Patents by Inventor Atsuo Nakajima

Atsuo Nakajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for connecting circuits and adhesive film used therefor
    Patent number: 6113728
    Abstract: An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: September 5, 2000
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto
  • Process for connecting circuits and adhesive film used therefor
    Patent number: 5843251
    Abstract: An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.
    Type: Grant
    Filed: March 20, 1992
    Date of Patent: December 1, 1998
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto
  • Process for repairing circuit connections
    Patent number: 5155906
    Abstract: Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.
    Type: Grant
    Filed: March 19, 1991
    Date of Patent: October 20, 1992
    Assignee: Hitachi Chemical, Ltd.
    Inventors: Yasushi Goto, Atsuo Nakajima, Isao Tsukagoshi, Tomohisa Ohta, Yutaka Yamaguchi
  • Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
    Patent number: 5120665
    Abstract: A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
    Type: Grant
    Filed: March 19, 1991
    Date of Patent: June 9, 1992
    Assignee: Hitachi Chemical Company
    Inventors: Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto
  • Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
    Patent number: 5001542
    Abstract: A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
    Type: Grant
    Filed: November 30, 1989
    Date of Patent: March 19, 1991
    Assignee: Hitachi Chemical Company
    Inventors: Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto
  • Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
    Patent number: 4740657
    Abstract: Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.
    Type: Grant
    Filed: February 12, 1987
    Date of Patent: April 26, 1988
    Assignee: Hitachi, Chemical Company, Ltd
    Inventors: Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yoshikatsu Mikami, Kuniteru Muto, Yoshiyuki Ikezoe