Patents by Inventor Atsushi Masunaga
Atsushi Masunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230024800Abstract: The present invention addresses the problem of providing a polyaryletherketone resin composition having excellent toughness and fluidity, a fiber-reinforced resin base material having excellent impregnating ability and toughness, and a molded article thereof. In order to solve said problem, the present invention has the following compositional make-up. A polyaryletherketone resin composition containing, with respect to (A) 100 parts by mass of a polyaryletherketone, (B) 1-100 parts by mass of a liquid crystalline polyester, wherein the polyaryletherketone resin composition forms a sea-island structure, and the average diameter of the island phases is 10-1000 nm.Type: ApplicationFiled: February 5, 2021Publication date: January 26, 2023Applicant: TORAY INDUSTRIES, INC.Inventors: Atsushi MASUNAGA, Hidenobu TAKAO, Kenji ISHITAKE, Nobuyuki TOMIOKA
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Publication number: 20220389161Abstract: The objective of the present invention is to provide a polyarylketone resin composition, a fiber-reinforced resin base material, and formed products therefrom having excellent thermal stability and mechanical properties. In order to achieve the above objective, the present invention has the following constitution. That is, the polyaryletherketone resin composition comprises (A) a polyaryletherketone and (B) a transition metal compound, wherein the transition metal content is between 0.001 parts by mass and 4 parts by mass inclusive with respect to 100 parts by mass of (A) the polyaryletherketone.Type: ApplicationFiled: September 11, 2020Publication date: December 8, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Atsushi MASUNAGA, Kenji ISHITAKE, Nobuyuki TOMIOKA
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Publication number: 20220275167Abstract: The purpose of the present invention is to provide a thermoplastic resin composition having exceptional thermal stability and mechanical characteristics, a fiber-reinforced resin substrate, and a molded article obtained therefrom. In order to achieve the abovementioned purpose, an embodiment of the present invention has the structure described below. Specifically, a thermoplastic resin composition including a thermoplastic resin (A) having an electron-donating group, and a transition metal compound (B), wherein the transition metal compound (B) includes a nickel compound (B1) and a copper compound (B2), the complete decomposition temperature of the copper compound (B2) is 400° C. or higher, and the copper compound (B2) has a nickel content of 0.001-4 parts by mass (inclusive) and a copper content of 0.001-4 parts by mass (inclusive) with respect to 100 parts by mass of the thermoplastic resin (A) having an electron-donating group.Type: ApplicationFiled: September 11, 2020Publication date: September 1, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Atsushi MASUNAGA, Shinya HAYASHI, Kenji ISHITAKE, Nobuyuki TOMIOKA
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Publication number: 20210292491Abstract: A fiber reinforced resin base material is formed by impregnating a continuous reinforcing fiber(s) or a reinforcing fiber material having a discontinuous fiber(s) dispersed therein with a resin composition which exhibits a single glass-transition temperature before and after being heated at 400° C. for one hour, wherein the resin composition is composed of (A) a thermoplastic resin having a glass-transition temperature of 100° C. or more and (B) a thermoplastic resin having a glass-transition temperature of less than 100° C. The fiber reinforced resin base material has excellent impregnation properties and thermal stability, having fewer voids, and having surface quality and high heat resistance.Type: ApplicationFiled: July 1, 2019Publication date: September 23, 2021Inventors: Naoya Ouchiyama, Masayuki Koshi, Yoshihiro Naruse, Atsushi Masunaga, Kenichi Utazaki
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Publication number: 20180312692Abstract: A molded product made from a resin composition includes a polyamide resin and has a thickness of not less than 0.56 mm. A difference (Q?P) between Q and P is less than 0.06, where P (A1680/A1632) denotes an intensity ratio of a maximum value of absorbance A1680 at 1680 cm?1±8 cm?1 to a maximum value of absorbance A1632 at 1632 cm?1±8 cm?1 with an absorbance at 1800 cm?1 being set to 0 with regard to an infrared absorption spectrum of a cutting surface at a depth of 0.28 mm from a surface of the molded product, and Q (A?1680/A?1632) denotes an intensity ratio of a maximum value of absorbance A?1680 at 1680 cm?1±8 cm?1 to a maximum value of absorbance A?1632 at 1632 cm?1±8 cm?1 with an absorbance at 1800 cm?1 being set to 0.Type: ApplicationFiled: July 6, 2016Publication date: November 1, 2018Applicant: Toray Industries, Inc.Inventors: Kenichi Okunaga, Atsushi Masunaga, Shingo Nishida, Masaru Akita, Hideyuki Umetsu
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Patent number: 9873793Abstract: A polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130° C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.2 mm after the heat treatment is lower than 70%.Type: GrantFiled: August 28, 2014Date of Patent: January 23, 2018Assignee: Toray Industries, Inc.Inventors: Atsushi Masunaga, Hideyuki Umetsu
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Patent number: 9732190Abstract: There is provided a production method of a crystalline polyamide resin by thermal polycondensation of a mixture including at least a diamine component, a dicarboxylic acid component and water as a starting material, wherein the diamine component includes (A) pentamethylene diamine at a ratio that is equal to or greater than 10 mol % and less than 80 mol % relative to a gross amount of the diamine component; and the dicarboxylic acid component includes (B) at least one selected from the group consisting of an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid and dialkyl ester derivatives thereof at a ratio that is equal to or greater than 76 mol % and equal to or less than 100 mol % relative to a gross amount of the dicarboxylic acid component.Type: GrantFiled: August 13, 2012Date of Patent: August 15, 2017Assignee: TORAY INDUSTRIES INC.Inventors: Koya Kato, Atsushi Masunaga, Eri Hatano, Hideo Matsuoka
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Patent number: 9493611Abstract: A polyamide resin composition includes 100 parts by weight of a (a) polyamide resin; and 0.1 to 10 parts by weight of a (b) hydroxyl group- and carboxyl group-containing compound, wherein the (b) hydroxyl group- and carboxyl group-containing compound has a ratio (COOH/OH) of 0.01 to 5.0 of a rate (percentage) of a carboxyl group-derived peak area to a total peak area in a 13C-NMR spectrum to a rate (percentage) of a hydroxyl group-derived peak area to a total peak area in a 1H-NMR spectrum and has a degree of branching of 0.05 to 0.35.Type: GrantFiled: September 12, 2013Date of Patent: November 15, 2016Assignee: Toray Industries, Inc.Inventors: Atsushi Masunaga, Hiroshi Nakagawa, Hideyuki Umetsu
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Publication number: 20160264778Abstract: A polyamide resin composition has excellent heat aging resistance, surface appearance, retention stability, dimensional accuracy, chemical resistance and the like. One polyamide resin composition includes a specified amount of a compound and/or its condensate that includes a hydroxyl group and an epoxy group or a carbodiimide group and has a specific structure. Another polyamide resin composition includes specified amounts of an aliphatic compound having three or more amino groups or three or more hydroxyl groups per molecule and a compound having more than one functional group per molecule that is reactive with the amino group or the hydroxyl group, wherein, when an ASTM No. 1 dumbbell of 3.2 mm in thickness produced by injection molding of the polyamide resin composition is processed by heat treatment at 130° C. for 100 hours, an increase rate in concentration of a carboxyl group in the polyamide resin composition from a surface of the molded product to a depth of 0.Type: ApplicationFiled: August 28, 2014Publication date: September 15, 2016Inventors: Atsushi Masunaga, Hideyuki Umetsu
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Publication number: 20150232617Abstract: A polyamide resin composition includes 100 parts by weight of a (a) polyamide resin; and 0.1 to 10 parts by weight of a (b) hydroxyl group- and carboxyl group-containing compound, wherein the (b) hydroxyl group- and carboxyl group-containing compound has a ratio (COOH/OH) of 0.01 to 5.0 of a rate (percentage) of a carboxyl group-derived peak area to a total peak area in a 13C-NMR spectrum to a rate (percentage) of a hydroxyl group-derived peak area to a total peak area in a 1H-NMR spectrum and has a degree of branching of 0.05 to 0.35.Type: ApplicationFiled: September 12, 2013Publication date: August 20, 2015Applicant: Toray Industries, Inc.Inventors: Atsushi Masunaga, Hiroshi Nakagawa, Hideyuki Umetsu
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Publication number: 20140194570Abstract: There is provided a production method of a crystalline polyamide resin by thermal polycondensation of a mixture including at least a diamine component, a dicarboxylic acid component and water as a starting material, wherein the diamine component includes (A) pentamethylene diamine at a ratio that is equal to or greater than 10 mol % and less than 80 mol % relative to a gross amount of the diamine component; and the dicarboxylic acid component includes (B) at least one selected from the group consisting of an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid and dialkyl ester derivatives thereof at a ratio that is equal to or greater than 76 mol % and equal to or less than 100 mol % relative to a gross amount of the dicarboxylic acid component, the production method comprising: a first step that heats the above mixture, which has a water content equal to or less than 30% by weight, at a temperature equal to or higher than 200° C. under a pressure of 1.8 to 3.Type: ApplicationFiled: August 13, 2012Publication date: July 10, 2014Applicant: TORAY INDUSTRIES, INC.Inventors: Koya Kato, Atsushi Masunaga, Eri Hatano, Hideo Matsuoka
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Patent number: 8674055Abstract: A method for producing a polyamide resin characterized by comprising thermally polycondension of tetramethylene diamine and either an aliphatic dicarboxylic acid having 7 or more carbon atoms or a salt thereof, and then being melt-polymerized at a temperature equal to or higher than the melting point thereof until the relative viscosity of a 0.01 g/ml solution thereof in 98% sulfuric acid solution with a 0.01 g/ml content at 25° C. becomes 2.2-5.0.Type: GrantFiled: February 24, 2010Date of Patent: March 18, 2014Assignee: Toray Industries, Inc.Inventors: Koya Kato, Atsushi Masunaga, Hideo Matsuoka
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Publication number: 20120016077Abstract: A polyamide resin obtained by heating and condensation-polymerizing ingredients mainly comprising pentamethylenediamine having a total content of 2,3,4,5-tetrahydropyridine and piperidine of 0.10 wt. % or lower and an aliphatic dicarboxylic acid having 7 or more carbon atoms, a 0.01 g/mL solution of the polyamide resin in 98% sulfuric acid having a relative viscosity at 25° C. of 1.8-4.5. The polyamide resin has excellent heat resistance, extremely low water absorption, and excellent melt residence stability and is hence suitable for use as long molded articles represented by automotive radiator tanks, etc.Type: ApplicationFiled: March 25, 2010Publication date: January 19, 2012Applicant: TORAY INDUSTRIES INC.Inventors: Koya Kato, Atsushi Masunaga, Hideo Matsuoka
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Publication number: 20110301290Abstract: A method for producing a polyamide resin characterized by comprising thermally polycondension of tetramethylene diamine and either an aliphatic dicarboxylic acid having 7 or more carbon atoms or a salt thereof, and then being melt-polymerized at a temperature equal to or higher than the melting point thereof until the relative viscosity of a 0.01 g/ml solution thereof in 98% sulfuric acid solution with a 0.01 g/ml content at 25° C. becomes 2.2-5.0.Type: ApplicationFiled: February 24, 2010Publication date: December 8, 2011Inventors: Koya Kato, Atsushi Masunaga, Hideo Matsuoka