Patents by Inventor Atsushi Masunaga

Atsushi Masunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230024800
    Abstract: The present invention addresses the problem of providing a polyaryletherketone resin composition having excellent toughness and fluidity, a fiber-reinforced resin base material having excellent impregnating ability and toughness, and a molded article thereof. In order to solve said problem, the present invention has the following compositional make-up. A polyaryletherketone resin composition containing, with respect to (A) 100 parts by mass of a polyaryletherketone, (B) 1-100 parts by mass of a liquid crystalline polyester, wherein the polyaryletherketone resin composition forms a sea-island structure, and the average diameter of the island phases is 10-1000 nm.
    Type: Application
    Filed: February 5, 2021
    Publication date: January 26, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Atsushi MASUNAGA, Hidenobu TAKAO, Kenji ISHITAKE, Nobuyuki TOMIOKA
  • Publication number: 20220389161
    Abstract: The objective of the present invention is to provide a polyarylketone resin composition, a fiber-reinforced resin base material, and formed products therefrom having excellent thermal stability and mechanical properties. In order to achieve the above objective, the present invention has the following constitution. That is, the polyaryletherketone resin composition comprises (A) a polyaryletherketone and (B) a transition metal compound, wherein the transition metal content is between 0.001 parts by mass and 4 parts by mass inclusive with respect to 100 parts by mass of (A) the polyaryletherketone.
    Type: Application
    Filed: September 11, 2020
    Publication date: December 8, 2022
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Atsushi MASUNAGA, Kenji ISHITAKE, Nobuyuki TOMIOKA
  • Publication number: 20220275167
    Abstract: The purpose of the present invention is to provide a thermoplastic resin composition having exceptional thermal stability and mechanical characteristics, a fiber-reinforced resin substrate, and a molded article obtained therefrom. In order to achieve the abovementioned purpose, an embodiment of the present invention has the structure described below. Specifically, a thermoplastic resin composition including a thermoplastic resin (A) having an electron-donating group, and a transition metal compound (B), wherein the transition metal compound (B) includes a nickel compound (B1) and a copper compound (B2), the complete decomposition temperature of the copper compound (B2) is 400° C. or higher, and the copper compound (B2) has a nickel content of 0.001-4 parts by mass (inclusive) and a copper content of 0.001-4 parts by mass (inclusive) with respect to 100 parts by mass of the thermoplastic resin (A) having an electron-donating group.
    Type: Application
    Filed: September 11, 2020
    Publication date: September 1, 2022
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Atsushi MASUNAGA, Shinya HAYASHI, Kenji ISHITAKE, Nobuyuki TOMIOKA
  • Publication number: 20210292491
    Abstract: A fiber reinforced resin base material is formed by impregnating a continuous reinforcing fiber(s) or a reinforcing fiber material having a discontinuous fiber(s) dispersed therein with a resin composition which exhibits a single glass-transition temperature before and after being heated at 400° C. for one hour, wherein the resin composition is composed of (A) a thermoplastic resin having a glass-transition temperature of 100° C. or more and (B) a thermoplastic resin having a glass-transition temperature of less than 100° C. The fiber reinforced resin base material has excellent impregnation properties and thermal stability, having fewer voids, and having surface quality and high heat resistance.
    Type: Application
    Filed: July 1, 2019
    Publication date: September 23, 2021
    Inventors: Naoya Ouchiyama, Masayuki Koshi, Yoshihiro Naruse, Atsushi Masunaga, Kenichi Utazaki
  • Publication number: 20180312692
    Abstract: A molded product made from a resin composition includes a polyamide resin and has a thickness of not less than 0.56 mm. A difference (Q?P) between Q and P is less than 0.06, where P (A1680/A1632) denotes an intensity ratio of a maximum value of absorbance A1680 at 1680 cm?1±8 cm?1 to a maximum value of absorbance A1632 at 1632 cm?1±8 cm?1 with an absorbance at 1800 cm?1 being set to 0 with regard to an infrared absorption spectrum of a cutting surface at a depth of 0.28 mm from a surface of the molded product, and Q (A?1680/A?1632) denotes an intensity ratio of a maximum value of absorbance A?1680 at 1680 cm?1±8 cm?1 to a maximum value of absorbance A?1632 at 1632 cm?1±8 cm?1 with an absorbance at 1800 cm?1 being set to 0.
    Type: Application
    Filed: July 6, 2016
    Publication date: November 1, 2018
    Applicant: Toray Industries, Inc.
    Inventors: Kenichi Okunaga, Atsushi Masunaga, Shingo Nishida, Masaru Akita, Hideyuki Umetsu
  • Patent number: 9873793
    Abstract: A polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130° C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.2 mm after the heat treatment is lower than 70%.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: January 23, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Atsushi Masunaga, Hideyuki Umetsu
  • Patent number: 9732190
    Abstract: There is provided a production method of a crystalline polyamide resin by thermal polycondensation of a mixture including at least a diamine component, a dicarboxylic acid component and water as a starting material, wherein the diamine component includes (A) pentamethylene diamine at a ratio that is equal to or greater than 10 mol % and less than 80 mol % relative to a gross amount of the diamine component; and the dicarboxylic acid component includes (B) at least one selected from the group consisting of an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid and dialkyl ester derivatives thereof at a ratio that is equal to or greater than 76 mol % and equal to or less than 100 mol % relative to a gross amount of the dicarboxylic acid component.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: August 15, 2017
    Assignee: TORAY INDUSTRIES INC.
    Inventors: Koya Kato, Atsushi Masunaga, Eri Hatano, Hideo Matsuoka
  • Patent number: 9493611
    Abstract: A polyamide resin composition includes 100 parts by weight of a (a) polyamide resin; and 0.1 to 10 parts by weight of a (b) hydroxyl group- and carboxyl group-containing compound, wherein the (b) hydroxyl group- and carboxyl group-containing compound has a ratio (COOH/OH) of 0.01 to 5.0 of a rate (percentage) of a carboxyl group-derived peak area to a total peak area in a 13C-NMR spectrum to a rate (percentage) of a hydroxyl group-derived peak area to a total peak area in a 1H-NMR spectrum and has a degree of branching of 0.05 to 0.35.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: November 15, 2016
    Assignee: Toray Industries, Inc.
    Inventors: Atsushi Masunaga, Hiroshi Nakagawa, Hideyuki Umetsu
  • Publication number: 20160264778
    Abstract: A polyamide resin composition has excellent heat aging resistance, surface appearance, retention stability, dimensional accuracy, chemical resistance and the like. One polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130° C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.
    Type: Application
    Filed: August 28, 2014
    Publication date: September 15, 2016
    Inventors: Atsushi Masunaga, Hideyuki Umetsu
  • Publication number: 20150232617
    Abstract: A polyamide resin composition includes 100 parts by weight of a (a) polyamide resin; and 0.1 to 10 parts by weight of a (b) hydroxyl group- and carboxyl group-containing compound, wherein the (b) hydroxyl group- and carboxyl group-containing compound has a ratio (COOH/OH) of 0.01 to 5.0 of a rate (percentage) of a carboxyl group-derived peak area to a total peak area in a 13C-NMR spectrum to a rate (percentage) of a hydroxyl group-derived peak area to a total peak area in a 1H-NMR spectrum and has a degree of branching of 0.05 to 0.35.
    Type: Application
    Filed: September 12, 2013
    Publication date: August 20, 2015
    Applicant: Toray Industries, Inc.
    Inventors: Atsushi Masunaga, Hiroshi Nakagawa, Hideyuki Umetsu
  • Publication number: 20140194570
    Abstract: There is provided a production method of a crystalline polyamide resin by thermal polycondensation of a mixture including at least a diamine component, a dicarboxylic acid component and water as a starting material, wherein the diamine component includes (A) pentamethylene diamine at a ratio that is equal to or greater than 10 mol % and less than 80 mol % relative to a gross amount of the diamine component; and the dicarboxylic acid component includes (B) at least one selected from the group consisting of an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid and dialkyl ester derivatives thereof at a ratio that is equal to or greater than 76 mol % and equal to or less than 100 mol % relative to a gross amount of the dicarboxylic acid component, the production method comprising: a first step that heats the above mixture, which has a water content equal to or less than 30% by weight, at a temperature equal to or higher than 200° C. under a pressure of 1.8 to 3.
    Type: Application
    Filed: August 13, 2012
    Publication date: July 10, 2014
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Koya Kato, Atsushi Masunaga, Eri Hatano, Hideo Matsuoka
  • Patent number: 8674055
    Abstract: A method for producing a polyamide resin characterized by comprising thermally polycondension of tetramethylene diamine and either an aliphatic dicarboxylic acid having 7 or more carbon atoms or a salt thereof, and then being melt-polymerized at a temperature equal to or higher than the melting point thereof until the relative viscosity of a 0.01 g/ml solution thereof in 98% sulfuric acid solution with a 0.01 g/ml content at 25° C. becomes 2.2-5.0.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: March 18, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Koya Kato, Atsushi Masunaga, Hideo Matsuoka
  • Publication number: 20120016077
    Abstract: A polyamide resin obtained by heating and condensation-polymerizing ingredients mainly comprising pentamethylenediamine having a total content of 2,3,4,5-tetrahydropyridine and piperidine of 0.10 wt. % or lower and an aliphatic dicarboxylic acid having 7 or more carbon atoms, a 0.01 g/mL solution of the polyamide resin in 98% sulfuric acid having a relative viscosity at 25° C. of 1.8-4.5. The polyamide resin has excellent heat resistance, extremely low water absorption, and excellent melt residence stability and is hence suitable for use as long molded articles represented by automotive radiator tanks, etc.
    Type: Application
    Filed: March 25, 2010
    Publication date: January 19, 2012
    Applicant: TORAY INDUSTRIES INC.
    Inventors: Koya Kato, Atsushi Masunaga, Hideo Matsuoka
  • Publication number: 20110301290
    Abstract: A method for producing a polyamide resin characterized by comprising thermally polycondension of tetramethylene diamine and either an aliphatic dicarboxylic acid having 7 or more carbon atoms or a salt thereof, and then being melt-polymerized at a temperature equal to or higher than the melting point thereof until the relative viscosity of a 0.01 g/ml solution thereof in 98% sulfuric acid solution with a 0.01 g/ml content at 25° C. becomes 2.2-5.0.
    Type: Application
    Filed: February 24, 2010
    Publication date: December 8, 2011
    Inventors: Koya Kato, Atsushi Masunaga, Hideo Matsuoka