Patents by Inventor Atsushi HORITA
Atsushi HORITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955933Abstract: A high-frequency module and a communication device capable of suppressing deterioration of a noise figure of a low-noise amplifier are provided. A high-frequency module (1) includes a mounting substrate (2), a low-noise amplifier (12), an input switch (20), and a matching circuit (30). The input switch (20) is connected to an input terminal of the low-noise amplifier (12). The matching circuit (30) performs impedance matching between the input switch (20) and the low-noise amplifier (12). The matching circuit (30) is disposed on a first main surface (21) in a first direction (Dl) of the mounting substrate (2). The input switch (20) and the low-noise amplifier (12) are disposed on a second main surface (22) opposed to the first main surface (21). When the mounting substrate (2) is viewed in plan, the input switch (20) overlaps at least a part of the matching circuit (30).Type: GrantFiled: December 14, 2021Date of Patent: April 9, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Atsushi Horita
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Publication number: 20240093370Abstract: According to one aspect of the present disclosure, there is provided a substrate processing method including: forming a film containing a predetermined element on a substrate by performing a first cycle a first predetermined number of times, the first cycle including: forming a first layer containing the predetermined element by performing a second cycle a second predetermined number of times, wherein a surface of the first layer is halogen-terminated and wherein the second cycle includes: supplying a first gas containing the predetermined element and a halogen element to the substrate; and removing the first gas; and forming a second layer containing the predetermined element by supplying a second gas containing the predetermined element to the substrate.Type: ApplicationFiled: July 27, 2023Publication date: March 21, 2024Applicant: KOKUSAI ELECTRIC CORPORATIONInventors: Masahiro TAKAHASHI, Hideki HORITA, Atsushi MORIYA
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Patent number: 11483019Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.Type: GrantFiled: June 18, 2021Date of Patent: October 25, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Motoji Tsuda, Yukiya Yamaguchi, Sho Matsumoto, Hiroyuki Kani, Atsushi Horita, Morio Takeuchi, Yusuke Naniwa, Jin Yokoyama
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Patent number: 11451251Abstract: A radio frequency module includes a mounting board, a low noise amplifier, a reception filter, and an input matching circuit. The low noise amplifier is mounted on the mounting board. The reception filter is connected to the low noise amplifier. The input matching circuit is provided on a signal path between the reception filter and the low noise amplifier. The input matching circuit includes at least one inductor. The reception filter is disposed on the low noise amplifier. The at least one inductor included in the input matching circuit is adjacent to the low noise amplifier such that no other circuit element is present between the low noise amplifier and the at least one inductor.Type: GrantFiled: October 21, 2020Date of Patent: September 20, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Atsushi Horita
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Patent number: 11387853Abstract: A radio frequency module includes: a module substrate; a first circuit component disposed on a first principal surface of the module substrate; and a second circuit component stacked on the first circuit component. Here, one of the first circuit component and the second circuit component includes a reception filter, the other of the first circuit component and the second circuit component includes a switch connected between an antenna connection terminal and the reception filter, and the second circuit component is connected to the first circuit component via a via electrode in the first circuit component or a side wiring on a side surface of the first circuit component.Type: GrantFiled: November 3, 2020Date of Patent: July 12, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Atsushi Horita
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Patent number: 11381261Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).Type: GrantFiled: July 7, 2021Date of Patent: July 5, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Motoji Tsuda, Yusuke Naniwa, Morio Takeuchi, Atsushi Horita, Jin Yokoyama, Sho Matsumoto, Syunsuke Kido, Yukiya Yamaguchi, Hiroyuki Kani
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Patent number: 11316544Abstract: A front-end module includes a substrate, and a circuit that is provided in or on the substrate, wherein the circuit includes a first filter to filter a high-frequency signal, a first low noise amplifier (LNA) to amplify a signal filtered by the first filter, a first inductor disposed between the first filter and the first LNA, a second filter to filter the high-frequency signal, a second LNA to amplify a signal filtered by the second filter, and a second inductor disposed between the second filter and the second LNA, and a coil axis of the first inductor and a coil axis of the second inductor are perpendicular or substantially perpendicular to each other.Type: GrantFiled: February 26, 2021Date of Patent: April 26, 2022Assignee: Murata Manufacturing Co., Ltd.Inventor: Atsushi Horita
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Publication number: 20220109409Abstract: A high-frequency module and a communication device capable of suppressing deterioration of a noise figure of a low-noise amplifier are provided. A high-frequency module (1) includes a mounting substrate (2), a low-noise amplifier (12), an input switch (20), and a matching circuit (30). The input switch (20) is connected to an input terminal of the low-noise amplifier (12). The matching circuit (30) performs impedance matching between the input switch (20) and the low-noise amplifier (12). The matching circuit (30) is disposed on a first main surface (21) in a first direction (Dl) of the mounting substrate (2). The input switch (20) and the low-noise amplifier (12) are disposed on a second main surface (22) opposed to the first main surface (21). When the mounting substrate (2) is viewed in plan, the input switch (20) overlaps at least a part of the matching circuit (30).Type: ApplicationFiled: December 14, 2021Publication date: April 7, 2022Inventor: Atsushi HORITA
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Publication number: 20220021404Abstract: A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.Type: ApplicationFiled: June 14, 2021Publication date: January 20, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Atsushi HORITA, Yukiya YAMAGUCHI, Morio TAKEUCHI, Shigeru TSUCHIDA, Tomoaki SATO, Rui TANAKA
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Publication number: 20210336639Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).Type: ApplicationFiled: July 7, 2021Publication date: October 28, 2021Inventors: Motoji TSUDA, Yusuke NANIWA, Morio TAKEUCHI, Atsushi HORITA, Jin YOKOYAMA, Sho MATSUMOTO, Syunsuke KIDO, Yukiya YAMAGUCHI, Hiroyuki KANI
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Publication number: 20210314010Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.Type: ApplicationFiled: June 18, 2021Publication date: October 7, 2021Inventors: Motoji TSUDA, Yukiya YAMAGUCHI, Sho MATSUMOTO, Hiroyuki KANI, Atsushi HORITA, Morio TAKEUCHI, Yusuke NANIWA, Jin YOKOYAMA
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Publication number: 20210184705Abstract: A front-end module includes a substrate, and a circuit that is provided in or on the substrate, wherein the circuit includes a first filter to filter a high-frequency signal, a first low noise amplifier (LNA) to amplify a signal filtered by the first filter, a first inductor disposed between the first filter and the first LNA, a second filter to filter the high-frequency signal, a second LNA to amplify a signal filtered by the second filter, and a second inductor disposed between the second filter and the second LNA, and a coil axis of the first inductor and a coil axis of the second inductor are perpendicular or substantially perpendicular to each other.Type: ApplicationFiled: February 26, 2021Publication date: June 17, 2021Inventor: Atsushi HORITA
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Publication number: 20210152200Abstract: A radio frequency module includes: a module substrate; a first circuit component disposed on a first principal surface of the module substrate; and a second circuit component stacked on the first circuit component. Here, one of the first circuit component and the second circuit component includes a reception filter, the other of the first circuit component and the second circuit component includes a switch connected between an antenna connection terminal and the reception filter, and the second circuit component is connected to the first circuit component via a via electrode in the first circuit component or a side wiring on a side surface of the first circuit component.Type: ApplicationFiled: November 3, 2020Publication date: May 20, 2021Applicant: MURATA MANUFACTURING CO., LTD.Inventor: Atsushi HORITA
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Publication number: 20210135693Abstract: A radio frequency module includes a mounting board, a low noise amplifier, a reception filter, and an input matching circuit. The low noise amplifier is mounted on the mounting board. The reception filter is connected to the low noise amplifier. The input matching circuit is provided on a signal path between the reception filter and the low noise amplifier. The input matching circuit includes at least one inductor. The reception filter is disposed on the low noise amplifier. The at least one inductor included in the input matching circuit is adjacent to the low noise amplifier such that no other circuit element is present between the low noise amplifier and the at least one inductor.Type: ApplicationFiled: October 21, 2020Publication date: May 6, 2021Applicant: Murata Manufacturing Co., Ltd.Inventor: Atsushi HORITA
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Patent number: 10965326Abstract: A front-end module includes a substrate, and a receiving circuit that is provided in or on the substrate and in which CA is executed. The receiving circuit includes a first filter, a first inductor, and a first LNA disposed on a first path, and a second filter, a second inductor, and a second LNA disposed on a second path. A coil axis of the first inductor and a coil axis of the second inductor are different from each other.Type: GrantFiled: January 2, 2020Date of Patent: March 30, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Atsushi Horita
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Patent number: 10819310Abstract: A filter (11) includes a series-arm circuit (10) connected between an input/output terminal (11m) and an input/output terminal (11n); and a parallel-arm circuit (20) connected between a ground and a path that connects the input/output terminal (11m) and the input/output terminal (11n). One circuit among the series-arm circuit (10) and the parallel-arm circuit (20) is constituted by a parallel-arm resonator (p1) and a parallel-arm resonator (p2) that are connected in parallel to each other and that are connected to a node (x1) on the path. The parallel-arm resonators (p1) and (p2) form a pass band, together with another circuit among the series-arm circuit (10) and the parallel-arm circuit (20). The parallel-arm resonator (p2) has a resonant frequency lower than a resonant frequency of the parallel-arm resonator (p1) and has an impedance higher than an impedance of the parallel-arm resonator (p1).Type: GrantFiled: January 18, 2019Date of Patent: October 27, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Atsushi Horita, Koji Nosaka
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Patent number: 10715110Abstract: An acoustic wave filter device includes a first resonant circuit, a second resonant circuit, a first interconnect line, and a second interconnect line. The second resonant circuit includes a second parallel-arm resonator, and a frequency-tuning circuit that allows tuning of the resonant frequency of the second parallel-arm resonator. The frequency-tuning circuit includes a capacitor, and a switching element connected in parallel with the capacitor. The first interconnect line is an interconnect line connected to the portion of the series-arm resonator located adjacent to the first input/output terminal. The second interconnect line is an interconnect line connecting the parallel-arm resonator with the switching element, or an interconnect line connecting the parallel-arm resonator with the capacitor. A first transmission line formed by the first interconnect line, and a second transmission line formed by the second interconnect line are magnetically coupled with each other.Type: GrantFiled: March 15, 2019Date of Patent: July 14, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Atsushi Horita, Koji Nosaka
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Publication number: 20200145028Abstract: A front-end module includes a substrate, and a receiving circuit that is provided in or on the substrate and in which CA is executed. The receiving circuit includes a first filter, a first inductor, and a first LNA disposed on a first path, and a second filter, a second inductor, and a second LNA disposed on a second path. A coil axis of the first inductor and a coil axis of the second inductor are different from each other.Type: ApplicationFiled: January 2, 2020Publication date: May 7, 2020Inventor: Atsushi HORITA
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Patent number: 10560131Abstract: A front-end module includes a substrate, and a receiving circuit that is provided in or on the substrate and in which CA is executed. The receiving circuit includes a first filter, a first inductor, and a first LNA disposed on a first path, and a second filter, a second inductor, and a second LNA disposed on a second path. A coil axis of the first inductor and a coil axis of the second inductor are different from each other.Type: GrantFiled: April 9, 2019Date of Patent: February 11, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Atsushi Horita
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Patent number: 10547337Abstract: A radio frequency front-end circuit performs, in a communication band made up of a plurality of communication channels within a particular frequency band used in a system, wireless communication through a use channel selected from among empty communication channels in the plurality of communication channels, the radio frequency front-end circuit including a transmission-side amplifier circuit and a transmission circuit both serving as a transmission-side circuit that produces, from a transmitted signal after being subjected to a predistortion process, a transmitted signal corresponding to the use channel, and a frequency variable filter serving as a tunable filter that attenuates a radio frequency signal of a spurious wave at least in an alternate adjacent channel relative to the use channel.Type: GrantFiled: July 25, 2018Date of Patent: January 28, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Atsushi Horita, Hirotsugu Mori