Patents by Inventor Atsuko Noda
Atsuko Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230257539Abstract: [Problem] To provide a method for producing a polyamide resin film by using a poi amide resin obtained through polymerization of a regenerated monomer used as a recycled material. [Solution] Provided is a method for producing a polyamide resin film, including: a step of producing a monomer from a raw material (A) for depolymerization, (2) a step of producing a polyamide resin (B) through polymerization using a raw material containing the monomer, (3) a step of refining the polyamide resin (B), and (4) a step of producing an unstretched film using a starting material containing the refined polyamide resin (B), and stretching the unstretched film.Type: ApplicationFiled: April 28, 2023Publication date: August 17, 2023Applicant: UNITIKA LTD.Inventors: Akiko Kurosawa, Atsuko Noda
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Publication number: 20230054022Abstract: To provide a method for producing a polyamide resin film by using a polyamide resin obtained through polymerization of a regenerated monomer used as a recycled material. Provided is a method for producing a polyamide resin film, including: (1) a step of producing a monomer from a raw material (A) for depolymerization, (2) a step of producing a polyamide resin (B) through polymerization using a raw material containing the monomer. (3) a step of refining the polyamide resin (B), and (4) a step of producing an unstretched film using a starting material containing the refined polyamide resin (B), and stretching the unstretched film.Type: ApplicationFiled: January 22, 2021Publication date: February 23, 2023Applicant: UNITIKA LTD.Inventors: Akiko Kurosawa, Atsuko Noda
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Publication number: 20220088910Abstract: A laminate including one or more layers of a layer consisting of a polyimide resin and a layer consisting of a polyamide resin, respectively, in which a puncture strength is 0.60 N/?m or more, and a retention rate of edge tear resistance measured at a bent portion after a bend test is 70% or more.Type: ApplicationFiled: December 25, 2019Publication date: March 24, 2022Applicant: UNITIKA LTD.Inventors: Guangzhu Li, Toshihiro Ogino, Atsuko Noda
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Publication number: 20190255809Abstract: A mold release sheet including a resin layer provided on a semi-aromatic polyimide resin film, wherein the resin layer contains an acid-modified polyolefin resin having a proportion of an acid-modified component of 2 to 6% by mass, and a crosslinking agent.Type: ApplicationFiled: September 27, 2017Publication date: August 22, 2019Applicant: UNITIKA LTD.Inventors: Masayuki Tsubota, Atsuko Noda
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Patent number: 9168695Abstract: Disclosed is a biaxially stretched polyamide resin film which is a biaxially stretched film having a layer of a polyamide resin with caproamide as a repeating unit thereof and has an amount of the caprolactam monomer extracted from the biaxially stretched polyamide resin film of 0.1% by mass or less, and also disclosed is a packaging material including the biaxially stretched polyamide resin film.Type: GrantFiled: December 17, 2007Date of Patent: October 27, 2015Assignee: UNITIKA LTD.Inventors: Atsuko Noda, Kiwamu Yuki, Nobuhiro Tanaka, Chiemi Nishitani, Hiroshi Sakakura
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Patent number: 9109094Abstract: Disclosed is a highly adhesive polyester film having a highly adhesive primer layer disposed on at least one side of a substrate polyester film. The substrate polyester film is a stretched film having linear tearability and formed of a mixed polyester resin containing polyethylene terephthalate and a modified polybutylene terephthalate, and the highly adhesive primer layer contains a polyester resin (A) having an acid number of 20 to 60 mg KOH/g and a hydroxyl number of 30 to 150 mg KOH/g, and having an oligomer content of 2.0% by mass or less, and substantially contains no crosslinking agent component.Type: GrantFiled: June 25, 2009Date of Patent: August 18, 2015Assignee: Unitika, Ltd.Inventors: Atsuko Noda, Takayoshi Okuzu, Hideki Kuwata, Kiwamu Yuki
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Patent number: 8293160Abstract: At an optional stage in the production step of a biaxially stretched film using a polyamide resin including, as a first component, nylon 6, and as a second component, a polyamide including xylylenediamine and an aliphatic dicarboxylic acid having 4 to 12 carbon atoms, the film is brought into contact with water set at 40° C. or higher and lower than 70° C. for 1 to 10 minutes and further with water set at 70° C. or higher for 1 to 10 minutes. In the film thus obtained, the content of low molecular weight compounds is 0% by mass to 0.2% by mass.Type: GrantFiled: April 15, 2009Date of Patent: October 23, 2012Assignee: Unitika Ltd.Inventors: Kiwamu Yuki, Makoto Nakai, Atsuko Noda
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Publication number: 20120003458Abstract: Disclosed are a biaxially stretched polyamide resin film having gas barrier properties and a process for producing the biaxially stretched polyamide resin film having gas barrier properties. In this film, a gas barrier coat layer is formed on at least one side of a biaxially stretched polyamide resin film, the thickness of the gas barrier coat layer is 0.5 to 5 ?m, and the amount of the extracted monomer in the polyamide resin film is 0.1% by mass or less. The production process includes, in the order of description, the steps of removing the monomer in an unstretched polyamide resin film, biaxial stretching, and laminating an anchor coat layer, performed where necessary, and forming a gas barrier coat layer.Type: ApplicationFiled: March 12, 2009Publication date: January 5, 2012Applicant: UNITIKA LTD.Inventors: Xiaorui Wu, Nobuhiro Tanaka, Atsuko Noda
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Publication number: 20110081512Abstract: Disclosed is a highly adhesive polyester film having a highly adhesive primer layer disposed on at least one side of a substrate polyester film. The substrate polyester film is a stretched film having linear tearability and formed of a mixed polyester resin containing polyethylene terephthalate and a modified polybutylene terephthalate, and the highly adhesive primer layer contains a polyester resin (A) having an acid number of 20 to 60 mg KOH/g and a hydroxyl number of 30 to 150 mg KOH/g, and having an oligomer content of 2.0% by mass or less, and substantially contains no crosslinking agent component.Type: ApplicationFiled: June 25, 2009Publication date: April 7, 2011Applicant: UNITIKA LTD.Inventors: Atsuko Noda, Takayoshi Okuzu, Hideki Kuwata, Kiwamu Yuki
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Publication number: 20110021719Abstract: At an optional stage in the production step of a biaxially stretched film using a polyamide resin including, as a first component, nylon 6, and as a second component, a polyamide including xylylenediamine and an aliphatic dicarboxylic acid having 4 to 12 carbon atoms, the film is brought into contact with water set at 40° C. or higher and lower than 70° C. for 1 to 10 minutes and further with water set at 70° C. or higher for 1 to 10 minutes. In the film thus obtained, the content of low molecular weight compounds is 0% by mass to 0.2% by mass.Type: ApplicationFiled: April 15, 2009Publication date: January 27, 2011Applicant: UNITIKA LTD.Inventors: Kiwamu Yuki, Makoto Nakai, Atsuko Noda
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Publication number: 20100221554Abstract: Disclosed is a process for producing a polyamide resin film, wherein in a simultaneous biaxial tenter stretching method for simultaneously biaxially, longitudinally and transversely, stretching an unstretched film by gripping the widthwise edges of the unstretched film with clips, from the start of the transverse stretching until the maximum stretching magnification factor of the transverse stretching is reached, the longitudinal stretching magnification factor represented by the linear distance between the adjacent clips is prevented from being decreased by 5% or more of the maximum stretching magnification factor of the longitudinal stretching.Type: ApplicationFiled: November 7, 2008Publication date: September 2, 2010Applicant: UNITIKA LTD.Inventors: Kenji Tsubouchi, Atsuko Noda, Hideki Kuwata
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Publication number: 20100080985Abstract: Disclosed is a biaxially stretched polyamide resin film which is a biaxially stretched film having a layer of a polyamide resin with caproamide as a repeating unit thereof and has an amount of the caprolactam monomer extracted from the biaxially stretched polyamide resin film of 0.1% by mass or less, and also disclosed is a packaging material including the biaxially stretched polyamide resin film.Type: ApplicationFiled: December 17, 2007Publication date: April 1, 2010Inventors: Atsuko Noda, Kiwamu Yuki, Nobuhiro Tanaka, Chiemi Nishitani, Hiroshi Sakakura
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Patent number: 5276414Abstract: The improved moistureproof structure for a module circuit is characterized in that a porous film conditioned to have an apparent relative dielectric constant of no more than 2.0 is coated over a stripline a high-frequency circuit, or a high-frequency device formed on a substrate, which porous film may in turn be provided with a resin coating material. The structure insures that the module circuit is moistureproof, thereby protecting it against corrosion to improve its operational reliability without affecting its electrical characteristics.Type: GrantFiled: September 2, 1992Date of Patent: January 4, 1994Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Takamitsu Fujimoto, Satoshi Yanaura, Atsuko Noda, Takeji Fujiwara, Hiroyuki Sato, Fumiaki Baba
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Patent number: 5097317Abstract: A resin-sealed semiconductor device includes a semiconductor element mounted on a die frame, bonding wires and external wires connected to the bonding wires. The semiconductor element, the bonding wires and portions of the external leads are coated with porous silica gel impregnated with a sealing resin.Type: GrantFiled: July 13, 1990Date of Patent: March 17, 1992Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Takamitsu Fujimoto, Shuichi Kita, Atsuko Noda, Hiroshi Koezuka