Patents by Inventor Atsuko Noda

Atsuko Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230257539
    Abstract: [Problem] To provide a method for producing a polyamide resin film by using a poi amide resin obtained through polymerization of a regenerated monomer used as a recycled material. [Solution] Provided is a method for producing a polyamide resin film, including: a step of producing a monomer from a raw material (A) for depolymerization, (2) a step of producing a polyamide resin (B) through polymerization using a raw material containing the monomer, (3) a step of refining the polyamide resin (B), and (4) a step of producing an unstretched film using a starting material containing the refined polyamide resin (B), and stretching the unstretched film.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 17, 2023
    Applicant: UNITIKA LTD.
    Inventors: Akiko Kurosawa, Atsuko Noda
  • Publication number: 20230054022
    Abstract: To provide a method for producing a polyamide resin film by using a polyamide resin obtained through polymerization of a regenerated monomer used as a recycled material. Provided is a method for producing a polyamide resin film, including: (1) a step of producing a monomer from a raw material (A) for depolymerization, (2) a step of producing a polyamide resin (B) through polymerization using a raw material containing the monomer. (3) a step of refining the polyamide resin (B), and (4) a step of producing an unstretched film using a starting material containing the refined polyamide resin (B), and stretching the unstretched film.
    Type: Application
    Filed: January 22, 2021
    Publication date: February 23, 2023
    Applicant: UNITIKA LTD.
    Inventors: Akiko Kurosawa, Atsuko Noda
  • Publication number: 20220088910
    Abstract: A laminate including one or more layers of a layer consisting of a polyimide resin and a layer consisting of a polyamide resin, respectively, in which a puncture strength is 0.60 N/?m or more, and a retention rate of edge tear resistance measured at a bent portion after a bend test is 70% or more.
    Type: Application
    Filed: December 25, 2019
    Publication date: March 24, 2022
    Applicant: UNITIKA LTD.
    Inventors: Guangzhu Li, Toshihiro Ogino, Atsuko Noda
  • Publication number: 20190255809
    Abstract: A mold release sheet including a resin layer provided on a semi-aromatic polyimide resin film, wherein the resin layer contains an acid-modified polyolefin resin having a proportion of an acid-modified component of 2 to 6% by mass, and a crosslinking agent.
    Type: Application
    Filed: September 27, 2017
    Publication date: August 22, 2019
    Applicant: UNITIKA LTD.
    Inventors: Masayuki Tsubota, Atsuko Noda
  • Patent number: 9168695
    Abstract: Disclosed is a biaxially stretched polyamide resin film which is a biaxially stretched film having a layer of a polyamide resin with caproamide as a repeating unit thereof and has an amount of the caprolactam monomer extracted from the biaxially stretched polyamide resin film of 0.1% by mass or less, and also disclosed is a packaging material including the biaxially stretched polyamide resin film.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: October 27, 2015
    Assignee: UNITIKA LTD.
    Inventors: Atsuko Noda, Kiwamu Yuki, Nobuhiro Tanaka, Chiemi Nishitani, Hiroshi Sakakura
  • Patent number: 9109094
    Abstract: Disclosed is a highly adhesive polyester film having a highly adhesive primer layer disposed on at least one side of a substrate polyester film. The substrate polyester film is a stretched film having linear tearability and formed of a mixed polyester resin containing polyethylene terephthalate and a modified polybutylene terephthalate, and the highly adhesive primer layer contains a polyester resin (A) having an acid number of 20 to 60 mg KOH/g and a hydroxyl number of 30 to 150 mg KOH/g, and having an oligomer content of 2.0% by mass or less, and substantially contains no crosslinking agent component.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: August 18, 2015
    Assignee: Unitika, Ltd.
    Inventors: Atsuko Noda, Takayoshi Okuzu, Hideki Kuwata, Kiwamu Yuki
  • Patent number: 8293160
    Abstract: At an optional stage in the production step of a biaxially stretched film using a polyamide resin including, as a first component, nylon 6, and as a second component, a polyamide including xylylenediamine and an aliphatic dicarboxylic acid having 4 to 12 carbon atoms, the film is brought into contact with water set at 40° C. or higher and lower than 70° C. for 1 to 10 minutes and further with water set at 70° C. or higher for 1 to 10 minutes. In the film thus obtained, the content of low molecular weight compounds is 0% by mass to 0.2% by mass.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: October 23, 2012
    Assignee: Unitika Ltd.
    Inventors: Kiwamu Yuki, Makoto Nakai, Atsuko Noda
  • Publication number: 20120003458
    Abstract: Disclosed are a biaxially stretched polyamide resin film having gas barrier properties and a process for producing the biaxially stretched polyamide resin film having gas barrier properties. In this film, a gas barrier coat layer is formed on at least one side of a biaxially stretched polyamide resin film, the thickness of the gas barrier coat layer is 0.5 to 5 ?m, and the amount of the extracted monomer in the polyamide resin film is 0.1% by mass or less. The production process includes, in the order of description, the steps of removing the monomer in an unstretched polyamide resin film, biaxial stretching, and laminating an anchor coat layer, performed where necessary, and forming a gas barrier coat layer.
    Type: Application
    Filed: March 12, 2009
    Publication date: January 5, 2012
    Applicant: UNITIKA LTD.
    Inventors: Xiaorui Wu, Nobuhiro Tanaka, Atsuko Noda
  • Publication number: 20110081512
    Abstract: Disclosed is a highly adhesive polyester film having a highly adhesive primer layer disposed on at least one side of a substrate polyester film. The substrate polyester film is a stretched film having linear tearability and formed of a mixed polyester resin containing polyethylene terephthalate and a modified polybutylene terephthalate, and the highly adhesive primer layer contains a polyester resin (A) having an acid number of 20 to 60 mg KOH/g and a hydroxyl number of 30 to 150 mg KOH/g, and having an oligomer content of 2.0% by mass or less, and substantially contains no crosslinking agent component.
    Type: Application
    Filed: June 25, 2009
    Publication date: April 7, 2011
    Applicant: UNITIKA LTD.
    Inventors: Atsuko Noda, Takayoshi Okuzu, Hideki Kuwata, Kiwamu Yuki
  • Publication number: 20110021719
    Abstract: At an optional stage in the production step of a biaxially stretched film using a polyamide resin including, as a first component, nylon 6, and as a second component, a polyamide including xylylenediamine and an aliphatic dicarboxylic acid having 4 to 12 carbon atoms, the film is brought into contact with water set at 40° C. or higher and lower than 70° C. for 1 to 10 minutes and further with water set at 70° C. or higher for 1 to 10 minutes. In the film thus obtained, the content of low molecular weight compounds is 0% by mass to 0.2% by mass.
    Type: Application
    Filed: April 15, 2009
    Publication date: January 27, 2011
    Applicant: UNITIKA LTD.
    Inventors: Kiwamu Yuki, Makoto Nakai, Atsuko Noda
  • Publication number: 20100221554
    Abstract: Disclosed is a process for producing a polyamide resin film, wherein in a simultaneous biaxial tenter stretching method for simultaneously biaxially, longitudinally and transversely, stretching an unstretched film by gripping the widthwise edges of the unstretched film with clips, from the start of the transverse stretching until the maximum stretching magnification factor of the transverse stretching is reached, the longitudinal stretching magnification factor represented by the linear distance between the adjacent clips is prevented from being decreased by 5% or more of the maximum stretching magnification factor of the longitudinal stretching.
    Type: Application
    Filed: November 7, 2008
    Publication date: September 2, 2010
    Applicant: UNITIKA LTD.
    Inventors: Kenji Tsubouchi, Atsuko Noda, Hideki Kuwata
  • Publication number: 20100080985
    Abstract: Disclosed is a biaxially stretched polyamide resin film which is a biaxially stretched film having a layer of a polyamide resin with caproamide as a repeating unit thereof and has an amount of the caprolactam monomer extracted from the biaxially stretched polyamide resin film of 0.1% by mass or less, and also disclosed is a packaging material including the biaxially stretched polyamide resin film.
    Type: Application
    Filed: December 17, 2007
    Publication date: April 1, 2010
    Inventors: Atsuko Noda, Kiwamu Yuki, Nobuhiro Tanaka, Chiemi Nishitani, Hiroshi Sakakura
  • Patent number: 5276414
    Abstract: The improved moistureproof structure for a module circuit is characterized in that a porous film conditioned to have an apparent relative dielectric constant of no more than 2.0 is coated over a stripline a high-frequency circuit, or a high-frequency device formed on a substrate, which porous film may in turn be provided with a resin coating material. The structure insures that the module circuit is moistureproof, thereby protecting it against corrosion to improve its operational reliability without affecting its electrical characteristics.
    Type: Grant
    Filed: September 2, 1992
    Date of Patent: January 4, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takamitsu Fujimoto, Satoshi Yanaura, Atsuko Noda, Takeji Fujiwara, Hiroyuki Sato, Fumiaki Baba
  • Patent number: 5097317
    Abstract: A resin-sealed semiconductor device includes a semiconductor element mounted on a die frame, bonding wires and external wires connected to the bonding wires. The semiconductor element, the bonding wires and portions of the external leads are coated with porous silica gel impregnated with a sealing resin.
    Type: Grant
    Filed: July 13, 1990
    Date of Patent: March 17, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Takamitsu Fujimoto, Shuichi Kita, Atsuko Noda, Hiroshi Koezuka