Abstract: The heating apparatus includes a chamber configured to accommodate an object, a stage on which the object is placed and partitioning an internal space of the chamber into a lower region and an upper region, a heating mechanism configured to heat the object on the stage, and a gas supplier configured to supply gas to the lower region. The chamber has an outlet port being formed in the upper region. The stage includes a gap through which the gas supplied to the lower region by the gas supplier flows from the lower region to the upper region along a wall surface of the chamber. The method includes providing the object in the chamber, supplying the gas such that the gas flows from the lower region to the upper region along a wall surface of the chamber, and effecting a solder joint by increasing a temperature of the object.

Abstract: The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.

Abstract: The present invention relates to a method for producing a soldered product by which soldering can be accomplished without using a jig.

Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

Abstract: The present invention relates to a method for producing a soldered product by which soldering can be accomplished without using a jig.