Patents by Inventor Atsunori DOI

Atsunori DOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210367130
    Abstract: To provide a thermoelectric conversion module member which has a high connecting property between a thermoelectric conversion layer and a diffusion prevention layer and is also excellent in heat resistance. A thermoelectric conversion module member comprising a thermoelectric conversion layer and a diffusion prevention layer in contact with the above-described thermoelectric conversion layer, wherein the above-described thermoelectric conversion layer is a layer containing a thermoelectric conversion material having a silicon element or a tellurium element, the above-described diffusion prevention layer is a layer containing a metal and the same thermoelectric conversion material as that contained in the above-described thermoelectric conversion layer, and the amount of the above-described thermoelectric conversion material in the above-described diffusion prevention layer is 10 to 50 parts by weight with respect to 100 parts by weight of the above-described metal.
    Type: Application
    Filed: February 19, 2019
    Publication date: November 25, 2021
    Applicant: Sumitomo Chemical Company, Limited
    Inventors: Atsunori Doi, Satoshi Shimano
  • Publication number: 20210284843
    Abstract: A silicone resin composition contains a silicone resin and a solvent. The silicone resin composition is a liquid composition having a viscosity of 100 to 50000 mPa·s at 25° C. The silicone resin contains a structural unit represented by the following formula (A3), and the total content of a structural unit represented by the following formula (A1), a structural unit represented by the following formula (A1?), a structural unit represented by the following formula (A2) and the structural unit represented by the following formula (A3) contained in the silicone resin to the total content of all structural units contained in the silicone resin is 80% by mole or more, wherein R1 represents an alkyl group or an aryl group; and R2 represents an alkoxy group or a hydroxyl group.
    Type: Application
    Filed: September 4, 2017
    Publication date: September 16, 2021
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Kentaro MASUI, Atsunori DOI
  • Publication number: 20210284903
    Abstract: A wavelength conversion sheet contains a condensed silicone resin cured product, and a wavelength conversion material. The wavelength conversion sheet has a storage modulus at 25° C. of 2 GPa or more and 10 GPa or less, and a storage modulus at 150° C. of 0.1 GPa or more and 5 GPa or less. The content of the condensed silicone resin cured product is 5% by mass or more and 80% by mass or less, to the total content of the condensed silicone resin cured product and the wavelength conversion material.
    Type: Application
    Filed: September 4, 2017
    Publication date: September 16, 2021
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Kentaro MASUI, Atsunori DOI
  • Publication number: 20200262760
    Abstract: A composition including a binder and a variable thermal conductivity material satisfying a conditional expression 1, wherein a content of the variable thermal conductivity material is from 300 parts by weight to 10,000 parts by weight with respect to a content of 100 parts by weight of the binder: ?max/?25?1.2??[conditional expression 1] (wherein, ?25 represents a thermal conductivity at 25° C., and ?max represents the maximum value of a thermal conductivity at 200° C. or 500° C.
    Type: Application
    Filed: September 19, 2018
    Publication date: August 20, 2020
    Applicant: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Shimano, Atsunori Doi, Fumio Tamura
  • Publication number: 20190225879
    Abstract: A cured product includes a condensed silicone resin cured product and satisfies (1) and (2): (1) In a solid state 29Si-nuclear magnetic resonance spectrum of a condensed silicone resin cured product, there is a peak assigned to silicon atoms of a T unit (silicon atoms bonded to three oxygen atoms); and (2) In a Kratky Plot, from a wavenumber qMax of a maximum peak position in the range of wavenumbers of 0.01 to 0.17 ??1 of the X-ray, a parameter dMax obtained by formula (A) is 170 ? or less.
    Type: Application
    Filed: September 4, 2017
    Publication date: July 25, 2019
    Applicant: Sumitomo Chemical Company, Limited
    Inventors: Atsunori DOI, Toshihiko NISHIDA, Kentaro MASUI
  • Patent number: 10256378
    Abstract: An LED device is provided which includes a substrate, an LED element disposed on the substrate, an inorganic glass molded body disposed at a position where all or a part of the light which is emitted from the LED element passes through, a first bonding portion that is provided in contact with the substrate and bonds the substrate and the inorganic glass molded body, and a second bonding portion provided between the LED element and the inorganic glass molded body. The LED element is shielded from the outside air by the substrate, the inorganic glass molded body and the first bonding portion. A material which forms the second bonding portion contains a condensation polymerization-type silicone resin. A distance between the LED element and the inorganic glass molded body is 0.1 mm or less.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: April 9, 2019
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Atsunori Doi, Katsuhiko Iwasaki, Kentaro Masui
  • Publication number: 20180159000
    Abstract: An LED device is provided which includes a substrate, an LED element disposed on the substrate, an inorganic glass molded body disposed at a position where all or a part of the light which is emitted from the LED element passes through, a first bonding portion that is provided in contact with the substrate and bonds the substrate and the inorganic glass molded body, and a second bonding portion provided between the LED element and the inorganic glass molded body. The LED element is shielded from the outside air by the substrate, the inorganic glass molded body and the first bonding portion. A material which forms the second bonding portion contains a condensation polymerization-type silicone resin. A distance between the LED element and the inorganic glass molded body is 0.1 mm or less.
    Type: Application
    Filed: May 19, 2016
    Publication date: June 7, 2018
    Inventors: Atsunori DOI, Katsuhiko IWASAKI, Kentaro MASUI