Abstract: A shift device, including: a shift body that is operated to change a shift position thereof; a biasing section that causes biasing force to act on the shift body; a retention track that, by placement of the biasing section thereon, causes the shift body to be retained at a shift position; a release track that, by movement of the biasing section thereon from the retention track, causes retention of the shift body at a shift position to be released; and a changer section that, after the biasing section has been moved from the retention track to the release track and moved along the release track, causes the biasing section to be moved from the release track onto the retention track and a shift position of the shift body to be changed by moving the biasing section at a specific occasion.

Abstract: In a plane including the center line of a vertical through hole, it is assumed that a segment that connects a first point corresponding to the edge of an opening of an insulating layer and a second point corresponding to the edge of a second opening is a first segment, a segment that connects the second point and a third point corresponding to an intersection point between the second opening and a surface of the insulating layer is a second segment, and a segment that connects the third point and the first point is a third segment. In the insulating layer, the first area located on one side with respect to the first segment is larger than the sum of the second area surrounded by the first, the second and the third segments and the third area located on the other side with respect to the third segment.

Abstract: A work vehicle includes a work implement, a valve adjusting a flow rate of a hydraulic oil operating the work implement, an electromagnetic proportional control valve generating a pilot pressure guided to the valve, a controller outputting a current to the electromagnetic proportional control valve, and a sensor for detecting an operation of the work implement. The controller increases stepwise a current value of a current output to the electromagnetic proportional control valve by repeating processing for temporarily lowering a current value of the current output to the electromagnetic proportional control valve and thereafter outputting to the electromagnetic proportional control valve, a current having a current value greater than the current value before lowering. The controller calibrates data for predicting an operation speed of the work implement based on a result of detection by the sensor at the time when the current value is increased stepwise.

Abstract: In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof, and plating layers on the conductive resin layers and the exposed portions of the base electrode layers. The exposed portions of the base electrode layers are in direct contact with the plating layers at least at one corner on the one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof.

Abstract: A shift device is configured including a restriction member and a release section. The restriction member stops a detent pin that has been moved at a release position, restricting movement of a shift lever to a third shift position when the shift lever is moved from a first shift position to a second shift position. When the shift lever has been moved at the second shift position, by the detent pin being moved to the release position from a non-release position, the release section releases the restriction of movement of the shift lever toward the third shift position by the restriction member.

Abstract: In a plane including the center line of a vertical through hole, it is assumed that a segment that connects a first point corresponding to the edge of an opening of an insulating layer and a second point corresponding to the edge of a second opening is a first segment, a segment that connects the second point and a third point corresponding to an intersection point between the second opening and a surface of the insulating layer is a second segment, and a segment that connects the third point and the first point is a third segment. In the insulating layer, the first area located on one side with respect to the first segment is larger than the sum of the second area surrounded by the first, the second and the third segments and the third area located on the other side with respect to the third segment.

Abstract: In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof, and plating layers on the conductive resin layers and the exposed portions of the base electrode layers. The exposed portions of the base electrode layers are in direct contact with the plating layers at least at one corner on the one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof.

Abstract: A shift device, including: a shift body that is operated to change a shift position thereof; a biasing section that causes biasing force to act on the shift body; a retention track that, by placement of the biasing section thereon, causes the shift body to be retained at a shift position; a release track that, by movement of the biasing section thereon from the retention track, causes retention of the shift body at a shift position to be released; and a changer section that, after the biasing section has been moved from the retention track to the release track and moved along the release track, causes the biasing section to be moved from the release track onto the retention track and a shift position of the shift body to be changed by moving the biasing section at a specific occasion.

Abstract: In a multilayer ceramic capacitor including outer electrodes electrically connected to inner electrodes of a ceramic body, a thickness of each of end portions of extension portions of the inner electrodes in a width direction is larger than a thickness of a corresponding one of middle regions in the width direction, and a distance from a first main surface of the ceramic body to a first auxiliary electrode closest to the first main surface is different from a distance from a second main surface of the ceramic body to a second auxiliary electrode closest to the second main surface in a stacking direction. Each of the first auxiliary electrode and the second auxiliary electrode has a continuity in the width direction of about 60% or more.

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract: A shift device is configured including a restriction member and a release section. The restriction member stops a detent pin that has been moved at a release position, restricting movement of a shift lever to a third shift position when the shift lever is moved from a first shift position to a second shift position. When the shift lever has been moved at the second shift position, by the detent pin being moved to the release position from a non-release position, the release section releases the restriction of movement of the shift lever toward the third shift position by the restriction member.

Abstract: In a laminated ceramic electronic component, a first functional portion and a second functional portion are disposed within a ceramic element body so as to be adjacent to each other along a height direction, first and second internal electrodes face each other through a ceramic layer in the first functional portion, and third and fourth internal electrodes whose number of laminated layers is different from the number of laminated layers of the first and second internal electrodes face each other through the ceramic layer in the second functional portion. A marking internal conductor is disposed on the same plane as the first internal electrode and/or the second internal electrode, a marking external conductor is disposed on the side surface of the ceramic element body so as to link a plurality of exposed marking internal conductors such that it is possible to recognize vertical directionality.

Abstract: A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.

Abstract: The locking device is for arrangement in the connector receptacle, which is connected to the charging connector that charges a battery, to interlock the connector receptacle and the charging connector. The locking device includes a notch engageable with a hook arranged in the charging connector. A lock bar is movable between a lock position, at which the lock bar restricts movement of the hook and keeps the hook and lock bar engaged, and an unlock position, at which the lock bar moves away from the hook and permits movement of the hook. A drive unit generates drive force for moving the lock bar from the unlock position to the lock position.

Abstract: A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes.

Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

Abstract: A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.

Abstract: A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.

Abstract: A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.

Abstract: A multilayer printed wiring board has a core substrate including first insulation layers, first conductive patterns formed on the first insulation layers, and first via conductors formed through the first insulation layers and connecting the first conductive patterns, and a buildup layer formed on the core substrate and including second insulation layers, second conductive patterns formed on the second insulation layers, and second via conductors formed through the second insulation layers and connecting the second conductive patterns. Each of the first insulation layers includes an inorganic reinforcing fiber material, each of the second insulation layers does not include an inorganic reinforcing fiber material, and the core substrate includes an inductor having the first conductive patterns and the first via conductors.