Patents by Inventor Atsushi Yoneda

Atsushi Yoneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11356089
    Abstract: Provided is a semiconductor device with a novel structure in which the power consumption can be reduced. The semiconductor device includes a sensor, a sample-and-hold circuit to which a sensor signal of the sensor is input, an analog-digital converter circuit to which an output signal of the sample-and-hold circuit is input, a control circuit, a battery, and an antenna.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: June 7, 2022
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Seiichi Yoneda, Atsushi Miyaguchi, Tatsunori Inoue
  • Patent number: 10632666
    Abstract: A blow molding capable of maintaining the parison thickness distribution uniform, fabricating high-quality molded products, and improving its productivity. A parison supply device for supplying, to a blow mold, a parison discharged from an extrusion die, the parison supply device including: a pair of chucks for pinching, from above and below, a parison discharged downward from the extrusion die; and a chuck operation part for controlling an operation of pinching the parison by the pair of chucks and an operation of moving the pair of chucks. By the chuck operation part, the pair of chucks performs the operation of pinching the parison while being moved downward.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: April 28, 2020
    Assignee: TOYO SEIKAN CO., LTD.
    Inventors: Norihisa Hirota, Atsushi Yoneda, Kouichi Narutaki, Akihiro Usami, Eiichiro Kaneko, Takuo Yamada, Youtarou Takahashi, Ikuo Komatsu
  • Publication number: 20190039278
    Abstract: A blow molding apparatus improves productivity and obtains a high-quality molded product by supplying a good-quality parison to molds. A blow molding apparatus includes: a die head which discharges a parison; a parison supplying part which cuts the discharged parison at a preset length and conveys the cut parison; and a blow molding part in which the supplied parison is clamped between blow molds so as to perform blow molding. The parison supplying part has a pickup chuck which conveys the cut parison alternately to a first supplying position set on one of right and left sides with respect to a discharge center of the die head and a second supplying position set on the other of right and left sides with respect to the discharge center. The blow molding part performs blow molding at the blow molds arranged at the first supplying position and the second supplying position, respectively.
    Type: Application
    Filed: January 31, 2017
    Publication date: February 7, 2019
    Applicant: TOYO SEIKAN CO., LTD.
    Inventors: Kouji NAGATA, Atsushi YONEDA, Eiichiro KANEKO, Nobuhiro SASAJIMA
  • Publication number: 20170173842
    Abstract: A blow molding capable of maintaining the parison thickness distribution uniform, fabricating high-quality molded products, and improving its productivity. A parison supply device for supplying, to a blow mold, a parison discharged from an extrusion die, the parison supply device including: a pair of chucks for pinching, from above and below, a parison discharged downward from the extrusion die; and a chuck operation part for controlling an operation of pinching the parison by the pair of chucks and an operation of moving the pair of chucks. By the chuck operation part, the pair of chucks performs the operation of pinching the parison while being moved downward.
    Type: Application
    Filed: July 27, 2015
    Publication date: June 22, 2017
    Inventors: Norihisa HIROTA, Atsushi YONEDA, Kouichi NARUTAKI, Akihiro USAMI, Eiichiro KANEKO, Takuo YAMADA, Youtarou TAKAHASHI, Ikuo KOMATSU
  • Patent number: 9636865
    Abstract: A parison supply device that continuously supplies, to a blow molding die, parison sections of a parison discharged from an extrusion die, the parison section having a specified length. The parison supply device includes a plurality of tension chucks and a tension chuck operation unit that operates the plurality of tension chucks. The tension chuck operation unit causes the individual tension chucks to perform a repeated operation of grasping the parison at a first position near the extrusion die and moving to a second position separated from the extrusion die such that, before the preceding tension chuck is separated by a set distance from the extrusion die at the second position, the following tension chuck grasps the parison at the first position, and then the parison section is supplied to the blow molding die.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: May 2, 2017
    Assignee: Toyo Seikan Group Holdings, Ltd.
    Inventors: Norihisa Hirota, Ikuo Komatsu, Hiromitsu Fukuoka, Atsushi Yoneda, Kouichi Narutaki
  • Publication number: 20160039139
    Abstract: A parison supply device that continuously supplies, to a blow molding die, parison sections of a parison discharged from an extrusion die, the parison section having a specified length. The parison supply device includes a plurality of tension chucks and a tension chuck operation unit that operates the plurality of tension chucks. The tension chuck operation unit causes the individual tension chucks to perform a repeated operation of grasping the parison at a first position near the extrusion die and moving to a second position separated from the extrusion die such that, before the preceding tension chuck is separated by a set distance from the extrusion die at the second position, the following tension chuck grasps the parison at the first position, and then the parison section is supplied to the blow molding die.
    Type: Application
    Filed: April 23, 2014
    Publication date: February 11, 2016
    Applicant: Toyo Seikan Group Holdings, Ltd.
    Inventors: Norihisa HIROTA, Ikuo KOMATSU, Hiromitsu FUKUOKA, Atsushi YONEDA, Kouichi NARUTAKI
  • Patent number: 8652390
    Abstract: In supplying a predetermined amount of a molten resin D between an upper mold 10 and a lower mold 20 for compression molding, after the upper mold 10 is moved downward for a predetermined stroke length so that it approaches the lower mold 20 in which the molten resin D has been supplied, a compression load is applied while moving the lower mold 20 upward and supporting the upper mold 10 such that clamping is conducted against the compression load which has been applied to the lower mold 20. As a result, when molding a molded article in a predetermined shape by compression molding, if molds are allowed to open with a sufficient stroke length for taking a molded article out, prolongation of molding cycle can be effectively prevented, whereby a molded product in a predetermined shape can be mass-produced.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: February 18, 2014
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventor: Atsushi Yoneda
  • Publication number: 20120285534
    Abstract: A back side protective sheet disposed on a back side of a solar cell module and including a first film containing linear low-density polyethylene having a density greater than or equal to 0.91 g/cm3 and less than or equal to 0.93 g/cm3 and an inorganic ultraviolet absorbing agent; and a second film being laminated on the first film, with a urethane adhesive layer being interposed therebetween. An average particle diameter of the inorganic ultraviolet absorbing agent is greater than or equal to 0.1 ?m and less than or equal to 5 ?m. The first film contains the inorganic ultraviolet absorbing agent greater than or equal to 0.1% by mass and less than or equal to 30% by mass.
    Type: Application
    Filed: March 3, 2011
    Publication date: November 15, 2012
    Inventors: Yoshinobu Kitamori, Atsushi Yoneda, Masataka Saruwatari
  • Patent number: 8168100
    Abstract: Each of supply means 30 arranged around an extrusion port 22 of an extruder 20 supplies, while cutting a molten resin which has been extruded from the extrusion port 22 of the extruder 20 alternately in a predetermined length, the molten resin D which has been cut to a supply position which is provided at each of the supply means, and then sequentially supplies the molten resin D to each of a compression molding dies 40 which are provided in a pair with each of the supply means. As a result, in producing a synthetic resin molded article with a predetermined shape by compression molding by cutting a molten resin which has been extruded from an extruder and supplying the resin which has been cut to a compression molding die, the above-mentioned constitution can be preferably utilized for the production of a synthetic resin molded product which requires a further high load.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: May 1, 2012
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventors: Atsushi Yoneda, Yuuji Iwakiri
  • Publication number: 20110121489
    Abstract: In supplying a predetermined amount of a molten resin D between an upper mold 10 and a lower mold 20 for compression molding, after the upper mold 10 is moved downward for a predetermined stroke length so that it approaches the lower mold 20 in which the molten resin D has been supplied, a compression load is applied while moving the lower mold 20 upward and supporting the upper mold 10 such that clamping is conducted against the compression load which has been applied to the lower mold 20. As a result, when molding a molded article in a predetermined shape by compression molding, if molds are allowed to open with a sufficient stroke length for taking a molded article out, prolongation of molding cycle can be effectively prevented, whereby a molded product in a predetermined shape can be mass-produced.
    Type: Application
    Filed: February 27, 2009
    Publication date: May 26, 2011
    Applicant: TOYO SEIKAN KAISHA, LTD
    Inventor: Atsushi Yoneda
  • Patent number: 7935300
    Abstract: A manufacturing method of a resin container includes continuously supplying a base material resin forming a container body from a main extruder, discharging from a discharge portion provided in a die head a sub-material supplied from a sub-extruder so that the sub-material joins the base material resin, extruding a parison from a slit portion opened on an end side of the die head, and blow-molding the parison, thereby forming a coating layer which covers the whole or a part of the container body by using the sub-material. A thickness reducing portion in which a thickness is continuously reduced is formed in the coating layer while adjusting a resin pressure in a supply path of the sub-material fed from the sub-extruder by performing suck-back control which pulls back the sub-material from the discharge portion at an arbitrary timing when joining the sub-material with the base material resin.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: May 3, 2011
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventors: Kenjiro Tanaka, Isamu Takeda, Atsushi Yoneda, Eriko Kimotsuki
  • Patent number: 7891963
    Abstract: A manufacturing apparatus of a resin container includes a main extruder which supplies a base material resin, and a sub-extruder which supplies a sub-material. The sub-material supplied from the sub-extruder is discharged from a discharge portion provided in a die head so that the sub-material joins the base material resin continuously supplied from the main extruder. A parison is then extruded from a slit portion opened on an end side of the die head, and subjected to blow molding, thereby forming a coating layer which covers the whole or a part of a container body formed of the base material resin by using the sub-material. A suck-back mechanism which pulls back the sub-material from the discharge portion is provided between the sub-extruder and the die head, and the discharge portion is provided in the vicinity of the slit portion in-the die head.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: February 22, 2011
    Assignee: Toyo Seikan Kaisha Ltd.
    Inventors: Kenjiro Tanaka, Isamu Takeda, Atsushi Yoneda, Eriko Kimotsuki
  • Publication number: 20110001258
    Abstract: Each of supply means 30 arranged around an extrusion port 22 of an extruder 20 supplies, while cutting a molten resin which has been extruded from the extrusion port 22 of the extruder 20 alternately in a predetermined length, the molten resin D which has been cut to a supply position which is provided at each of the supply means, and then sequentially supplies the molten resin D to each of a compression molding dies 40 which are provided in a pair with each of the supply means. As a result, in producing a synthetic resin molded article with a predetermined shape by compression molding by cutting a molten resin which has been extruded from an extruder and supplying the resin which has been cut to a compression molding die, the above-mentioned constitution can be preferably utilized for the production of a synthetic resin molded product which requires a further high load.
    Type: Application
    Filed: March 17, 2009
    Publication date: January 6, 2011
    Applicant: TOYO SEIKAN KAISHA, LTD
    Inventors: Atsushi Yoneda, Yuuji Iwakiri
  • Publication number: 20090206523
    Abstract: A manufacturing method of a resin container includes continuously supplying a base material resin forming a container body from a main extruder, discharging from a discharge portion provided in a die head a sub-material supplied from a sub-extruder so that the sub-material joins the base material resin, extruding a parison from a slit portion opened on an end side of the die head, and blow-molding the parison, thereby forming a coating layer which covers the whole or a part of the container body by using the sub-material. A thickness reducing portion in which a thickness is continuously reduced is formed in the coating layer while adjusting a resin pressure in a supply path of the sub-material fed from the sub-extruder by performing suck-back control which pulls back the sub-material from the discharge portion at an arbitrary timing when joining the sub-material with the base material resin.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 20, 2009
    Applicant: TOYO SEIKAN KAISHA, LTD.
    Inventors: Kenjiro Tanaka, Isamu Takeda, Atsushi Yoneda, Eriko Kimotsuki
  • Publication number: 20090208599
    Abstract: A manufacturing apparatus of a resin container includes a main extruder which supplies a base material resin, and a sub-extruder which supplies a sub-material. The sub-material supplied from the sub-extruder is discharged from a discharge portion provided in a die head so that the sub-material joins the base material resin continuously supplied from the main extruder. A parison is then extruded from a slit portion opened on an end side of the die head, and subjected to blow molding, thereby forming a coating layer which covers the whole or a part of a container body formed of the base material resin by using the sub-material. A suck-back mechanism which pulls back the sub-material from the discharge portion is provided between the sub-extruder and the die head, and the discharge portion is provided in the vicinity of the slit portion in-the die head.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 20, 2009
    Applicant: TOYO SEIKAN KAISHA, LTD.
    Inventors: Kenjiro Tanaka, Isamu Takeda, Atsushi Yoneda, Eriko Kimotsuki
  • Publication number: 20080063823
    Abstract: In a first embodiment of the present invention, a coating layer 3 which covers a container body 2 is formed; this coating layer 3 disappears while continuously and gradually reducing its thickness in a reduction rate of 0.1 to 1.5 ?m/mm from a coating layer forming part 4 toward a coating layer non-forming part 5; and the coating layer 3 has a thickness reducing portion 6 in which a thickness reduction rate is 0.1 to 0.5 ?m/mm at least in a range of 30 mm in a height direction immediately before a part where the coating layer 3 disappears.
    Type: Application
    Filed: July 28, 2005
    Publication date: March 13, 2008
    Applicant: Toyo Seikan Kaisha, Ltd.
    Inventors: Kenjiro Tanaka, Isamu Takeda, Atsushi Yoneda, Eriko Kimotsuki
  • Patent number: 5882752
    Abstract: A wrapping pipe for a bundle of hollow fibers comprises a plastic sheet welded at its opposing edges by ultrasonics and having no difference in level of the inner surface.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: March 16, 1999
    Assignee: Nissho Corp.
    Inventor: Atsushi Yoneda