Patents by Inventor Atsushi Ono

Atsushi Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240200587
    Abstract: A joint structure according to an aspect of the present invention includes: a first metal sheet on which a cylindrical first rising portion is formed; at least one target material in which a through hole into which the first rising portion is inserted is formed and which is joined to the first metal sheet; and a joint member which is inserted into the first rising portion and joins the first metal sheet and the target material which are superimposed on each other to each other, wherein the joint member has a shaft portion which is inserted inside the first rising portion, and a first surface which is a surface opposite to a surface facing the first metal sheet of both surfaces of the target material and a tip end portion of the first rising portion are at different positions in an axial direction of the first rising portion.
    Type: Application
    Filed: June 29, 2022
    Publication date: June 20, 2024
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Atsushi ONO, Hiroki FUJIMOTO, Koichi HAMADA, Masanobu KAMO, Takashi IMAMURA
  • Patent number: 12000844
    Abstract: The present invention provides a polypeptide consisting of any of the following amino acid sequences and useful for determining Alzheimer's disease: (1) the amino acid sequence shown in SEQ ID NO: 1; and (2) an amino acid sequence resulting from substitution, deletion, addition or insertion of one to several amino acids in the amino acid sequence shown in SEQ ID NO: 1.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: June 4, 2024
    Assignee: SUMITOMO PHARMA CO., LTD.
    Inventors: Atsushi Ono, Yasuhiro Teranishi, Masanori Kusumoto, Masakazu Hashimoto, Shoji Kashiwabara, Maki Hashimoto
  • Patent number: 11986874
    Abstract: A method of manufacturing a press-formed article includes first press forming and second press forming. In the first press forming, an intermediate formed article is formed from a metal sheet by subjecting the metal sheet to processing including performing draw-forming on the metal sheet to form a peripheral wall portion, bending the metal sheet to form a convex flange portion, and bending the metal sheet to form at least a side standing flange main body portion of a side standing flange portion and a floor flange main body portion of a floor flange portion. The second press forming includes bending the intermediate formed article to form the convex flange portion to an inclined flange portion.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: May 21, 2024
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Atsushi Ono, Yoshiaki Nakazawa, Satoshi Shirakami
  • Patent number: 11967978
    Abstract: A radio-frequency circuit is used in simultaneous transfer of a radio-frequency signal of 4G and a radio-frequency signal of 5G, and includes a first transfer circuit that selectively receives the 4G radio-frequency signal or the 5G radio-frequency signal, and transfers a radio-frequency signal of a first communication band including a first transmission band and a first reception band and a radio-frequency signal of a second communication band including a second transmission band and a second reception band. The first and second transmission bands at least partially overlap. The first transfer circuit includes a first power amplifier that amplifies transmission signals of the first and second communication bands, and a first transmission filter that has a first passband including the first and second transmission bands, and passes the transmission signals of the first and second communication bands output from the first power amplifier.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: April 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Ono, Satoshi Tanaka, Hirotsugu Mori
  • Publication number: 20240116496
    Abstract: A cooling ECU for a vehicle including a high-temperature-side coolant circuit that circulates high-temperature-side coolant by a high-temperature-side water pump, and an airbag ECU that detects collision stops the high-temperature-side water pump when the collision is detected by the airbag ECU and the high-temperature-side coolant is equal to or higher than a first predetermined temperature determined based on the boiling point of the water.
    Type: Application
    Filed: August 4, 2023
    Publication date: April 11, 2024
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takayuki SHIMAUCHI, Hidekazu HIRABAYASHI, Atsushi ONO
  • Publication number: 20240106465
    Abstract: A first receiving band and a first transmission band in band A and a second transmission band and a second receiving band in band B are listed in frequency order. A radio frequency module includes: first and second boards; a first filter having a passband that is the first transmission band; second and sixth filters each having a passband that is the first receiving band; third and fifth filters each having a passband that is the second receiving band; a first power amplifier connected to the first filter; a fourth filter having a passband that is the second transmission band; and a second power amplifier connected to the fourth filter. The first to third filters and the first power amplifier are disposed on the first board, and the fourth to sixth filters and the second power amplifier are disposed on the second board.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Atsushi ONO, Hirotsugu MORI, Yoshiki YAGURA, Kiwamu SAKANO, Akira NOGUCHI
  • Publication number: 20240099139
    Abstract: A fabrication method of a thermoelectric conversion element includes forming a first metal layer containing Cu on a first surface of a thermoelectric conversion layer, and forming a first electrode and a first intermediate layer from the first metal layer. The thermoelectric conversion layer is composed of a thermoelectric conversion material containing Mg and at least one kind of element selected from the group consisting of Sb and Bi, the first intermediate layer is provided between the thermoelectric conversion layer and the first electrode, the first intermediate layer is in contact with the thermoelectric conversion layer, the first electrode is in contact with the first intermediate layer, and a composition of the first intermediate layer is different from both a composition of the first electrode and a composition of the thermoelectric conversion layer.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Inventors: Miho UEHARA, Yuriko KANEKO, Atsushi ONO, Masashige KAWABE, Tsutomu KANNO, Hiromasa TAMAKI, Hiroki SATO
  • Publication number: 20240059238
    Abstract: A structural member includes a first member, a second member, and resin. The first member includes a top plate, vertical walls, flanges, and ridge portions. The second member includes a top plate, vertical walls, flanges, and ridge portions. The vertical walls of the second member are disposed along the vertical walls of the first member on an inner side of the vertical walls. The flanges of the second member are joined to the flanges of the first member, respectively. The resin is filled in between the vertical walls of the second member.
    Type: Application
    Filed: December 24, 2021
    Publication date: February 22, 2024
    Applicant: NIPPON STEEL CORPORATION
    Inventor: Atsushi ONO
  • Publication number: 20240059237
    Abstract: A structural member includes a first member, a second member, and a restricting portion. The first member includes a top plate, vertical walls, flanges, and ridge portions. The second member includes a top plate, vertical walls, flanges, and ridge portions. The vertical walls of the second member are disposed along the vertical walls of the first member inside of the vertical walls. The flanges of the second member are joined to the flanges of the first member, respectively. The restricting portion is provided between the vertical walls of the second member. The restricting portion restricts deformation in which portions of the vertical walls of the first member close to the flanges approach each other.
    Type: Application
    Filed: December 24, 2021
    Publication date: February 22, 2024
    Applicant: NIPPON STEEL CORPORATION
    Inventor: Atsushi ONO
  • Publication number: 20240022280
    Abstract: A radio frequency circuit includes: a divider circuit configured to divide a radio frequency signal input through a first terminal, and output radio frequency signals resulting from the dividing, respectively through a second terminal and a third terminal; a combiner circuit configured to combine a radio frequency signal input through a fourth terminal and a radio frequency signal input through a fifth terminal, and output a radio frequency signal resulting from the combining, through a sixth terminal; a first amplifier disposed on a first path connecting the second terminal and the fourth terminal; a second amplifier disposed on a second path connecting the third terminal and the fifth terminal; and a first switch connected between the third terminal and an input terminal of the second amplifier, the first switch being switched between a conducting state and a non-conducting state according to a power class.
    Type: Application
    Filed: June 14, 2023
    Publication date: January 18, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi TANAKA, Atsushi ONO, Hirotsugu MORI
  • Publication number: 20240014842
    Abstract: A radio frequency circuit includes: a plurality of input terminals including a first input terminal through which a first Wireless Local Area Network (WLAN) transmission signal is received and a second input terminal through which a 5th Generation New Radio (5G NR) transmission signal is received; a power amplifier; a first switch connected to an input side of the power amplifier and switches a connection of the power amplifier between the plurality of input terminals; and a variable phase circuit connected to an output side of the power amplifier and changes the impedance matching between the power amplifier and the load in accordance with a connection status of the first switch.
    Type: Application
    Filed: September 22, 2023
    Publication date: January 11, 2024
    Inventors: Atsushi ONO, Hirotsugu MORI
  • Patent number: 11871666
    Abstract: The thermoelectric conversion element according to the present disclosure comprises a first electrode, a second electrode, a first intermediate layer, a second intermediate layer, and a thermoelectric conversion layer. The first intermediate layer is provided between the thermoelectric conversion layer and the first electrode. The first intermediate layer is in contact with the thermoelectric conversion layer. The first electrode is in contact with the first intermediate layer. The second intermediate layer is provided between the thermoelectric conversion layer and the second electrode. The second intermediate layer is in contact with the thermoelectric conversion layer. The second electrode is in contact with the second intermediate layer. The first electrode and the second electrode are composed of a CuZn alloy. The thermoelectric conversion layer is composed of a thermoelectric conversion material containing Mg.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: January 9, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Miho Uehara, Yuriko Kaneko, Atsushi Ono, Masashige Kawabe, Tsutomu Kanno, Hiromasa Tamaki, Hiroki Sato
  • Publication number: 20230415476
    Abstract: A liquid ejection apparatus includes a liquid ejection portion configured to eject a liquid from a plurality of nozzles to perform printing, a liquid mounting portion to which a liquid accommodation portion configured to accommodate a liquid is removably mounted, an image reading portion configured to read an image, and a control portion. The control portion enables use of the image reading portion whether or not the liquid accommodation portion is replaced, in a state in which a liquid accommodation amount of the liquid accommodation portion is less than a liquid threshold value, and there is no possibility of reduction in product quality. The control portion prohibits use of the image reading portion until the liquid accommodation portion is replaced, in a state in which the liquid accommodation amount is less than the liquid threshold value, and there is no possibility of reduction in product quality.
    Type: Application
    Filed: June 26, 2023
    Publication date: December 28, 2023
    Inventor: Atsushi ONO
  • Publication number: 20230411376
    Abstract: A high frequency module capable of improving a heat dissipation performance of a power amplifier includes a mounting board, a power amplifier, and a connection member. The mounting board has a first main surface facing a second main surface. The power amplifier is disposed on the second main surface of the mounting board. The connection member is connectable to an external board. The power amplifier includes a base material, a transistor, and a through via. The base material has a third main surface facing a fourth main surface, and the third main surface is disposed between the second main surface and the fourth main surface. The transistor is disposed on the third main surface of the base material. The through via is provided between the third main surface and the fourth main surface. The through via is connected to the connection member.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Atsushi ONO, Yoshiaki SUKEMORI, Yoshiki KOGUSHI, Hisanori NAMIE
  • Publication number: 20230411377
    Abstract: A high frequency module capable of improving heat dissipation characteristics of a power amplifier and suppressing influence of heat of the power amplifier on another electronic component is provided. A high frequency module includes a mounting substrate, a power amplifier, a switch, a plurality of external connection terminals, and a connector. The mounting substrate has a first main surface and a second main surface that are opposite to each other. The power amplifier and the switch are disposed on the second main surface of the mounting substrate. The plurality of external connection terminals are disposed on the second main surface of the mounting substrate. The connector is able to be connected to an external substrate. The plurality of external connection terminals include a first external connection terminal that is connected to the connector. The first external connection terminal is disposed between the power amplifier and the switch.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Atsushi ONO, Masanori KISHIMOTO, Yoshiaki SUKEMORI, Yoshiki KOGUSHI, Kenichi SHIMAMOTO, Hisanori NAMIE
  • Patent number: 11822075
    Abstract: A display device according to one aspect of the present invention includes: a display unit configured to have display information and emits visible light having a continuous spectrum; an infrared cut-off part configured to transmit the visible light from the display unit and to reduce the amount of infrared light striking the display unit; and a reflecting part configured to reflect the visible light having passed through the infrared cut-off part. The infrared cut-off part includes a first polymer film and a second polymer film, the first polymer film includes an infrared cut-off layer configured to reduce infrared light transmission, and the second polymer film includes a high-retardation polyester film and is disposed between the first polymer film and the display unit.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: November 21, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Yuji Saito, Noboru Iwata, Atsushi Ono, Kentaro Tamura
  • Publication number: 20230349924
    Abstract: The present invention provides a kit for use in determining tauopathy or a dementia-related disease (excluding Alzheimer’s disease), containing an antibody that recognizes a polypeptide consisting of (1) the amino acid sequence shown in SEQ ID NO: 1, or (2) an amino acid sequence resulting from substitution, deletion, addition or insertion of one to several amino acids in the amino acid sequence shown in SEQ ID NO: 1, and the like.
    Type: Application
    Filed: February 4, 2021
    Publication date: November 2, 2023
    Applicant: Sumitomo Pharma Co., Ltd.
    Inventors: Atsushi ONO, Hidetaka NAGATA, Masakazu HASHIMOTO
  • Patent number: 11804868
    Abstract: A radio frequency circuit includes: a plurality of input terminals including a first input terminal through which a first Wireless Local Area Network (WLAN) transmission signal is received and a second input terminal through which a 5th Generation New Radio (5G NR) transmission signal is received; a power amplifier; a first switch connected to an input side of the power amplifier and switches a connection of the power amplifier between the plurality of input terminals; and a variable phase circuit connected to an output side of the power amplifier and changes the impedance matching between the power amplifier and the load in accordance with a connection status of the first switch.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: October 31, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Ono, Hirotsugu Mori
  • Publication number: 20230336204
    Abstract: A radio frequency circuit includes a first radio frequency circuit, a second radio frequency circuit, and a first switch circuit. The first switch circuit includes a first terminal connected to an antenna connection terminal, a second terminal connected to the first radio frequency circuit, and a third terminal connected to the second radio frequency circuit. The first radio frequency circuit includes a first power amplifier circuit supporting a first power class, and a first filter circuit connected to the first power amplifier circuit and having a passband that includes a first band. The second radio frequency circuit includes a second power amplifier circuit supporting a second power class having a maximum output power greater than a maximum output power of the first power class. The second radio frequency circuit includes a second filter circuit connected to the second power amplifier circuit and having a passband that includes the first band.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Atsushi ONO, Satoshi TANAKA, Hirotsugu MORI
  • Publication number: 20230318558
    Abstract: A radio-frequency circuit includes a first switch, a first filter, a second filter, a third filter, and a fourth filter. The first switch is capable of selectively connecting a first selection terminal or a second selection terminal to a first common terminal. The first filter and the second filter are connected to the first selection terminal. The third filter and the fourth filter are connected to the second selection terminal. The first filter and the third filter are band pass filters. The second filter is a band elimination filter. A pass band of the first filter and a rejection band of the second filter overlap each other. The pass band of the first filter and a pass band of the third filter overlap each other.
    Type: Application
    Filed: March 3, 2023
    Publication date: October 5, 2023
    Inventors: Masanori KATO, Syunsuke KIDO, Atsushi ONO, Hiroshi MATSUBARA