Patents by Inventor Arthur P. Riaf
Arthur P. Riaf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10658207Abstract: Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a platen having different regions, where the pressure levels in the regions may be substantially equal. For example, the platen may comprise a platen body comprising first and second recesses, the first recess defining a fluid region for holding fluid for maintaining a temperature of the substrate at a desired temperature, the second recess defining a first cavity for holding a ground circuit; a first via defined in the platen body, the first via having first and second openings, the first opening proximate to the fluid region and the second opening proximate to the first cavity, wherein pressure level of the fluid region may be maintained at a level that is substantially equal to pressure level of the first cavity.Type: GrantFiled: April 16, 2018Date of Patent: May 19, 2020Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: David E. Suuronen, Dale K. Stone, Shigeo Oshiro, Arthur P. Riaf, Edward D. MacIntosh
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Publication number: 20180233386Abstract: Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a platen having different regions, where the pressure levels in the regions may be substantially equal. For example, the platen may comprise a platen body comprising first and second recesses, the first recess defining a fluid region for holding fluid for maintaining a temperature of the substrate at a desired temperature, the second recess defining a first cavity for holding a ground circuit; a first via defined in the platen body, the first via having first and second openings, the first opening proximate to the fluid region and the second opening proximate to the first cavity, wherein pressure level of the fluid region may be maintained at a level that is substantially equal to pressure level of the first cavity.Type: ApplicationFiled: April 16, 2018Publication date: August 16, 2018Applicant: Varian Semiconductor Equipment Associates, Inc.Inventors: David E. Suuronen, Dale K. Stone, Shigeo Oshiro, Arthur P. Riaf, Edward D. MacIntosh
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Patent number: 10001161Abstract: A rotary union is disclosed for use in semiconductor processing applications. The rotary is coupled between a platen base and a platen of a rotating platen assembly. The rotary union includes a coiled flexible tube member for passing a flow of cryogenic fluid to the platen for cooling during an ion implant procedure. The coiled flexible tube member has a first configuration associated with a non-rotated position of the platen and a second configuration associated with a rotated position of the platen. In the first configuration the coiled flexible tube member has a first bend radius, and in the second configuration the coiled flexible tube member has a second bend radius that is smaller than first bend radius. The rotary union also includes a base with a peripheral wall that restricts movement of the coiled flexible tube member as it cycles between the first and second configurations.Type: GrantFiled: May 26, 2016Date of Patent: June 19, 2018Assignee: Varian Semiconductor Equipment Associates, Inc.Inventor: Arthur P. Riaf
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Patent number: 9953849Abstract: Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a platen having different regions, where the pressure levels in the regions may be substantially equal. For example, the platen may comprise a platen body comprising first and second recesses, the first recess defining a fluid region for holding fluid for maintaining a temperature of the substrate at a desired temperature, the second recess defining a first cavity for holding a ground circuit; a first via defined in the platen body, the first via having first and second openings, the first opening proximate to the fluid region and the second opening proximate to the first cavity, wherein pressure level of the fluid region may be maintained at a level that is substantially equal to pressure level of the first cavity.Type: GrantFiled: March 25, 2014Date of Patent: April 24, 2018Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.Inventors: David E. Suuronen, Dale K. Stone, Shigeo Oshiro, Arthur P. Riaf, Edward D. MacIntosh
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Publication number: 20160265583Abstract: A rotary union is disclosed for use in semiconductor processing applications. The rotary is coupled between a platen base and a platen of a rotating platen assembly. The rotary union includes a coiled flexible tube member for passing a flow of cryogenic fluid to the platen for cooling during an ion implant procedure. The coiled flexible tube member has a first configuration associated with a non-rotated position of the platen and a second configuration associated with a rotated position of the platen. In the first configuration the coiled flexible tube member has a first bend radius, and in the second configuration the coiled flexible tube member has a second bend radius that is smaller than first bend radius. The rotary union also includes a base with a peripheral wall that restricts movement of the coiled flexible tube member as it cycles between the first and second configurations.Type: ApplicationFiled: May 26, 2016Publication date: September 15, 2016Inventor: Arthur P. Riaf
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Patent number: 9377048Abstract: A rotary union is disclosed for use in semiconductor processing applications. The rotary is coupled between a platen base and a platen of a rotating platen assembly. The rotary union includes a coiled flexible tube member for passing a flow of cryogenic fluid to the platen for cooling during an ion implant procedure. The coiled flexible tube member has a first configuration associated with a non-rotated position of the platen and a second configuration associated with a rotated position of the platen. In the first configuration the coiled flexible tube member has a first bend radius, and in the second configuration the coiled flexible tube member has a second bend radius that is smaller than first bend radius. The rotary union also includes a base with a peripheral wall that restricts movement of the coiled flexible tube member as it cycles between the first and second configurations.Type: GrantFiled: March 13, 2013Date of Patent: June 28, 2016Assignee: Varian Semiconductor Equipment Associates, Inc.Inventor: Arthur P. Riaf
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Publication number: 20150279704Abstract: Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a platen having different regions, where the pressure levels in the regions may be substantially equal. For example, the platen may comprise a platen body comprising first and second recesses, the first recess defining a fluid region for holding fluid for maintaining a temperature of the substrate at a desired temperature, the second recess defining a first cavity for holding a ground circuit; a first via defined in the platen body, the first via having first and second openings, the first opening proximate to the fluid region and the second opening proximate to the first cavity, wherein pressure level of the fluid region may be maintained at a level that is substantially equal to pressure level of the first cavity.Type: ApplicationFiled: March 25, 2014Publication date: October 1, 2015Inventors: David E. Suuronen, Dale K. Stone, Shigeo Oshiro, Arthur P. Riaf, Edward D. MacIntosh
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Publication number: 20140270905Abstract: A rotary union is disclosed for use in semiconductor processing applications. The rotary is coupled between a platen base and a platen of a rotating platen assembly. The rotary union includes a coiled flexible tube member for passing a flow of cryogenic fluid to the platen for cooling during an ion implant procedure. The coiled flexible tube member has a first configuration associated with a non-rotated position of the platen and a second configuration associated with a rotated position of the platen. In the first configuration the coiled flexible tube member has a first bend radius, and in the second configuration the coiled flexible tube member has a second bend radius that is smaller than first bend radius. The rotary union also includes a base with a peripheral wall that restricts movement of the coiled flexible tube member as it cycles between the first and second configurations.Type: ApplicationFiled: March 13, 2013Publication date: September 18, 2014Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.Inventor: Arthur P. Riaf
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Patent number: 8681472Abstract: Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a ground pin that extends two regions of a platen that support the substrate. The ground pin may comprise a pin body; and a sleeve comprising an upper portion, a side portion, and a lower portion, the sleeve being configured to fit around the pin body, the sleeve including a fluid channel configured to transport fluid between the upper portion and the lower portion of the sleeve.Type: GrantFiled: June 18, 2009Date of Patent: March 25, 2014Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: David E. Suuronen, Dale K. Stone, Shigeo Oshiro, Arthur P. Riaf, Edward D. MacIntosh
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Patent number: 8149256Abstract: Techniques for changing temperature of a platen are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for changing temperature of a platen comprising a platen and one or more movable thermal pads comprising one or more thermal fluid channels to carry a thermal fluid configured to affect a temperature of the platen.Type: GrantFiled: June 4, 2008Date of Patent: April 3, 2012Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Roger B. Fish, Samuel M. Barsky, Scott C. Holden, Arthur P. Riaf, Steven M. Anella
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Publication number: 20090317964Abstract: Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a platen having different regions, where the pressure levels in the regions may be substantially equal. For example, the platen may comprise a platen body comprising first and second recesses, the first recess defining a fluid region for holding fluid for maintaining a temperature of the substrate at a desired temperature, the second recess defining a first cavity for holding a ground circuit; a first via defined in the platen body, the first via having first and second openings, the first opening proximate to the fluid region and the second opening proximate to the first cavity, wherein pressure level of the fluid region may be maintained at a level that is substantially equal to pressure level of the first cavity.Type: ApplicationFiled: June 18, 2009Publication date: December 24, 2009Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.Inventors: David E. SUURONEN, Dale K. Stone, Shigeo Oshiro, Arthur P. Riaf, Edward D. MacIntosh
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Publication number: 20090303306Abstract: Techniques for changing temperature of a platen are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for changing temperature of a platen comprising a platen and one or more movable thermal pads comprising one or more thermal fluid channels to carry a thermal fluid configured to affect a temperature of the platen.Type: ApplicationFiled: June 4, 2008Publication date: December 10, 2009Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.Inventors: Roger B. Fish, Samuel M. Barsky, Scott C. Holden, Arthur P. Riaf, Steven M. Anella