Patents by Inventor Atsushi Togashi

Atsushi Togashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10346688
    Abstract: The present invention provides a system for visualizing the congestion degree of an entire facility using a monitoring camera. The system detects a crowd from a monitoring camera video and derives the magnitude (number of people) of the crowd from the edge amount thereof, and thereby estimates a congestion state in a range of camera video. The system also calculates a human flow (amount of movement of people) on the basis of a number of passing people counter and the magnitude and movement speed of the crowd, etc., and estimates the number of people in an area other than the range of camera video on the basis of a modeled crowd behavior pattern. The model is constructed by selecting a distribution function and a parameter thereof by a statistical model selection technique such as a Bayesian Information Criteria (BIC). The congestion state is plotted on a map, allowing the congestion state of an area of interest to be grasped at once.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: July 9, 2019
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Junichi Togashi, Atsushi Sassa, Takashi Yoshida, Yohei Akimoto, Kazunari Iwanaga, Tomomi Takada
  • Publication number: 20190180447
    Abstract: The purpose of the present invention is to provide a technology which adaptively switches video analysis methods according to a congestion situation within a video, and which carries out a suitable video analysis by a limited computational volume. Provided is an image processing device 100, wherein a congestion estimation unit 102 estimates a congestion situation within a video which is acquired from an image input unit 101. A control unit 103 switches methods for video analysis according to the congestion situation. In a situation of low congestion, an image analysis unit for use in normal situations 105 carries out the video analysis by a basic method. In a situation of high congestion, an image analysis unit for use in congested situations 106 carries out a high-precision video analysis, such as an analysis which spans a plurality of frames.
    Type: Application
    Filed: September 21, 2017
    Publication date: June 13, 2019
    Inventors: Yuichiro KOMIYA, Muneaki YAMAGUCHI, Hiroaki NAKAKITA, Kazunari IWANAGA, Junichi TOGASHI, Yohei AKIMOTO, Masaya OKADA, Atsushi SASSA, Wataru ITO
  • Patent number: 7781522
    Abstract: A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a[R22SiO2/2]b[R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c equals 1; on average, “a” satisfies the following condition: 0?a?0.8; on average, “b” satisfies the following condition: 0.2?b?0.8; and, on average, “c” satisfies the following condition: 0.2<c<1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: August 24, 2010
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Yoshitsugu Morita, Minoru Isshiki, Hiroshi Ueki, Atsushi Togashi
  • Patent number: 7405251
    Abstract: This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: July 29, 2008
    Assignee: Dow Corning Corporation
    Inventors: David Joseph Romenesko, Randall Gene Schmidt, Atsushi Togashi, Gary Michael Wieber
  • Patent number: 7282270
    Abstract: A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: October 16, 2007
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Yoshitsugu Morita, Tomoko Kato, Atsushi Togashi, Hiroji Enami
  • Publication number: 20070225437
    Abstract: A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a [R22SiO2/2]b [R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c & equals; 1; on average, “a” satisfies the following condition: 0?a?0.8; on average, “b” satisfies the following condition: 0?b?0.8; and, on average satisfies the following condition: 0.2?c?1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.
    Type: Application
    Filed: November 4, 2004
    Publication date: September 27, 2007
    Inventors: Yoshitsugu Morita, Minoru Isshiki, Hiroshi Ueki, Atsushi Togashi
  • Publication number: 20060252890
    Abstract: This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300 and having the average molecular formula: (R3SiO1/2)a (R2SiO2/2)b (RSiO3/2)c (SiO4/2)d(RO1/2)e (OH1/2)f wherein each R is hydrogen, an alkyl group, an alkenyl group, or an aryl group having from 6 to 12 carbon atoms, a and b are zero or positive numbers and the value of a+b is greater than zero, c is a positive number, d, e and f are zero or positive numbers with the provisos that the copolymer comprises at least 40 mole percent of RSiO3/2 units, the copolymer comprises less than 10 mole percent SiO4/2 units, greater than 30 mole percent of the silicon-bonded R groups are silicon-bonded aryl groups, greater than 0.
    Type: Application
    Filed: May 15, 2003
    Publication date: November 9, 2006
    Applicant: DOW CORNING CORPORATION
    Inventors: David Romenesko, Randall Schmidt, Atsushi Togashi, Gary Wieber
  • Publication number: 20060073347
    Abstract: A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
    Type: Application
    Filed: September 8, 2003
    Publication date: April 6, 2006
    Applicant: Dow Corning Toray Silicone Company , Ltd
    Inventors: Yoshitsugu Morita, Tomoko Kato, Atsushi Togashi, Hiroji Enami
  • Patent number: 6300426
    Abstract: This invention relates to a silicone composition comprising: (A) a mixture of (i) a linear trimethylsiloxy-terminated polydiorganosiloxane containing at least 2 alkenyl groups having at least 4 carbon atoms and (ii) optionally a linear dimethylalkenylsiloxy-terminated polydiorganosiloxane, (B) a polyorganohydrogensiloxane, (C) a catalytic quantity of a platinum catalyst, and (D) an inhibitor. The silicone compositions of this invention make it possible to form cured release films with low resistance to peeling when peeling is carried out at high speeds, and with the possibility of controlling the resistance to peeling between low and high values when peeling is carried out at low speeds. The silicone compositions of this invention also are not subject to a decrease in the coefficient of residual adhesion in the adhesive material applied onto a cured release film.
    Type: Grant
    Filed: November 18, 1999
    Date of Patent: October 9, 2001
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Taku Koyama, Atsushi Togashi, Takateru Yamada
  • Patent number: 5914192
    Abstract: This invention relates to a silicone release coating composition comprising an organopolysiloxane having at least 2 alkenyl groups in each molecule, an organopolysiloxane having at least 3 silicon-bonded hydrogen atoms in each molecule, a carbon-carbon triple bond-functional alcohol having a boiling point at ambient pressure of at least 140.degree. C., an organosilicon compound having at least 3 carbon-carbon triple bond-functional hydrocarbon groups bonded across oxygen to silicon, and a platinum catalyst. The silicone release coating compositions of this invention have excellent bath stability, form a very stable thin film on applicator rolls, cure rapidly even at relatively low temperatures, have stable curing characteristics during the course of bath aging, and exhibit stable release values during the course of bath aging.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: June 22, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Nobuo Kaiya, Taku Koyama, Atsushi Togashi
  • Patent number: 5877237
    Abstract: The thermosetting silicone composition of the instant invention is comprised of (a) a diorganopolysiloxane containing alkenyl groups, (b) an organohydrogenpolysiloxane, (c) a platinum catalyst-containing silicone resin fine particle catalyst comprised of (i) a thermoplastic silicone resin containing 5 to 90 mole % PhSiO.sub.3/2 siloxane units and 5 to 20 mole % MeViSiO.sub.2/2 siloxane units, wherein Ph denotes phenyl, Me denotes methyl and Vi denotes vinyl; said resin having a glass transition point of 40.degree. to 70.degree. C. and (ii) 0.05 to 2 wt % as platinum atoms of a platinum catalyst; and (d) a hydrosilation reaction inhibiting compound. The thermosetting silicone compositions have excellent storage stability at about room temperature, and cure at a fast rate when heated.
    Type: Grant
    Filed: December 16, 1994
    Date of Patent: March 2, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Junji Nakanishi, Toshio Saruyama, Atsushi Togashi
  • Patent number: 5789334
    Abstract: A microparticle catalyst for hydrosilylation reactions which contains microparticles of an average particle diameter of 0.1 to 20 .mu.m made of a metallic catalyst for hydrosilylation reactions; a disiloxane having the general formula (R.sup.1 R.sup.2 ArSi).sub.2 O, wherein, R.sup.1 is an alkenyl group, R.sup.2 is a monovalent hydrocarbon group and Ar is an aryl group; and a resin having a glass transition temperature of 40.degree. to 200.degree. C. and thermosetting silicone composition containing the microparticle catalyst.
    Type: Grant
    Filed: August 30, 1996
    Date of Patent: August 4, 1998
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Junji Nakanishi, Toshio Saruyama, Atsushi Togashi
  • Patent number: 5708046
    Abstract: The present invention relates to a curable silicone release coating composition comprising a mixture of an organopolysiloxane containing at least two alkenyl groups per compound, an organohydrogensilicon compound, inhibitors having a boiling point of up to 130.degree. C. at atmospheric pressure, inhibitors having a boiling point of at least 170.degree. C. at atmospheric pressure a platinum group metal-containing catalyst, and optionally a diluent. The silicone release coating compositions are stable when stored at room temperature, especially when the composition is used on a coating roll for the production of a thin films. The compositions of this invention also quickly form a cured film having good release properties for adhesive materials at a comparatively low temperatures.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: January 13, 1998
    Assignees: Dow Corning Corporation, Dow Corning Toray Silicone Co., Ltd.
    Inventors: John Darrell Jones, Michael Ward Skinner, Nobuo Kaiya, Atsushi Togashi, Takateru Yamada
  • Patent number: 5529822
    Abstract: The present invention relates to a process for forming a laminate and the laminate using silicone release coating compositions comprising (A) a mixture of (i) a dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer and (ii) a dimethylsiloxane-methylvinylsiloxane copolymer, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an organic solvent. The silicone release coating compositions of the present invention provide small release resistance values both at low and high peeling velocities and do not impair the residual adhesion of tacky substances that have come into contact with the coating.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: June 25, 1996
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Atsushi Togashi, Takateru Yamada
  • Patent number: 5468824
    Abstract: The present invention relates to silicone release coating compositions comprising (A) a mixture of (i) a dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer and (ii) a dimethylsiloxanemethylvinylsiloxane copolymer, (B) an organohydrogenpolysiloxane, (C) a platinum catalyst, and (D) an organic solvent. The silicone release coating compositions of the present invention provide small release resistance values both at low and high peeling velocities and do not impair the residual adhesion of tacky substances that have come into contact with the coating.
    Type: Grant
    Filed: August 24, 1994
    Date of Patent: November 21, 1995
    Assignee: Dow Corning Toray Silicon Co., Ltd.
    Inventors: Atsushi Togashi, Takateru Yamada
  • Patent number: 5300607
    Abstract: Silicone resins containing monorganosiloxane and diorganosiloxane units and exhibiting reproducible values of molecular weight and dispersity are prepared by condensing a mixture of hydrolyzed silanes, adjusting the solids content of the condensed resin and then subjecting the resultant product to a re-equilibration reaction in the presence of an alkali metal compound.
    Type: Grant
    Filed: September 11, 1992
    Date of Patent: April 5, 1994
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Junji Nakanishi, Toshio Saruyama, Atsushi Togashi
  • Patent number: 5232959
    Abstract: This invention provides a novel class of organohydrogenpolysiloxanes that function as curing agents for organosiloxane compositions curable by a hydrosilylation reaction in addition to imparting excellent adhesion to the cured composition. This invention also provides curable organosiloxane compositions containing these novel organohydrogen-polysiloxanes. The compositions exhibit excellent adhesion to a variety of organic and inorganic substrates, including but not limited to metals, glasses, and plastics.
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: August 3, 1993
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Atsushi Togashi, Akira Kasuya
  • Patent number: 5153160
    Abstract: Microparticles of a hydrosilylation catalyst encapsulated in a thermoplastic resin are prepared by forming a solution containing the hydrosilylation catalyst and a thermoplastic resin with a glass-transition temperature or softening point of 40.degree. to 200.degree. C. dissolved in a solvent, and then spraying this solution as droplets into a hot gas current in order to volatilize the solvent while solidifying said thermoplastic resin during entrainment of the droplets in the gas current.
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: October 6, 1992
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Toshio Saruyama, Teruyuki Nakagawa, Toyohiko Yamadera, Atsushi Togashi
  • Patent number: 5017654
    Abstract: The combination of a microencapsulated hydrosilylation catalyst selected from the group consisting of metals from the platinum group of the periodic table and compounds of these metals and a known inhibitor for this type of catalyst impart excellent storage stability to organosiloxane compositions that cure by a hydrosilation reaction while enabling these compositions to rapidly cure at temperatures above the softening temperature of the thermoplastic resin used to encapsulate the hydrosilylation catalyst. The curing rate of the composition is faster relative to compositions containing the microencapsulated catalyst without the catalyst inhibitor.
    Type: Grant
    Filed: June 28, 1989
    Date of Patent: May 21, 1991
    Assignee: Toray Silicone Company, Limited
    Inventors: Atsushi Togashi, Toshio Saruyama
  • Patent number: 5015716
    Abstract: This invention provides particulate catalyst compositions comprising a platinum-containing hydrosilation reaction catalyst and a polydiorganosilane exhibiting a softening point of from 50.degree. to 200.degree. C. The average particle size of the particulate does not exceed 100 micrometers, and the surface layer of the particulate is substantially free of said catalyst. Curable organopolysiloxane compositions containing the present catalyst compositions exhibit excellent storage stability.
    Type: Grant
    Filed: June 22, 1989
    Date of Patent: May 14, 1991
    Assignee: Toray Silicone Company, Limited
    Inventors: Atsushi Togashi, Toshio Saruyama