Abstract: An integrated circuit package comprising an active semiconductor device layer and at least one heat-transfer semiconductor layer on the active semiconductor device layer. The heat-transfer semiconductor layer has a coefficient of thermal expansion that substantially matches a coefficient of thermal expansion of the active semiconductor device layer.

Abstract: An integrated circuit package comprising an active semiconductor device layer and at least one heat-transfer semiconductor layer on the active semiconductor device layer. The heat-transfer semiconductor layer has a coefficient of thermal expansion that substantially matches a coefficient of thermal expansion of the active semiconductor device layer.

Abstract: Various apparatuses and methods for a preferentially cooled electronic device are disclosed herein. For example, some embodiments provide an electronic apparatus including a package substrate and with a semiconductor die electrically and thermally connected to the package substrate by a plurality of connection nodes. At least one thermal trace interconnects at least one subset of the plurality of connection nodes. At least one heat dissipation trace on the package substrate is connected to the at least one subset of the plurality of connection nodes.

Abstract: Various apparatuses and methods for a preferentially cooled electronic device are disclosed herein. For example, some embodiments provide an electronic apparatus including a package substrate and with a semiconductor die electrically and thermally connected to the package substrate by a plurality of connection nodes. At least one thermal trace interconnects at least one subset of the plurality of connection nodes. At least one heat dissipation trace on the package substrate is connected to the at least one subset of the plurality of connection nodes.

Abstract: A process is provided, which includes receiving geometrical information for a plurality of layers of an electronic structure within at least one output data file from an electronic structure design tool. At least one numerical analysis data file is created from the output data file, which contains the geometrical information and has a file structure compatible with a numerical analysis tool for characterizing the electronic structure. The numerical analysis tool is used to read the numerical analysis data file and generate a three-dimensional meshed geometric model of the electronic structure from the numerical analysis data file, wherein the model includes three-dimensional geometric models of each layer. The model can then be used, for example, to solve numerical thermal, mechanical or electrical equations that are applied to the model.

Abstract: A method of optimizing a bond out design includes steps of: (a) receiving as input an initial bond out design including at least one selected I/O pad and a top redistribution layer; (b) determining whether to include a lower redistribution layer in an optimized bond out design; (c) selecting a trace design to be included in the optimized bond out design for connecting the selected I/O pad to the top redistribution layer according to a bump function of the selected I/O pad; and (d) generating as output the optimized bond out design.

Abstract: A method of optimizing a bond out design includes steps of: (a) receiving as input an initial bond out design including at least one selected I/O pad and a top redistribution layer; (b) determining whether to include a lower redistribution layer in an optimized bond out design; (c) selecting a trace design to be included in the optimized bond out design for connecting the selected I/O pad to the top redistribution layer according to a bump function of the selected I/O pad; and (d) generating as output the optimized bond out design.

Abstract: A multi-level redistribution layer trace reduces current crowding in solder bumps of an integrated circuit package. A multi-level redistribution layer trace for an integrated circuit die includes a redistribution layer trace formed on the integrated circuit die in each of a plurality of electrically conductive layers and an I/O pad formed at a termination of the redistribution layer trace so that the I/O pad extends through each of the plurality of electrically conductive layers to form an electrical junction between the termination of the redistribution layer trace and the I/O pad in each of the plurality of electrically conductive layers. The redistribution layer trace may also be slotted to divide current flow horizontally at the electrical junction between the termination of the redistribution layer trace and the I/O pad in each of the plurality of electrically conductive layers.

Abstract: A multi-level redistribution layer trace reduces current crowding in solder bumps of an integrated circuit package. A multi-level redistribution layer trace for an integrated circuit die includes a redistribution layer trace formed on the integrated circuit die in each of a plurality of electrically conductive layers and an I/O pad formed at a termination of the redistribution layer trace so that the I/O pad extends through each of the plurality of electrically conductive layers to form an electrical junction between the termination of the redistribution layer trace and the I/O pad in each of the plurality of electrically conductive layers. The redistribution layer trace may also be slotted to divide current flow horizontally at the electrical junction between the termination of the redistribution layer trace and the I/O pad in each of the plurality of electrically conductive layers.

Abstract: A multi-level redistribution layer trace reduces current crowding in solder bumps of an integrated circuit package. A multi-level redistribution layer trace for an integrated circuit die includes a redistribution layer trace formed on the integrated circuit die in each of a plurality of electrically conductive layers and an I/O pad formed at a termination of the redistribution layer trace so that the I/O pad extends through each of the plurality of electrically conductive layers to form an electrical junction between the termination of the redistribution layer trace and the I/O pad in each of the plurality of electrically conductive layers. The redistribution layer trace may also be slotted to divide current flow horizontally at the electrical junction between the termination of the redistribution layer trace and the I/O pad in each of the plurality of electrically conductive layers.

Abstract: A thermally-enhanced flip chip integrated circuit (IC) package has a package substrate to which an IC die is bonded. A thermally-conductive heatspreader, having planar dimensions larger than the IC die, is thermally bonded at or near its center to an upper surface of the IC die. A plurality of cooling extensions are formed that protrude from a lower surface (the surface closest to the package substrate) of the heatspreader so as to create passageways through which cooling air may flow. In one embodiment, the cooling extensions are parallel fins that protrude transversely from the lower surface of the heatspreader, thereby forming U-shaped channels. In another embodiment, the cooling extensions are an array of fin pins that protrude transversely from the lower surface of the heatspreader.

Abstract: An electronic semiconductor device package, the package having: a substrate having a top and bottom surface and having traces; a die attached to the top surface of the substrate; first level interconnects of the die to the traces of the substrate; encapsulant which covers the die and first level interconnects; and a lid attached to the encapsulant, wherein the lid comprises at least one lid support which extends from the lid to the substrate.

Abstract: An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one hole. A system for attaching a heat dissipater to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package comprising at least one hole, wherein the stiffener is attachable to the electronic package; a heat dissipater comprising at least one pin, wherein the pin is engagable with the hole.

Abstract: A system and method are presented for forming a grid array device package around an integrated circuit (i.e., chip). The device package includes a substrate and a heat spreader. The chip includes multiple I/O pads preferably arranged in a two-dimensional array on an underside surface. The substrate includes a first set of bonding pads on an upper surface configured to vertically align with the I/O pads. The chip is connected to the first set of bonding pads using the C4 method. The substrate maintains its substantially planar shape during C4 heating. The heat spreader is thermally conductive and preferably dimensioned to substantially cover the upper surface of the substrate. An underside surface of the heat spreader includes a cavity dimensioned to receive the chip and multiple pins extending outwardly therefrom. The substrate includes multiple holes adapted to receive the pins of the heat spreader.

Abstract: An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one slot. A system for attaching a heat sink to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package which is attachable to the electronic package; a clip which secures the heat sink to the stiffener; and at least one slot in the stiffener which receives the clip. A method of detachably attaching a heat sink to an electronic semiconductor device package, the method comprising: attaching a stiffener to the package, wherein the stiffener comprises at least one slot; positioning a heat sink adjacent the stiffener; and engaging a clip with the slot and the heat sink, wherein the heat sink is secured to the stiffener by the clip.

Abstract: An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one clip. A system for attaching a heat sink to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package which is attachable to the electronic package; and at least one clip that is integral with the stiffener and secures the heat sink to the stiffener. A method of detachably attaching a heat sink to an electronic semiconductor device package, the method comprising: attaching a stiffener to the package, wherein the stiffener comprises at least one clip; positioning a heat sink adjacent the stiffener; and engaging the clip with the heat sink, wherein the heat sink is secured to the stiffener by the clip.

Abstract: According to one aspect of the invention, a semiconductor package is provided including a package substrate having an upper surface and a lower surface, wherein electrical contacts on the lower surface of the substrate are coupled to corresponding electrical contacts on a printed circuit board by a plurality of solder balls; a semiconductor die having a non-active surface and an active surface, wherein the active surface is electrically coupled to the upper surface of the package substrate by a plurality of solder bumps; and an integrated heat spreader and ring stiffener coupled with the non-active surface of the semiconductor die by a phase change material which is retained by a miniature dam ring while in a liquid state, wherein heat generated by the die is transferred to the heat spreader, and wherein the heat spreader has a protrusion formed thereon which matches the outermost size of the die.

Abstract: One aspect of the invention relates to a method for providing a semiconductor package with a thermally conductive coating, the semiconductor package including a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board, and a semiconductor die mounted to the upper surface to the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate. In one embodiment, the method includes the steps of depositing a coating on the upper surface of the package substrate and the coating includes a diamond film or diamond particles.

Abstract: An encapsulated semiconductor package assembly including a substrate, a die operatively disposed on the substrate, a lid for support by the substrate over the die, a heat sink operatively on the lid and a releasable clip which clips the heat sink releasably to the lid. With the encapsulant over the die but not yet solidified, the lid is pressed down into the encapsulant and onto the substrate. Thereby when the encapsulant is cured the lid is held in place on the substrate. The clip clips onto a lip or a slot of the lid to releasably hold a heat sink on the lid for dissipating heat from the die. The lip can be formed by an overhanging portion of the lid, and the slot can be formed in a side wall of the lid.

Abstract: A system and method are presented for forming a grid array device package around an integrated circuit (i.e., chip), the packaged device incorporating electromagnetic shielding. Embodiments of the packaged device include an integrated circuit, a substrate, and a thermally and electrically conductive heat spreader. The integrated circuit includes multiple input/output (I/O) pads on an underside surface divided into a central portion and a surrounding peripheral portion. Members of the central portion are connected to corresponding bonding pads on an upper surface of the substrate using the controlled collapse chip connection (C4) method. Members of the peripheral portion are connected to an electrical ground potential. One end of a grounding lead is attached to each member of the peripheral portion of the I/O pads such that the remaining free end extends outward from the integrated circuit. The grounding leads may be, for example, metal foil strips or wires.