Patents by Inventor Atsushi Yabe
Atsushi Yabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8736057Abstract: A substrate having, on a base material, a barrier film for preventing copper diffusion containing one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as platinum, gold, silver and palladium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.Type: GrantFiled: November 26, 2008Date of Patent: May 27, 2014Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori
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Patent number: 8537708Abstract: This is a method for transmitting packets. The transmission method includes measuring a time taken for feedback indicating that a packet including context information has been lost; and switching between a first mode and a second mode based on the measured time taken for the feedback, the first mode being a mode for periodically transmitting a packet including the context information and the second mode being a mode for transmitting a packet including the context information in response to the feedback indicating that a packet including the context information has been lost.Type: GrantFiled: March 15, 2011Date of Patent: September 17, 2013Assignee: Fujitsu LimitedInventors: Atsushi Yabe, Yasuhiro Yoshika, Yashushi Miyagawa, Akio Ohhashi, Isamu Fukuda, Akihiro Kobayashi, Kouichirou Higashi
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Patent number: 8521098Abstract: A receiving apparatus in a communications system that performs header compression of audio data and has a plurality of operation modes that each have a different frequency of header compression, the receiving apparatus includes: a receiver that receives the audio data, which is transmitted from a transmitting apparatus that performs the header compression; a processor that controls the receiving apparatus in accordance with the process includes: determining a voice-communication state of the received audio data; and changing the operation mode, according to a determination result.Type: GrantFiled: August 25, 2011Date of Patent: August 27, 2013Assignee: Fujitsu LimitedInventor: Atsushi Yabe
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Patent number: 8404035Abstract: An electroless copper plating solution that is favorable to improve the adhesion of a plating film and realizes uniform plating at a low temperature is characterized by containing a water-soluble nitrogen-containing polymer in an electroless copper plating solution, and preferably the above-mentioned electroless copper plating solution contains glyoxylic acid and phosphinic acid as reducing agents. The water-soluble nitrogen-containing polymer is preferably a polyacrylamide or a polyethyleneimine and, preferably, its weight average molecular weight (Mw) is at least 100,000 and Mw/Mn is 10.0 or less.Type: GrantFiled: July 30, 2004Date of Patent: March 26, 2013Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori, Yoshihisa Fujihira
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Patent number: 8394508Abstract: A plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 ??·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.Type: GrantFiled: July 18, 2008Date of Patent: March 12, 2013Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori
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Patent number: 8283051Abstract: A plated product made of a substrate having formed thereon an alloy barrier thin film for preventing copper diffusion contains metal B, which has barrier properties in relation to copper and enables displacement plating with the copper ions contained in an electroless copper plating solution, and metal A, which tends to have less ionization than metal B in an electroless copper plating solution at a pH of 10 or higher; the alloy barrier thin film for preventing copper diffusion has a composition wherein metal A constitutes between 15 and 35 at % of the atoms; and a copper thin film is formed on the alloy barrier thin film by electroless plating using an electroless copper plating solution at a pH of 10 or higher.Type: GrantFiled: July 13, 2009Date of Patent: October 9, 2012Assignee: JX Nippon Mining & Metals CorporationInventors: Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori, Yasuhiro Yamakoshi, Shinichiro Senda
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Patent number: 8247301Abstract: A substrate having, on a base material, a barrier film for preventing copper diffusion containing one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as ruthenium, rhodium, and iridium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.Type: GrantFiled: November 26, 2008Date of Patent: August 21, 2012Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori
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Patent number: 8182873Abstract: A method for metal plating with good adhesion to materials that are difficult to plate wherein a material to be plated is surface-treated with a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, surface treatment is performed with a solution containing a noble metal compound, and electroless plating is performed. Alternatively, a metal plating method is provided wherein a material to be plated is surface-treated with a liquid in which a noble metal compound and a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability have already been mixed or reacted, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, and electroless plating is performed.Type: GrantFiled: March 31, 2004Date of Patent: May 22, 2012Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Toru Imori, Junnosuke Sekiguchi, Atsushi Yabe, Yoshihisa Fujihira
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Patent number: 8163400Abstract: The present invention provides a plated article that has a thin seed layer having a uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and containing a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5at% to 40at% of the metal (A).Type: GrantFiled: July 18, 2008Date of Patent: April 24, 2012Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori
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Publication number: 20110306309Abstract: A receiving apparatus in a communications system that performs header compression of audio data and has a plurality of operation modes that each have a different frequency of header compression, the receiving apparatus includes: a receiver that receives the audio data, which is transmitted from a transmitting apparatus that performs the header compression; a processor that controls the receiving apparatus in accordance with the process includes: determining a voice-communication state of the received audio data; and changing the operation mode, according to a determination result.Type: ApplicationFiled: August 25, 2011Publication date: December 15, 2011Applicant: FUJITSU LIMITEDInventor: Atsushi YABE
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Publication number: 20110211471Abstract: This is a method for transmitting packets. The transmission method includes measuring a time taken for feedback indicating that a packet including context information has been lost; and switching between a first mode and a second mode based on the measured time taken for the feedback, the first mode being a mode for periodically transmitting a packet including the context information and the second mode being a mode for transmitting a packet including the context information in response to the feedback indicating that a packet including the context information has been lost.Type: ApplicationFiled: March 15, 2011Publication date: September 1, 2011Applicant: FUJITSU LIMITEDInventors: Atsushi YABE, Yasuhiro YOSHIKA, Yasushi MIYAGAWA, Akio OHHASHI, Isamu FUKUDA, Akihiro KOBAYASHI, Kouichirou HIGASHI
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Patent number: 7968150Abstract: It is an object of the present invention to provide a novel imidazole alcohol compound that adheres strongly to metal surfaces in metal products, especially copper, aluminum and steel products, and that has a superior rust-preventive effect even in a thin film, and a surface-treating agent using the same. The novel imidazole alcohol compound is expressed by the following general formula (1) show a rust-preventive effect. (In general formula (1), R1, R2 and R3 are each hydrogen, a vinyl group or an alkyl group with 1 to 20 carbon atoms, an aromatic ring may be formed by R2 and R3, X indicates hydrogen, an alkyl group with 1 to 6 carbon atoms, or a substituent group which may contain N or O, m indicates an integer from 0 to 20, and n and l indicate integers from 1 to 3.) The above-mentioned imidazole alcohol compound can be produced by reacting an imidazole compound and an epoxy alcohol compound.Type: GrantFiled: October 29, 2008Date of Patent: June 28, 2011Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Toru Imori, Atsushi Yabe, Junnosuke Sekiguchi
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Publication number: 20110129688Abstract: An object of the present invention is to provide a plated object having a thin seed layer of uniform thickness that enables the fabrication of ultrafine wiring thereon in which, when the seed layer is formed by electroless copper plating, the uniformity and adherence thereof are improved over the aforementioned case in which electroless copper plating is performed on an elemental metal such as tungsten, molybdenum, etc., and the aforementioned complexity of forming two layers of a barrier layer and a catalyst metal layer before forming the copper seed layer is eliminated.Type: ApplicationFiled: July 13, 2009Publication date: June 2, 2011Inventors: Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori, Yasuhiro Yamakoshi, Shinichiro Senda
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Patent number: 7867564Abstract: The object of the present invention is to provide a metal plating method by a simple process, for example, on resins on which plating has been heretofore impossible. The metal plating method involves surface treating an article to be plated with a liquid prepared by mixing or reacting in advance an organic acid salt of a silane coupling agent containing an azole in a molecule, for example, a coupling agent which is an equimolar reaction product of imidazole and ?-glycidoxypropyltrimethoxysilane, and a noble metal compound, and then conducting electroless plating thereon.Type: GrantFiled: August 5, 2003Date of Patent: January 11, 2011Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Toru Imori, Atsushi Yabe
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Publication number: 20100244259Abstract: It is an object of the present invention to provide a substrate having a barrier film for preventing copper diffusion having both a barrier function and a catalytic function, wherein the barrier properties during high-temperature heating is excellent. A substrate having, on a base material, a barrier film for preventing copper diffusion comprising one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as ruthenium, rhodium, and iridium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The said barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.Type: ApplicationFiled: November 26, 2008Publication date: September 30, 2010Inventors: Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori
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Publication number: 20100244258Abstract: It is an object of the present invention to provide a substrate having a barrier film for preventing copper diffusion having both a barrier function and a catalytic function, wherein the barrier properties during high-temperature heating is excellent. A substrate having, on a base material, a barrier film for preventing copper diffusion comprising one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as platinum, gold, silver and palladium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The said barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.Type: ApplicationFiled: November 26, 2008Publication date: September 30, 2010Inventors: Junichi Ito, Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori
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Publication number: 20100038111Abstract: The present invention provides a plated article that has a thin seed layer having uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A).Type: ApplicationFiled: July 18, 2008Publication date: February 18, 2010Inventors: Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori
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Publication number: 20100003539Abstract: The present invention provides a plated article that has a thin seed layer having uniform thickness, formed by electroless plating and allowing formation of ultrafine wiring, and that avoids the complicated formation of a bilayer of a barrier layer and a catalytic metal layer prior to forming the seed layer. The present invention also provides a method for manufacturing the plated article. The plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A).Type: ApplicationFiled: July 18, 2008Publication date: January 7, 2010Inventors: Atsushi Yabe, Junichi Ito, Yoshiyuki Hisumi, Junnosuke Sekiguchi, Toru Imori
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Publication number: 20090068364Abstract: It is an object of the present invention to provide a novel imidazole alcohol compound that adheres strongly to metal surfaces in metal products, especially copper, aluminum and steel products, and that has a superior rust-preventive effect even in a thin film, and a surface-treating agent using the same. The novel imidazole alcohol compound is expressed by the following general formula (1) show a rust-preventive effect. (In general formula (1), R1, R2 and R3 are each hydrogen, a vinyl group or an alkyl group with 1 to 20 carbon atoms, an aromatic ring may be formed by R2 and R3, X indicates hydrogen, an alkyl group with 1 to 6 carbon atoms, or a substituent group which may contain N or O, m indicates an integer from 0 to 20, and n and l indicate integers from 1 to 3.) The above-mentioned imidazole alcohol compound can be produced by reacting an imidazole compound and an epoxy alcohol compound.Type: ApplicationFiled: October 29, 2008Publication date: March 12, 2009Inventors: Toru Imori, Atsushi Yabe, Junnosuke Sekiguchi
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Publication number: 20080224313Abstract: A method for forming a seed layer for damascene copper wiring is provided. The method comprises the step of forming a seed layer, during damascene copper wiring formation, using an electroless plating solution comprising a water-soluble nitrogen-containing polymer and glyoxylic acid as a reducing agent, wherein the weight-average molecular weight (Mw) of the water-soluble nitrogen-containing polymer is 1,000 to less than 100,000. Preferably, the electroless plating solution further comprises phosphinic acid.Type: ApplicationFiled: March 13, 2008Publication date: September 18, 2008Inventors: Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori