Patents by Inventor Ashok Prabhu

Ashok Prabhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040229405
    Abstract: A semiconductor device of the invention includes an integrated circuit formed on a semiconductor substrate having first and second surfaces and edges. The first surface includes electrical contact pads electrically connected with the integrated circuit. The first surface of the semiconductor substrate includes a top protective layer that has a surface portion extending beyond the edges of the semiconductor substrate. The surface portion of the top protective layer includes electrical contact pads that are electrically connected with electrical contact pad extensions and with the integrated circuit. The second surface of the semiconductor substrate includes a multiplicity of backside electrical connectors that are in overlapping electrical contact with corresponding electrical contact pad extensions forming lap joint electrical connections between the backside electrical connectors and the corresponding electrical contact pad extensions. Methods for constructing such devices and connections are also disclosed.
    Type: Application
    Filed: June 18, 2004
    Publication date: November 18, 2004
    Inventor: Ashok Prabhu
  • Patent number: 6791072
    Abstract: An image sensor module includes a flexible support mounted with a flexible substrate that includes optical circuitry on its surface. The substrate is formed sufficiently thin so that it can be shaped into a curved configuration. The combination of substrate and support can be mounted inside an optically transmissive housing and shaped into a variety of curved configurations that match the curved focal surface of a lens. In another approach, the support is a rigid support having a curved surface contour that substantially corresponds to a curved focal surface of a lens. The substrate is coupled with the curved surface contour of the rigid support and mounted with a lens such that the optical circuitry of the substrate obtains a curve that substantially matches that of the focal surface of the lens. Methodologies for fabricating the above modules are also disclosed.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: September 14, 2004
    Assignee: National Semiconductor Corporation
    Inventor: Ashok Prabhu
  • Patent number: 6781244
    Abstract: A semiconductor device of the invention includes an integrated circuit formed on a semiconductor substrate having first and second surfaces and edges. The first surface includes electrical contact pads electrically connected with the integrated circuit. The first surface of the semiconductor substrate includes a top protective layer that has a surface portion extending beyond the edges of the semiconductor substrate. The surface portion of the top protective layer includes electrical contact pads that are electrically connected with electrical contact pad extensions and with the integrated circuit. The second surface of the semiconductor substrate includes a multiplicity of backside electrical connectors that are in overlapping electrical contact with corresponding electrical contact pad extensions forming lap joint electrical connections between the backside electrical connectors and the corresponding electrical contact pad extensions. Methods for constructing such devices and connections are also disclosed.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: August 24, 2004
    Assignee: National Semiconductor Corporation
    Inventor: Ashok Prabhu
  • Publication number: 20030209772
    Abstract: A semiconductor device of the invention includes an integrated circuit formed on a semiconductor substrate having first and second surfaces and edges. The first surface includes electrical contact pads electrically connected with the integrated circuit. The first surface of the semiconductor substrate includes a top protective layer that has a surface portion extending beyond the edges of the semiconductor substrate. The surface portion of the top protective layer includes electrical contact pads that are electrically connected with electrical contact pad extensions and with the integrated circuit. The second surface of the semiconductor substrate includes a multiplicity of backside electrical connectors that are in overlapping electrical contact with corresponding electrical contact pad extensions forming lap joint electrical connections between the backside electrical connectors and the corresponding electrical contact pad extensions. Methods for constructing such devices and connections are also disclosed.
    Type: Application
    Filed: December 4, 2002
    Publication date: November 13, 2003
    Applicant: National Semiconductor Corporation
    Inventor: Ashok Prabhu
  • Patent number: 6607941
    Abstract: A variety of improved shell case style packages as well as shell case style wafer level packaging processes are described. Generally, in shell case style packaging, traces are patterned on the top surface of a wafer. In some embodiments, the conductors formed along the sides of the package are formed from at least a couple conductor layers to improve the adhesion of the conductors to the traces formed on the top surface of the devices. In some embodiments the conductors are patterned during processing such that the conductors are not cut during the wafer dicing operation. This arrangement is particularly useful when the conductors are formed at least partially from aluminum (or other metals that oxidize in ambient air). In other embodiments, BCB is not used under the trace layer in regions that will have notches formed therein so that the resulting package does not have any exposed BCB/trace junctions. In some embodiments, no BCB layer whatsoever is applied during packaging.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: August 19, 2003
    Assignee: National Semiconductor Corporation
    Inventors: Ashok Prabhu, Nikhil Kelkar, Anindya Poddar
  • Publication number: 20030134453
    Abstract: A variety of improved shell case style packages as well as shell case style wafer level packaging processes are described. Generally, in shell case style packaging, traces are patterned on the top surface of a wafer. In some embodiments, the conductors formed along the sides of the package are formed from at least a couple conductor layers to improve the adhesion of the conductors to the traces formed on the top surface of the devices. In some embodiments the conductors are patterned during processing such that the conductors are not cut during the wafer dicing operation. This arrangement is particularly useful when the conductors are formed at least partially from aluminum (or other metals that oxidize in ambient air). In other embodiments, BCB is not used under the trace layer in regions that will have notches formed therein so that the resulting package does not have any exposed BCB/trace junctions. In some embodiments, no BCB layer whatsoever is applied during packaging.
    Type: Application
    Filed: January 11, 2002
    Publication date: July 17, 2003
    Applicant: National Semiconductor Corporation
    Inventors: Ashok Prabhu, Nikhil Kelkar, Anindya Poddar
  • Patent number: 6384397
    Abstract: An imaging sensor module assembly adapted to be mounted to a substrate for use in electronic imaging devices. The imaging sensor includes an optical lens, and a sensor package having a sensor surface containing an optical detector portion. The sensor further includes a plurality of sensor contacts in electrical communication with the optical detector portion. A flex circuit includes a plurality of circuits terminating at respective terminals electrically coupled to a corresponding sensor contact. The module assembly further includes a lens housing assembly configured to support the optical lens, and a barrel portion adapted to fixedly couple to the sensor package. This coupling orients the lens a predetermined focal length from the sensor package such that light waves passing through the lens are focused onto the optical detector portion.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: May 7, 2002
    Assignee: National Semiconductor Corporation
    Inventors: Hem Takiar, Ashok Prabhu, Luu Nguyen
  • Patent number: 6352881
    Abstract: A method and apparatus for forming a layer of underfill adhesive on an integrated circuit located on a wafer surface are described. As a flip chip, the integrated circuit has electrically conductive pads, most of which have a solder ball attached thereto. A layer of underfill adhesive is then formed on the wafer surface such that at least some portion of most of the solder balls remain uncovered. The layer of underfill adhesive is partially cured and the flip chip is then mounted onto a substrate. A solder reflow operation electrically couples the flip chip and the substrate as well as fully cures the underfill adhesive.
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: March 5, 2002
    Assignee: National Semiconductor Corporation
    Inventors: Luu Nguyen, Nikhil Kelkar, Christopher Quentin, Ashok Prabhu, Hem P. Takiar
  • Patent number: 6238949
    Abstract: A method and an apparatus for forming a plastic chip on chip module is disclosed. The plastic chip on chip module is formed by placing a stacked chip set into a molding chamber suitably arranged to receive encapsulant. The stacked chip set includes a daughter chip that is electrically and mechanically coupled to a mother chip where the daughter chip is directly aligned to and separated from the mother chip by a standoff gap. Encapsulant is then passed into the molding chamber filling the standoff gap substantially simultaneously with surrounding the chip set to form the plastic chip on chip module.
    Type: Grant
    Filed: June 18, 1999
    Date of Patent: May 29, 2001
    Assignee: National Semiconductor Corporation
    Inventors: Luu Nguyen, Ashok Prabhu, Nikhil Kelkar, Hem P. Takiar