Abstract: A power storage cell includes a cell case and an electrode assembly. The cell case houses the electrode assembly. The cell case includes a top wall, a peripheral wall, and a bottom wall. The top wall faces the bottom wall. The peripheral wall connects the top wall and the bottom wall. The top wall is provided with an electrode terminal. A current path that electrically connects the electrode terminal and the electrode assembly is formed in the cell case. The current path includes a fuse portion. The power storage cell further includes at least one of a thermal expansion member and a thermal contraction member. The thermal expansion member is disposed between the top wall and the electrode assembly. The thermal contraction member is disposed between the electrode assembly and at least one of the peripheral wall and the bottom wall. The thermal contraction member supports the electrode assembly.

Abstract: A power storage cell includes a cell case, a wound electrode assembly, and an electrolyte solution. The cell case houses the wound electrode assembly and the electrolyte solution. The wound electrode assembly includes a positive electrode sheet, a separator sheet, and a negative electrode sheet. In a winding axis direction, the wound electrode assembly has a first end portion and a second end portion. The first end portion faces a top wall. The second end portion is located opposite to the first end portion. At both the first end portion and the second end portion, the separator sheet extends outward with respect to the negative electrode sheet. At the first end portion, the separator sheet has a first protruding length. At the second end portion, the separator sheet has a second protruding length. The first protruding length is longer than the second protruding length.

Abstract: The protective film 10 is used by being attached to a resin substrate 21 in a case of performing heat bending on the resin substrate while heating the resin substrate. The protective film includes a base material layer and a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate, and is adhered to the resin substrate. The base material layer is composed of a laminate including a first layer which is positioned on a side opposite to the pressure sensitive adhesive layer and a second layer which is positioned on a side of the pressure sensitive adhesive layer. The protective film has a trouser elongation strain at break of 300% or less in a direction inclined at 45° to both MD and TD of the protective film, which is measured in accordance with JIS K 7128-1 (1998).

Abstract: A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

Abstract: Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

Abstract: The present invention makes a proposal of a heating component for a pipe joint which can be easily mounted on a pipe joint and also can stabilize the assembly quality to the pipe joint. The heating component for a pipe joint is characterized in that the heating component for a pipe joint has partially thereon fitting portions each having an inner face shape fitted with a part of an outer shape of the pipe joint, and also, a holding recess portion for holding therein a heating wire is formed on an inner face portion other than the fitting portions; when the heating wire is held in the holding recess portion, and then, the heating component for piping joint is mounted to the joint by fitting the fitting portions with the parts of the outer shape of the joint, the heating wire held in the holding recess portion comes in contact with the pipe joint.

Abstract: A resin composition is provided comprising a compound having a structure represented by formula (1) and a crosslinking agent: wherein in formula (1), R0 is a single bond or has a structure represented by formula (2); R1 to R8 are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond, —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R9 is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R1 to R8 is the group having an alicyclic structure when R0 is a single bond; at least one of R1 to R9 is the group having an alicyclic structure when R0 has the structure represented by formula (2); and “*”

Abstract: A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—.

Abstract: There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer. X-V?W?nY??(1) (In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater).

Abstract: Disclosed is a resin composition comprising a benzoxazole resin precursor having a first repeating unit obtained by reacting a bisaminophenol compound and a dicarboxylic acid compound, and a cross-linking agent wherein at least one of the bisaminophenol compound and the dicarboxylic acid compound has a diamondoid structure. The benzoxazole resin precursor further comprises a second repeating unit obtained by reacting a bisaminophenol compound not having a diamondoid structure and a dicarboxylic acid compound not having a diamondoid structure. Also disclosed is a resin film comprising the resin composition.

Abstract: A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same.

Abstract: A physiologically active polypeptide derived from human brain and a DNA fragment comprising the base sequence encoding the polypeptide are disclosed. The polypeptide possesses excellent smooth muscle relaxation activity, diuretic or natriuretic activity, and vasodepressor activity, and is thus useful as a medicine for curing circulation diseases, e.g. cardiac edema, nephric edema, hepatic edema, pulmonary edema, hypertension, congestive heart failure, and acute and chronic renal failure.

Abstract: Noble crystal of 4-dimethylamino-4-stilbazolium tosylate (DAST) useful as an electro-optical element. A DAST crystal having a size effective for use as an electro-optical element is provided by a twin crystal of DAST. The twin crystal of DAST can be obtained according to a seed crystallization method or a slope crystal growing method.

Abstract: A resin composition having high heat resistance and low dielectric constant after heat treatment, a varnish thereof and a semiconductor device using the same are provided by a resin composition including a compound having a structure represented by the general formula (1): wherein, “Ar” is an aromatic group; “a” is 0 or 1; R11 is an organic group having one or more carbon atoms and at least one is a group having an alicyclic structure; when “q” is an integer of 2 or more, R11s may be the same or different from each other; at least one of R1 to R5 and at least one of R6 to R10 on respective benzene rings are Ar-binding sites or R11-binding sites and the others of R1 to R5 and R6 to R10 are each hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms, a hydroxyl group or a carboxyl group; when “a” is 0, at least one of R1 to R5 and R6 to R10 is a group having an alicyclic structure; “q” is an integer of 1 or more; and “X” is any of —O—, —NHCO—, —COHN—, —COO— and —OCO—

Abstract: A benzoxazole resin precursor comprising a first repeating unit which is obtained by the reaction of a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has the diamondoid structure; a benzoxazole resin precursor further comprising a second repeating unit which is obtained by the reaction of a bisaminophenol compound having no diamondoid structure and a dicarboxylic acid compound having no diamondoid structure; a polybenzoxazole resin obtained by the ring-closing reaction with dehydration of the above benzoxazole resin precursor; a resin film constituted with the benzoxazole resin precursor or the polybenzoxazole resin. A polybenzoxazole resin and a resin film having excellent heat resistance and a small permittivity and a semiconductor device using the resin film can be obtained from the benzoxazole resin precursor.

Abstract: A heater-attached piping having, a cord-like heater disposed along substantially entire length of a nylon tube forming a pipe for transferring a fluid, and at least a heat-retaining layer disposed around the nylon tube and the cord-like heater. The cord-like heater located at the end of the nylon tube may be, for example, folded back and formed in a duplex arrangement. With this arrangement, heat generating at the end of the heater-attached piping increases and is duplicated to result in suppression of power consumption of the cord-like heater to a possible lowest limit, and the heat-retaining ability and defrosting ability in the end of the heater-attached piping can be enhanced.

Abstract: The present invention makes a proposal of a heating component for a pipe joint which can be easily mounted on a pipe joint and also can stabilize the assembly quality to the pipe joint. The heating component for a pipe joint is characterized in that the heating component for a pipe joint has partially thereon fitting portions each having an inner face shape fitted with a part of an outer shape of the pipe joint, and also, a holding recess portion for holding therein a heating wire is formed on an inner face portion other than the fitting portions; when the heating wire is held in the holding recess portion, and then, the heating component for piping joint is mounted to the joint by fitting the fitting portions with the parts of the outer shape of the joint, the heating wire held in the holding recess portion comes in contact with the pipe joint.

Abstract: A physiologically active polypeptide derived from human brain and a DNA fragment comprising the base sequence encoding the polypeptide are disclosed. The polypeptide possesses excellent smooth muscle relaxation activity, diuretic or natriuretic activity, and vasodepressor activity, and is thus useful as a medicine for curing circulation diseases, e.g. cardiac edema, nephric edema, hepatic edema, pulmonary edema, hypertension, congestive heat failure, and acute and chronic renal failure.

Abstract: Noble crystal of 4-dimethylamino-4-stilbazolium tosylate (DAST) useful as an electro-optical element. A DAST crystal having a size effective for use as an electro-optical element is provided by a twin crystal of DAST. The twin crystal of DAST can be obtained according to a seed crystallization method or a slope crystal growing method.

Abstract: A pure-water pipe for fuel cell has an innermost layer made of fluoro resin or polyolefin resin wherein an entire body of the pipe is made of resin and the pipe has a value of (a total thickness of the pipe)/(a thickness of the innermost layer) in a range of 1.1 to 40. The pure-water pipe further has a layer in the outside of the innermost layer which contains one of polyamide, polyester elastomer and polyolefin elastomer or a layer in the outside of the innermost layer which contains non-plastic polyamide. The pure-water pipe further has a low hydrogen-permeable layer in the outside of the innermost layer. The low hydrogen-permeable layer contains ethylene-vinyl alcohol copolymer, polymethaxyleneadipamide, or polybutylene naphthalate.