Abstract: The present invention provides: a heat generation method that makes the first use of the ionic vacancies that are a by-product of an electrochemical reaction and have conventionally been left unreacted; and a device for implementing the same. The present invention pertains to: a heat generation method characterized by comprising colliding, in an electrochemical reaction that proceeds in an electrolysis cell, ionic vacancies having a positive charge generated at an anode and ionic vacancies having a negative charge generated at a cathode; and a heat generation device characterized by being equipped with an electrolysis cell provided with an anode and a cathode and an electrolyte solution accommodated within the electrolysis cell, and by generating heat by colliding ionic vacancies of opposite signs generated by causing the electrochemical reaction to proceed in the electrolysis cell via the anode and the cathode.

Abstract: A quantum cascade laser element includes: a semiconductor substrate; a semiconductor laminate including an active layer having a quantum cascade structure; a first electrode formed on a surface on an opposite side of the semiconductor laminate from the semiconductor substrate; a second electrode; and an insulating film formed on at least one end surface of a first end surface and a second end surface of the semiconductor laminate. The first electrode includes a first metal layer made of a first metal, and a second metal layer made of a second metal having a higher ionization tendency than that of the first metal. The first metal layer has a first region exposed to an outside. The second metal layer has a second region located on one end surface side with respect to the first region. The insulating film reaches the second region from the one end surface.

Abstract: A quantum cascade laser element includes: a semiconductor substrate; a semiconductor laminate including an active layer and having a first end surface and a second end surface facing each other in an optical waveguide direction; a first electrode; a second electrode; and an anti-reflection film formed on the first end surface. The semiconductor laminate is configured to oscillate laser light having a central wavelength of 7.5 ?m or more. The anti-reflection film includes at least one of at least one layer of a CeO2 film formed by continuous sputtering and vacuum evaporation and a plurality of layers of CeO2 films formed by discrete sputtering and vacuum evaporation.

Abstract: The external cavity laser module includes a quantum cascade laser element, a MEMS diffraction grating, a support plate having a first surface on which the quantum cascade laser element and the MEMS diffraction grating are disposed and a second surface opposite to the first surface, and a cooling element disposed on a side facing the second surface of the support plate to overlap with the quantum cascade laser element and the MEMS diffraction grating. In the second surface of the support plate, a concave portion recessed in a direction from the second surface toward the first surface is provided in at least a region overlapping with the quantum cascade laser element and the MEMS diffraction grating when viewed from the thickness direction. At least a portion of the cooling element facing the support plate is inserted into the concave portion.

Abstract: A method for manufacturing a quantum cascade laser element includes: a step of forming a semiconductor layer on a first major surface of a semiconductor wafer; a step of removing a part of the semiconductor layer by etching such that each of portions of the semiconductor layer includes a ridge portion; a step of forming an insulating layer such that at least a part of a surface of the ridge portion is exposed; a step of embedding the ridge portion in each of metal plating layers; a step of flattening a surface of the metal plating layers by polishing in a state where a protective member is disposed; a step of forming an electrode layer on a second major surface of the semiconductor wafer; and a step of cleaving the semiconductor wafer and the semiconductor layer in a state where the protective member is removed.

Abstract: A quantum cascade laser element includes: a semiconductor substrate; a semiconductor laminate formed on the semiconductor substrate to include an active layer having a quantum cascade structure and to have a first end surface and a second end surface facing each other in a light waveguide direction; a first electrode; a second electrode; an insulating film continuously formed from the second end surface to a region on a second end surface side of at least one surface of a surface on an opposite side of the first electrode from the semiconductor laminate and a surface on an opposite side of the second electrode from the semiconductor substrate; and a metal film formed on the insulating film to cover at least the active layer when viewed in the light waveguide direction. An outer edge of the metal film does not reach the one surface when viewed in the light waveguide direction.

Abstract: A quantum-cascade laser element includes: a semiconductor substrate; a semiconductor mesa formed on the semiconductor substrate to include an active layer having a quantum-cascade structure and to extend along a light waveguide direction; an embedding layer formed to interpose the semiconductor mesa along a width direction of the semiconductor substrate; a cladding layer formed at least on the semiconductor mesa; and a metal layer formed at least on the cladding layer. A thickness of the cladding layer is thinner in a second region located outside a first region in the width direction of the semiconductor substrate than in the first region of which at least a part overlaps the semiconductor mesa when viewed in a thickness direction of the semiconductor substrate. The metal layer extends over the first region and the second region.

Abstract: A quantum cascade laser element includes: a semiconductor substrate; a semiconductor laminate having a first end surface and a second end surface; a first electrode; a second electrode; and an anti-reflection film formed on the first end surface. The semiconductor laminate is configured to oscillate laser light having a center wavelength of 7.5 ?m or more. The anti-reflection film includes an insulating film being a CeO2 film formed on the first end surface, a first refractive index film being a YF3 film or a CeF3 film disposed on a side opposite the first end surface with respect to the insulating film, and a second refractive index film formed on the first refractive index film on a side opposite the first end surface with respect to the first refractive index film and having a refractive index of larger than 1.8.

Abstract: A quantum-cascade laser element includes: a semiconductor substrate; a semiconductor mesa formed on the semiconductor substrate to include an active layer having a quantum-cascade structure and to extend along a light waveguide direction; an embedding layer formed to interpose the semiconductor mesa along a width direction of the semiconductor substrate; a cladding layer formed over the semiconductor mesa and over the embedding layer; and a metal layer formed on the cladding layer. A pair of groove portions extending along the light waveguide direction are formed in a surface on an opposite side of the cladding layer from the semiconductor substrate. The pair of groove portions are disposed in two respective outer regions when the cladding layer is equally divided into four regions in the width direction of the semiconductor substrate. The metal layer enters the pair of groove portions.

Abstract: A quantum-cascade laser element includes: an embedding layer including a first portion formed on a side surface of a ridge portion, and a second portion extending from an edge portion of the first portion on a side of a semiconductor substrate along a width direction of the semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion. A surface of the second portion on a side opposite to the semiconductor substrate is located between a surface of an active layer on a side opposite to the semiconductor substrate and a surface of the active layer on a side of the semiconductor substrate. When viewed in the width direction of the semiconductor substrate, a part of the metal layer on the first portion overlaps the active layer. The metal layer is directly formed on the first portion.

Abstract: A quantum-cascade laser element includes: a semiconductor substrate; a semiconductor laminate formed on the semiconductor substrate to include a ridge portion configured to include an active layer having a quantum-cascade structure; an embedding layer including a first portion formed on a side surface of the ridge portion, and a second portion extending from an edge portion of the first portion on a side of the semiconductor substrate along a width direction of the semiconductor substrate; a metal layer formed on a top surface of the ridge portion, on the first portion, and on the second portion; and a dielectric layer disposed between the second portion and the metal layer. The dielectric layer is formed such that a part of the second portion is exposed from the dielectric layer. The metal layer is in contact with the second portion at the part.

Abstract: A quantum-cascade laser element includes: an embedding layer including a first portion formed on a side surface of a ridge portion, and a second portion extending from an edge portion of the first portion along a width direction of a semiconductor substrate; and a metal layer formed at least on a top surface of the ridge portion and on the first portion. A surface of the first portion has a first inclined surface inclined with respect to the side surface to go away from the side surface as going away from the semiconductor substrate, and a second inclined surface located opposite to the semiconductor substrate with respect to the first inclined surface and inclined with respect to a center line to approach the center line as going away from the semiconductor substrate. The metal layer extends over the first inclined surface and the second inclined surface.

Abstract: A semiconductor laser element includes: a semiconductor substrate; a semiconductor laminate; a first electrode in which a ridge portion of the semiconductor laminate is embedded; and a second electrode. A first region of a side surface of the first electrode is separated from a first end surface in such a manner to extend away from the first end surface as the first region extends away from the ridge portion to both sides. A shortest distance between a first side surface and the first region is smaller than each of a shortest distance between a third side surface and a third region and a shortest distance between a fourth side surface and a fourth region. The first region does not include a corner in a range satisfying D1 ? S1 and D1 ? S2.

Abstract: The laser module includes a QCL element, a diffraction grating unit, a first lens holder, a second lens holder, and a mount member. The fourth mounting portion of the mount member is provided with a placement hole into which the protruding portion of the diffraction grating unit is inserted. The placement hole is longer than the protruding portion so that the protruding portion can be slid in the X-axis direction relative to the placement hole. A wall surface for positioning the diffraction grating unit is provided between the third mounting portion and the fourth mounting portion. The diffraction grating unit includes a positioning surface facing the wall surface. The diffraction grating unit is fixed to the fourth mounting portion in a state where the protruding portion is inserted into the placement hole and the positioning surface is in surface contact with the wall surface.

Abstract: The laser module includes a QCL element, a diffraction grating unit, a first lens holder, a second lens holder, and a mount member. The first mounting portion has a first top surface on which the first lens holder is mounted via an adhesive layer. The third mounting portion has a third top surface on which the second lens holder is mounted via an adhesive layer. The second mounting portion has a second top surface located higher than the first top surface and the third top surface, a first side surface connecting the second top surface and the first top surface, and a second side surface connecting the second top surface and the third top surface. A notch extending from the second top surface to the first top surface or the third top surface is formed in at least one of the first side surface and the second side surface.

Abstract: A control device includes a processor. The processor displays a first image of a robot, first input/output images representing a robot input/output, a second image of a peripheral device, second input/output images representing a device input/output, and an input/output edit screen accepting an input/output relationship between the robot output and a peripheral device input on a display. Each of the robot output and the peripheral device input causes the robot and the peripheral device to perform a synchronous operation or an asynchronous operation that is synchronously or asynchronously performed between the robot and the peripheral device, respectively. When one of the first input/output images corresponds to the synchronous operation, one of the second input/output images corresponds to only the synchronous operation. When another of the first input/output images corresponds to the asynchronous operation, another of the second input/output images corresponds to only the asynchronous operation.

Abstract: An external resonance-type laser module includes: a quantum cascade laser; a MEMS diffraction grating including a movable portion capable of swinging around an axis and a diffraction grating portion formed on the movable portion; and a lens. The diffraction grating portion includes a plurality of lattice grooves arranged in a first direction and each of the plurality of lattice grooves extends in a second direction perpendicular to the first direction. The MEMS diffraction grating is disposed such that a normal line of the diffraction grating portion is inclined with respect to an end surface and the first direction is along a lamination direction of a laminated structure when viewed in a direction perpendicular to the end surface. A length of the diffraction grating portion in the first direction exceeds a length of the diffraction grating portion in the second direction.

Abstract: The laser module includes a QCL element, a MEMS diffraction grating, a lens holder for holding a lens disposed between the QCL element and the MEMS diffraction grating, and a package. The package includes a bottom wall, a side wall erected on the bottom wall and formed in an annular shape so as to surround a region in which the QCL element is accommodated, and a top wall closing an opening of the side wall on a side opposite to a side where the bottom wall is disposed. The top wall faces the bottom wall in a direction orthogonal to the optical axis direction of the lens, and the distance between the top wall and a surface of the lens holder on a side where the top wall is disposed is smaller than a thickness of the lens holder along the optical axis direction of the lens.

Abstract: The laser module includes a QCL element, a MEMS diffraction grating, a lens holder holding a lens disposed between the QCL element and the MEMS diffraction grating, a package, an electrode terminal disposed along an inner wall surface of the package, and a wire for electrically connecting the electrode terminal and a coil. The top wall of the package faces the bottom wall of the package in a direction orthogonal to the optical axis direction of the lens. The MEMS diffraction grating includes an electrode pad electrically connected to the coil. The electrode pad is connected to the electrode terminal via the wire. A height position of the electrode pad with respect to the bottom wall is equal to or higher than a height position of the electrode terminal with respect to the bottom wall.

Abstract: The laser module includes a QCL element, a MEMS diffraction grating, a first lens holder disposed on a side opposite to a side on which the MEMS diffraction grating is disposed with respect to the QCL element, a second lens holder disposed between the QCL element and the MEMS diffraction grating, a package, an electrode terminal disposed along an inner wall surface of the package, and a wire for electrically connecting the electrode terminal and the QCL element. An end portion of the wire on a side where the QCL element is disposed is disposed at a position between the first lens holder and the second lens holder when viewed from a direction orthogonal to a facing direction in which the first lens holder and the second lens holder face each other.