentation layer between the first and second multilayer modules. The segmentation layer includes a metal layer and at least one thermoplastic adhesive layer. When heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.

Abstract: A multilayer module includes a first active layer with a first edge and second active layer with a second edge. Each active layer includes a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces which provide electrical connection from the respective edge to the electronic element of the active layer. The second active layer is adhered to the first active layer so that the first edge and second edge are aligned with each other thereby forming a side of the multilayer module. The multilayer module further includes a plurality of electrically-conductive lines along the side of the multilayer module, the lines providing electrical connection to the traces.

Abstract: Each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a substrate therein. The plurality of multilayer modules includes a first multilayer module including a first layer and a second multilayer module including a second layer each having a top side and bottom side. The first layer and second layer each includes a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further includes a heat-separating layer disposed between the top side of the first layer and the bottom side of the second layer. The first multilayer module is adhered to the second multilayer module and the first multilayer module can be detached from the second multilayer module by applying heat to the heat-separating layer.