Patents by Inventor Atsushi Takeda

Atsushi Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230413655
    Abstract: According to one embodiment, an evaporation device includes a first chamber group including a plurality of evaporation chambers arranged in line in a first conveyance direction, a second chamber group including a plurality of evaporation chambers arranged in line in a second conveyance direction, a first rotation chamber which is connected to a first evaporation chamber located at a upstream position in the first conveyance direction and a second evaporation chamber located at a downstream position in the second conveyance direction, and a second rotation chamber which is connected to a third evaporation chamber located at a downstream position in the first conveyance direction and a fourth evaporation chamber located at a upstream position in the second conveyance direction.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 21, 2023
    Applicant: Japan Display Inc.
    Inventor: Atsushi TAKEDA
  • Patent number: 11821448
    Abstract: A blind bolt with a bolt head, a shaft portion on which a male screw is formed, and a bolt. An outer nut having a polygonal outer surface, and an outer nut hole penetrating in the axial direction. A cylindrical valve sleeve formed with a sleeve hole and an inner nut having a cylindrical portion. A nut head portion formed at one end of the cylindrical portion, and an inner nut hole having a female screw formed in a part inside. A plurality of outer peripheral grooves, extending in the outer peripheral direction are formed on the outer circumference of the valve sleeve. The cylindrical portion of the inner nut being inserted into the sleeve hole of the valve sleeve, the tip portion of the cylindrical portion inserted into the outer nut hole of the outer nut to prevent the inner nut from rotating with respect to the outer nut.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: November 21, 2023
    Assignee: NEWFREY LLC
    Inventor: Atsushi Takeda
  • Publication number: 20230371344
    Abstract: According to an embodiment, a manufacturing method allows the manufacture of a display device including a partition including a lower portion provided on a rib including a pixel aperture and an upper portion protruding from a side surface of the lower portion. The method includes forming a lower electrode, forming a rib layer, forming a lower layer, forming an upper layer, forming a resist, forming the rib by a first etching process, forming the upper portion by a second etching process after the first etching process, and forming the lower portion by a third etching process after the second etching process.
    Type: Application
    Filed: May 8, 2023
    Publication date: November 16, 2023
    Applicant: Japan Display Inc.
    Inventor: Atsushi TAKEDA
  • Patent number: 11784030
    Abstract: A plasma processing apparatus includes a balun having a first unbalanced terminal, a second unbalanced terminal, a first balanced terminal, and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, and a ground electrode arranged in the vacuum container and grounded.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: October 10, 2023
    Assignee: CANON ANELVA CORPORATION
    Inventors: Atsushi Takeda, Takayuki Moriwaki, Tadashi Inoue, Masaharu Tanabe, Kazunari Sekiya, Hiroshi Sasamoto, Tatsunori Sato, Nobuaki Tsuchiya
  • Publication number: 20230269991
    Abstract: According to one embodiment, a display device includes first and second lower electrodes, a rib, a partition including a lower portion and an upper portion, a first organic layer disposed on the first lower electrode, a second organic layer disposed on the second lower electrode, a first upper electrode disposed on the first organic layer, a second upper electrode disposed on the second organic layer, a first sealing layer disposed above the first upper electrode, in contact with the lower portion and extending to above the upper portion and a second sealing layer disposed above the second upper electrode, in contact with the lower portion, extending to above the upper portion, and spaced apart from the first sealing layer.
    Type: Application
    Filed: February 21, 2023
    Publication date: August 24, 2023
    Applicant: Japan Display Inc.
    Inventors: Toshifumi MIMURA, Hiraaki KOKAME, Kaichi FUKUDA, Atsushi TAKEDA, Noriyuki HIRATA
  • Publication number: 20230219114
    Abstract: According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.
    Type: Application
    Filed: January 9, 2023
    Publication date: July 13, 2023
    Applicant: Japan Display Inc.
    Inventors: Takanobu TAKENAKA, Atsushi TAKEDA
  • Publication number: 20230220548
    Abstract: According to one embodiment, a deposition device includes a stage, a deposition head opposed to the stage, and a chamber accommodating the stage and the deposition head. The deposition head comprises a deposition source heating a material and generating vapor, a nozzle connected to the deposition source to emit the vapor generated by the deposition source, a control plate comprising a sleeve surrounding the nozzle, and a movement mechanism moving the control plate along an extension direction of the sleeve.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 13, 2023
    Applicant: Japan Display Inc.
    Inventors: Takanobu TAKENAKA, Atsushi TAKEDA
  • Publication number: 20230095767
    Abstract: Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 30, 2023
    Applicant: TDK Corporation
    Inventors: Yuichi NAGAI, Natsumi KATO, Akitoshi YOSHII, Ken MORITA, Takehisa TAMURA, Atsushi TAKEDA
  • Patent number: 11600469
    Abstract: A plasma processing apparatus includes a balun having a first unbalanced terminal, a second unbalanced terminal, a first balanced terminal, and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, and a ground electrode arranged in the vacuum container and grounded.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: March 7, 2023
    Assignee: CANON ANELVA CORPORATION
    Inventors: Atsushi Takeda, Takayuki Moriwaki, Tadashi Inoue, Masaharu Tanabe, Kazunari Sekiya, Hiroshi Sasamoto, Tatsunori Sato, Nobuaki Tsuchiya
  • Patent number: 11600466
    Abstract: A plasma processing apparatus includes an impedance matching circuit, a balun having a first unbalanced terminal connected to the impedance matching circuit, a grounded second unbalanced terminal, a first balanced terminal and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, an adjustment reactance configured to affect a relationship between a first voltage applied to the first electrode and a second voltage applied to the second electrode, a high-frequency power supply configured to supply a high frequency between the first unbalanced terminal and the second unbalanced terminal via the impedance matching circuit, and a controller configured to control an impedance of the impedance matching circuit and a reactance of the adjustment reactance.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: March 7, 2023
    Assignee: CANON ANELVA CORPORATION
    Inventors: Masaharu Tanabe, Kazunari Sekiya, Tadashi Inoue, Hiroshi Sasamoto, Tatsunori Sato, Nobuaki Tsuchiya, Atsushi Takeda
  • Publication number: 20230005721
    Abstract: A plasma processing apparatus includes a balun having a first unbalanced terminal, a second unbalanced terminal, a first balanced terminal, and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, and a ground electrode arranged in the vacuum container and grounded.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 5, 2023
    Applicant: Canon Anelva Corporation
    Inventors: Atsushi TAKEDA, Takayuki MORIWAKI, Tadashi INOUE, Masaharu TANABE, Kazunari SEKIYA, Hiroshi SASAMOTO, Tatsunori SATO, Nobuaki TSUCHIYA
  • Patent number: 11462391
    Abstract: A plasma processing apparatus includes an impedance matching circuit, a balun having a first unbalanced terminal connected to the impedance matching circuit, a grounded second unbalanced terminal, a first balanced terminal and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, an adjustment reactance configured to affect a relationship between a first voltage applied to the first electrode and a second voltage applied to the second electrode, a high-frequency power supply configured to supply a high frequency between the first unbalanced terminal and the second unbalanced terminal via the impedance matching circuit, and a controller configured to control an impedance of the impedance matching circuit and a reactance of the adjustment reactance.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: October 4, 2022
    Assignee: CANON ANELVA CORPORATION
    Inventors: Masaharu Tanabe, Kazunari Sekiya, Tadashi Inoue, Hiroshi Sasamoto, Tatsunori Sato, Nobuaki Tsuchiya, Atsushi Takeda
  • Patent number: 11335505
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: May 17, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Yuichi Nagai
  • Patent number: 11335541
    Abstract: A plasma processing apparatus includes an impedance matching circuit, a balun having a first unbalanced terminal connected to the impedance matching circuit, a grounded second unbalanced terminal, a first balanced terminal and a second balanced terminal, a grounded vacuum container, a first electrode electrically connected to the first balanced terminal, a second electrode electrically connected to the second balanced terminal, an adjustment reactance configured to affect a relationship between a first voltage applied to the first electrode and a second voltage applied to the second electrode, a high-frequency power supply configured to supply a high frequency between the first unbalanced terminal and the second unbalanced terminal via the impedance matching circuit, and a controller configured to control an impedance of the impedance matching circuit and a reactance of the adjustment reactance.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: May 17, 2022
    Assignee: CANON ANELVA CORPORATION
    Inventors: Masaharu Tanabe, Kazunari Sekiya, Tadashi Inoue, Hiroshi Sasamoto, Tatsunori Sato, Nobuaki Tsuchiya, Atsushi Takeda
  • Patent number: 11328866
    Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (?m) and a minimum thickness of the second region is T2 (?m), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1?0.26.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: May 10, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Patent number: 11289271
    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 29, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
  • Patent number: 11264171
    Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: March 1, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
  • Patent number: 11217391
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: January 4, 2022
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Patent number: 11152154
    Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m), a maximum thickness of the second region is T2 (?m), and a minimum thickness of the third region is T3 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1?0.11.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: October 19, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuichi Nagai, Atsushi Takeda, Takehisa Tamura, Shinya Onodera
  • Publication number: 20210123467
    Abstract: A blind bolt with a bolt head, a shaft portion on which a male screw is formed, and a bolt. An outer nut having a polygonal outer surface, and an outer nut hole penetrating in the axial direction. A cylindrical valve sleeve formed with a sleeve hole and an inner nut having a cylindrical portion. A nut head portion formed at one end of the cylindrical portion, and an inner nut hole having a female screw formed in a part inside. A plurality of outer peripheral grooves, extending in the outer peripheral direction are formed on the outer circumference of the valve sleeve. The cylindrical portion of the inner nut being inserted into the sleeve hole of the valve sleeve, the tip portion of the cylindrical portion inserted into the outer nut hole of the outer nut to prevent the inner nut from rotating with respect to the outer nut.
    Type: Application
    Filed: January 8, 2021
    Publication date: April 29, 2021
    Inventor: Atsushi TAKEDA