Patents by Inventor Atsuyasu MIURA

Atsuyasu MIURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10854481
    Abstract: A substrate processing method includes holding a substrate horizontally, supplying water-containing processing liquid to an upper surface of the substrate, forming a low surface tension liquid film, covering the upper surface by supplying that liquid to the substrate's upper surface, supplying a gas to a center region of the liquid film to form an opening in the center, widening the opening in order to remove the film, rotating the substrate around a predetermined rotational axis along a vertical direction, blowing, in the opening widening step, the gas toward a gas supply position that is set further inward than a peripheral edge of the opening on the upper surface of the substrate, and moving the gas supply position toward the peripheral edge of the upper surface of the substrate, and supplying, the low surface tension liquid toward a liquid landing position that is set further outward and moving the liquid landing position toward the peripheral edge of the upper surface of the substrate.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: December 1, 2020
    Inventors: Shigeki Tanizawa, Nobuyuki Miyaji, Makoto Takaoka, Naoki Sawazaki, Tsuyoshi Okumura, Atsuyasu Miura
  • Patent number: 10786836
    Abstract: A substrate processing method includes a chemical liquid supplying step of supplying a chemical liquid to a substrate, an elapsed period measuring step of measuring an after-the-end elapsed period, a recovery step of controlling the switching unit to be in a recovery guiding state, when, at a start of the chemical liquid supplying step, the after-the-end elapsed period is less than a predetermined first period, and a draining step of controlling the switching unit to be in a drain guiding state, in which the liquid led to the recovery space is led to the drain line, when, at the start of the chemical liquid supplying step, the after-the-end elapsed period is not less than the predetermined first period and then switching to the recovery guiding state based on establishment of a predetermined draining ending condition.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: September 29, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Atsuyasu Miura, Kazuhiro Fujita, Hiroki Tsujikawa, Yuya Tsuchihashi, Kenji Takemoto
  • Patent number: 10658203
    Abstract: A substrate processing apparatus includes a guard that catches liquid scattered outward from a spin chuck, a cup defining a liquid receiving groove to catch liquid that is guided downward by the guard, a guard elevating/lowering unit that moves the guard in an up/down direction, a cleaning liquid supplying unit that supplies cleaning liquid, discharged from a cleaning liquid nozzle, to the liquid receiving groove via the spin chuck and the guard, a cleaning liquid draining unit that drains the cleaning liquid in the liquid receiving groove, and a controller that controls the cleaning liquid supplying unit and the cleaning liquid draining unit to accumulate cleaning liquid in the liquid receiving groove and controls the guard elevating/lowering unit to cause a lower end portion of the cylindrical portion to be immersed in the cleaning liquid in the liquid receiving groove.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: May 19, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Hiroki Tsujikawa, Masahide Ikeda, Atsuyasu Miura, Kazuhiro Fujita, Yuya Tsuchihashi
  • Publication number: 20200144081
    Abstract: A substrate processing method includes a liquid discharging step of discharging liquid through a nozzle toward a predetermined supply region on the main surface of a substrate held on a substrate holding unit within a chamber, a humidified gas supplying step of supplying humidified gas with a humidity higher than the humidity within the chamber onto the main surface of the substrate to remove electrical charges carried on the substrate, and a spin-drying step of rotating the substrate about a predetermined rotational axis after the liquid discharging step to spin off the liquid component from the main surface of the substrate. The humidified gas supplying step is started before the start of the liquid discharging step and ended at a predetermined termination timing after the start of the liquid discharging step and before the spin-drying step.
    Type: Application
    Filed: April 17, 2018
    Publication date: May 7, 2020
    Inventors: Hiroki TSUJIKAWA, Masato TANAKA, Tsuyoshi OKUMURA, Atsuyasu MIURA, Makoto TAKAOKA, Nobuyuki MIYAJI, Kazuhiro FUJITA, Naoki SAWAZAKI, Takashi AKIYAMA, Yuya TSUCHIHASHI
  • Patent number: 10639683
    Abstract: A recover piping cleaning method is a method of cleaning a recovery piping into which a chemical liquid used for processing of a substrate is led via a processing cup, the recovery piping being arranged to lead the led chemical liquid into a predetermined chemical liquid recovery piping, the method including a piping cleaning step of cleaning the interior of the recovery piping by using a cleaning liquid by, while supplying the cleaning liquid to the recovery piping, leading the liquid led into the recovery piping into a drain piping which is different from the chemical liquid recovery piping, and a cleaning chemical liquid supplying step of, supplying the cleaning chemical liquid from a cleaning chemical liquid supply piping connected to the recovery piping to the recovery piping while leading the liquid led into the recovery piping into the drain piping.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: May 5, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yuya Tsuchihashi, Atsuyasu Miura, Hiroki Tsujikawa, Kazuhiro Fujita, Masahide Ikeda
  • Patent number: 10622225
    Abstract: The controller of a substrate processing apparatus carries out a liquid column forming step in which cleaning liquid is discharged through a lower surface nozzle when a spin chuck is not holding a substrate, to form a liquid column extending upward from the lower surface nozzle, and, in parallel with the liquid column forming step, a first dropping portion cleaning step in which an upper surface nozzle is reciprocated horizontally between a first position where a dropping portion of the upper surface nozzle does not contact the liquid column and a second position where the dropping portion of the upper surface nozzle does not contact the liquid column, so as to cause the upper surface nozzle to pass through a first middle position where the upper discharge port of the upper surface nozzle overlaps with the liquid column in a plan view.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: April 14, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Atsuyasu Miura, Masahide Ikeda, Hiroki Tsujikawa, Kazuhiro Fujita, Yuya Tsuchihashi
  • Publication number: 20190091640
    Abstract: A chemical liquid preparation method of preparing a chemical liquid for treating a film formed on a substrate, including a gas dissolving process in which an oxygen-containing gas and an inert-gas-containing gas are dissolved in the chemical liquid by supplying the oxygen-containing gas which contains oxygen gas and the inert-gas-containing gas which contains an inert gas to a chemical liquid, wherein in the gas dissolving process, a dissolved oxygen concentration in the chemical liquid is adjusted by setting a mixing ratio between the oxygen-containing gas and the inert-gas-containing gas supplied to the chemical liquid as a mixing ratio corresponding to a predetermined target dissolved oxygen concentration.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 28, 2019
    Applicant: SCREEN Holdings Co., Ltd.
    Inventors: Hajime NISHIDE, Takashi IZUTA, Takatoshi HAYASHI, Katsuhiro FUKUI, Koichi OKAMOTO, Kazuhiro FUJITA, Atsuyasu MIURA, Kenji KOBAYASHI, Sei NEGORO, Hiroki TSUJIKAWA
  • Publication number: 20190067047
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate horizontally, a processing liquid supply step of supplying a water-containing processing liquid to an upper surface of the substrate, a liquid film forming step of forming a liquid film of a low surface tension liquid, having a lower surface tension than water, that covers the upper surface by supplying the low surface tension liquid to the upper surface of the substrate to replace the processing liquid on the substrate with the low surface tension liquid, an opening forming step of supplying a gas to a center region of the liquid film to form an opening in the center region of the liquid film, an opening widening step of widening the opening in order to remove the liquid film, a substrate rotating step of rotating, in the opening widening step, the substrate around a predetermined rotational axis along a vertical direction, a gas supply position moving step of blowing, in the opening widening step, the gas toward a gas sup
    Type: Application
    Filed: July 23, 2018
    Publication date: February 28, 2019
    Inventors: Shigeki TANIZAWA, Nobuyuki MIYAJI, Makoto TAKAOKA, Naoki SAWAZAKI, Tsuyoshi OKUMURA, Atsuyasu MIURA
  • Patent number: 10199243
    Abstract: A substrate processing method is a substrate processing method which applies sequentially common etching processing which is common to each of a plurality of substrates. The common etching processing has an etching step and a high-temperature liquid discharge step. The substrate processing method further includes a piping heating step in which, of the plurality of common etching processings applied to the plurality of substrates, before the initial common etching processing, the pipe wall of the common piping is raised in temperature up to a predetermined second liquid temperature higher than a first liquid temperature and in each of the common etching processings, after each of high-temperature liquid discharge steps and before each of next etching steps, there is not performed a step in which the pipe wall of the common piping is lowered in temperature.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: February 5, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Kazuhiro Fujita, Atsuyasu Miura, Hiroki Tsujikawa, Yuya Tsuchihashi, Akihiko Taki
  • Patent number: 10186435
    Abstract: A substrate processing system includes a chemical liquid preparation unit preparing a chemical liquid to be supplied to a substrate and a processing unit which supplies the chemical liquid, prepared by the chemical liquid preparation unit, to the substrate. The chemical liquid preparation unit supplies an oxygen-containing gas, containing oxygen gas, to a TMAH-containing chemical liquid, containing TMAH (tetramethylammonium hydroxide), to make the oxygen-containing gas dissolve in the TMAH-containing chemical liquid.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: January 22, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Atsuyasu Miura, Hidekazu Ishikawa
  • Publication number: 20180207685
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate horizontally, a liquid droplet discharging step wherein liquid droplets of an organic solvent, formed by mixing the organic solvent and a gas, are discharged from a double-fluid nozzle toward a predetermined discharge region within an upper surface of the substrate, and a liquid film forming step, executed before the liquid droplet discharging step, of supplying the organic solvent to the double fluid nozzle without supplying the gas, so as to discharge the organic solvent in a continuous stream mode from the double-fluid nozzle to form a liquid film of the organic solvent covering the discharge region on the upper surface of the substrate.
    Type: Application
    Filed: March 19, 2018
    Publication date: July 26, 2018
    Inventors: Atsuyasu MIURA, Naoki SAWAZAKI
  • Publication number: 20180158698
    Abstract: A substrate processing method is a substrate processing method which applies sequentially common etching processing which is common to each of a plurality of substrates. The common etching processing has an etching step and a high-temperature liquid discharge step. The substrate processing method further includes a piping heating step in which, of the plurality of common etching processings applied to the plurality of substrates, before the initial common etching processing, the pipe wall of the common piping is raised in temperature up to a predetermined second liquid temperature higher than a first liquid temperature and in each of the common etching processings, after each of high-temperature liquid discharge steps and before each of next etching steps, there is not performed a step in which the pipe wall of the common piping is lowered in temperature.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 7, 2018
    Inventors: Kazuhiro Fujita, Atsuyasu Miura, Hiroki Tsujikawa, Yuya Tsuchihashi, Akihiko Taki
  • Patent number: 9956594
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate horizontally, a liquid droplet discharging step wherein liquid droplets of an organic solvent, formed by mixing the organic solvent and a gas, are discharged from a double-fluid nozzle toward a predetermined discharge region within an upper surface of the substrate, and a liquid film forming step, executed before the liquid droplet discharging step, of supplying the organic solvent to the double fluid nozzle without supplying the gas, so as to discharge the organic solvent in a continuous stream mode from the double-fluid nozzle to form a liquid film of the organic solvent covering the discharge region on the upper surface of the substrate.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: May 1, 2018
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Atsuyasu Miura, Naoki Sawazaki
  • Publication number: 20180085795
    Abstract: A recover piping cleaning method is a method of cleaning a recovery piping into which a chemical liquid used for processing of a substrate is led via a processing cup, the recovery piping being arranged to lead the led chemical liquid into a predetermined chemical liquid recovery piping, the method including a piping cleaning step of cleaning the interior of the recovery piping by using a cleaning liquid by, while supplying the cleaning liquid to the recovery piping, leading the liquid led into the recovery piping into a drain piping which is different from the chemical liquid recovery piping, and a cleaning chemical liquid supplying step of, supplying the cleaning chemical liquid from a cleaning chemical liquid supply piping connected to the recovery piping to the recovery piping while leading the liquid led into the recovery piping into the drain piping.
    Type: Application
    Filed: September 20, 2017
    Publication date: March 29, 2018
    Inventors: Yuya TSUCHIHASHI, Atsuyasu MIURA, Hiroki TSUJIKAWA, Kazuhiro FUJITA, Masahide IKEDA
  • Publication number: 20180061678
    Abstract: The controller of a substrate processing apparatus carries out a liquid column forming step in which cleaning liquid is discharged through a lower surface nozzle when a spin chuck is not holding a substrate, to form a liquid column extending upward from the lower surface nozzle, and, in parallel with the liquid column forming step, a first dropping portion cleaning step in which an upper surface nozzle is reciprocated horizontally between a first position where a dropping portion of the upper surface nozzle does not contact the liquid column and a second position where the dropping portion of the upper surface nozzle does not contact the liquid column, so as to cause the upper surface nozzle to pass through a first middle position where the upper discharge port of the upper surface nozzle overlaps with the liquid column in a plan view.
    Type: Application
    Filed: August 7, 2017
    Publication date: March 1, 2018
    Inventors: Atsuyasu MIURA, Masahide IKEDA, Hiroki TSUJIKAWA, Kazuhiro FUJITA, Yuya TSUCHIHASHI
  • Publication number: 20180029089
    Abstract: A substrate processing method includes a chemical liquid supplying step of supplying a chemical liquid to a substrate, an elapsed period measuring step of measuring an after-the-end elapsed period, a recovery step of controlling the switching unit to be in a recovery guiding state, when, at a start of the chemical liquid supplying step, the after-the-end elapsed period is less than a predetermined first period, and a draining step of controlling the switching unit to be in a drain guiding state, in which the liquid led to the recovery space is led to the drain line, when, at the start of the chemical liquid supplying step, the after-the-end elapsed period is not less than the predetermined first period and then switching to the recovery guiding state based on establishment of a predetermined draining ending condition.
    Type: Application
    Filed: July 21, 2017
    Publication date: February 1, 2018
    Inventors: Atsuyasu MIURA, Kazuhiro FUJITA, Hiroki TSUJIKAWA, Yuya TSUCHIHASHI, Kenji TAKEMOTO
  • Publication number: 20180025922
    Abstract: A substrate processing apparatus includes a guard that catches liquid scattered outward from a spin chuck, a cup defining a liquid receiving groove to catch liquid that is guided downward by the guard, a guard elevating/lowering unit that moves the guard in an up/down direction, a cleaning liquid supplying unit that supplies cleaning liquid, discharged from a cleaning liquid nozzle, to the liquid receiving groove via the spin chuck and the guard, a cleaning liquid draining unit that drains the cleaning liquid in the liquid receiving groove, and a controller that controls the cleaning liquid supplying unit and the cleaning liquid draining unit to accumulate cleaning liquid in the liquid receiving groove and controls the guard elevating/lowering unit to cause a lower end portion of the cylindrical portion to be immersed in the cleaning liquid in the liquid receiving groove.
    Type: Application
    Filed: July 13, 2017
    Publication date: January 25, 2018
    Inventors: Hiroki TSUJIKAWA, Masahide IKEDA, Atsuyasu MIURA, Kazuhiro FUJITA, Yuya TSUCHIHASHI
  • Publication number: 20170294323
    Abstract: A substrate processing system includes a chemical liquid preparation unit preparing a chemical liquid to be supplied to a substrate and a processing unit which supplies the chemical liquid, prepared by the chemical liquid preparation unit, to the substrate. The chemical liquid preparation unit supplies an oxygen-containing gas, containing oxygen gas, to a TMAH-containing chemical liquid, containing TMAH (tetramethylammonium hydroxide), to make the oxygen-containing gas dissolve in the TMAH-containing chemical liquid.
    Type: Application
    Filed: June 22, 2017
    Publication date: October 12, 2017
    Inventors: Atsuyasu MIURA, Hidekazu ISHIKAWA
  • Patent number: 9687887
    Abstract: A substrate processing apparatus includes a substrate holding means that holds a substrate horizontally, a substrate rotating means that rotates a substrate held by the substrate holding means about a vertical rotation axis passing through the substrate, a discharging member that discharges a processing liquid toward the substrate, and a high-temperature processing liquid pipe that supplies a processing liquid of a temperature higher than that of the discharging member to the flow passage. The discharging member includes a plurality of discharge ports respectively disposed at a plurality of positions different in distance from the rotation axis and a flow passage connected sequentially to the plurality of discharge ports in order from outside to inside. The discharging member discharges a processing liquid supplied from the flow passage to the plurality of discharge ports from the plurality of discharge ports toward the substrate.
    Type: Grant
    Filed: March 26, 2013
    Date of Patent: June 27, 2017
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Atsuyasu Miura
  • Publication number: 20160184870
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate horizontally, a liquid droplet discharging step of making liquid droplets of an organic solvent, formed by mixing the organic solvent and a gas, be discharged from a double-fluid nozzle toward a predetermined discharge region within an upper surface of the substrate, and a liquid film forming step, executed before the liquid droplet discharging step, of supplying the organic solvent to the double fluid nozzle without supplying the gas to discharge the organic solvent in a continuous stream mode from the double-fluid nozzle to form a liquid film of the organic solvent covering the discharge region on the upper surface of the substrate.
    Type: Application
    Filed: December 22, 2015
    Publication date: June 30, 2016
    Inventors: Atsuyasu MIURA, Naoki SAWAZAKI