Abstract: A wire-less inductive device and methods of manufacturing and use are disclosed. In one embodiment, the inductive device comprises a plurality of through-hole vias which act to replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a plurality of connection elements disposed or formed within channels which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices is disclosed. In a third aspect of the invention, an electronics assembly and circuit comprising the wire-less inductive devices are disclosed.

Abstract: An advanced modular plug connector assembly incorporating a substrate disposed in the rear portion of the connector housing, the substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. In one embodiment, the connector assembly comprises a single port pair with a single substrate disposed in the rear portion of the housing. In another embodiment, the assembly comprises a multi-port “row-and-column” housing with multiple substrates (one per port) received within the rear of the housing, each substrate having signal conditioning electronics which condition the input signal received from the corresponding modular plug before egress from the connector assembly. In yet another embodiment, the connector assembly comprises an indicator assembly having a plurality of optically transmissive conduits, the assembly being disposed largely outside the external noise shield of the connector and removable therefrom.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

Abstract: An advanced multi-connector electronic assembly incorporating a variety of different noise shield elements which reduce noise interference and increase performance. In one embodiment, the connector assembly comprises a plurality of connectors with associated electronic components arranged in two parallel rows, one disposed atop the other such that modular plug recesses of all connectors are accessible by the user. The assembly utilizes a substrate shield which mitigates noise transmission through the bottom surface of the assembly, as well as an external “wrap-around shield to mitigate noise transmission through the remaining external surfaces.

Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.

Abstract: An advanced shielded modular plug connector assembly incorporating a removable insert assembly disposed in the connector housing, the insert assembly adapted to optionally receive one or more electronic components. In one exemplary embodiment, the connector assembly comprises a single port connector with integral shielded housing and dual-substrate insert assembly. The housing is advantageously formed using a metal casting process which inherently shields the connector (and exterior environment) from EMI and other noise while allowing for a reduced housing profile. In another embodiment, a plurality of light sources are disposed within (and shielded by) the metallic housing. In yet another embodiment, the connector assembly comprises a multi-port “1×N” device. In yet another embodiment, a bail mechanism is provided to permit easy insertion/removal of the connector assembly from an external structure such as a rack or enclosure. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: An improved connector assembly for use on, inter alia, a printed circuit board or other device is disclosed. The assembly comprises a connector housing having one or more modular plug recesses for receiving a modular plug such as an RJ-type plug; a plurality of conductors disposed within the recess for contact with the terminals of the modular plug; and an electrical pathway between the conductors and a corresponding set of circuit board leads. The connector assembly also includes at least one other recess for receiving a light source sub-assembly. Each light source sub-assembly provides one or more light sources (e.g., light-emitting diodes) adapted to permit viewing of status indications during operation. Each light source sub-assembly is constructed to substantially reduce electromagnetic coupling between the light source and the connector's signal paths. The light source sub-assembly further simplifies the manufacturing of the connector assembly.

Abstract: An advanced modular plug connector assembly incorporating a substrate disposed in the rear portion of the connector housing, the substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. In one embodiment, the connector assembly comprises a single port pair with a single substrate disposed in the rear portion of the housing. In another embodiment, the assembly comprises a multi-port “row-and-column” housing with multiple substrates (one per port) received within the rear of the housing, each substrate having signal conditioning electronics which condition the input signal received from the corresponding modular plug before egress from the connector assembly. In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: An advanced modular plug connector assembly incorporating a substantially planar, low profile removable insert assembly with associated substrate disposed in the rear portion of the connector housing, the substrate adapted to optionally receive one or more electronic components. In one embodiment, the connector assembly comprises a single port with a single insert assembly. The conductors and terminals of the connector are retained within respective molded carriers which are received within the insert assembly. A plurality of light sources (e.g., LEDs) are also received within the housing, the conductors of the LEDs mated with conductive traces on the substrate of the insert assembly. In another embodiment, the connector assembly comprises a multi-port “1×N” device. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: A device for electrically interconnecting and packaging electronic components and method for manufacturing the device. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices.

Abstract: An advanced modular plug connector assembly incorporating a substrate disposed in the rear portion of the connector housing, the substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. In one embodiment, the connector assembly comprises a single port pair with a single substrate disposed in the rear portion of the housing. In another embodiment, the assembly comprises a multi-port “row-and-column” housing with multiple substrates (one per port) received within the rear of the housing, each substrate having signal conditioning electronics which condition the input signal received from the corresponding modular plug before egress from the connector assembly. In yet another embodiment, the connector assembly comprises an indicator assembly having a plurality of optically transmissive conduits, the assembly being disposed largely outside the external noise shield of the connector and removable therefrom.

Abstract: An advanced shielded modular plug connector assembly incorporating a removable insert assembly disposed in the connector housing, the insert assembly adapted to optionally receive one or more electronic components. In one exemplary embodiment, the connector assembly comprises a single port connector with integral shielded housing and dual-substrate insert assembly. The housing is advantageously formed using a metal casting process which inherently shields the connector (and exterior environment) from EMI and other noise while allowing for a reduced housing profile. In another embodiment, a plurality of light sources are disposed within (and shielded by) the metallic housing. In yet another embodiment, the connector assembly comprises a multi-port “I×N” device. In yet another embodiment, a bail mechanism is provided to permit easy insertion/removal of the connector assembly from an external structure such as a rack or enclosure.

Abstract: An advanced modular plug connector assembly incorporating a substantially planar, low profile removable insert assembly with associated substrate disposed in the rear portion of the connector housing, the substrate adapted to optionally receive one or more electronic components. In one embodiment, the connector assembly comprises a single port with a single insert assembly. The conductors and terminals of the connector are retained within respective molded carriers which are received within the insert assembly. A plurality of light sources (e.g., LEDs) are also received within the housing, the conductors of the LEDs mated with conductive traces on the substrate of the insert assembly. In another embodiment, the connector assembly comprises a multi-port “1×N” device. Methods for manufacturing the aforementioned embodiments are also disclosed.

Abstract: An improved connector assembly for use on, inter alia, a printed circuit board or other device is disclosed. The assembly comprises a connector housing having one or more modular plug recesses for receiving a modular plug such as an RJ-type plug; a plurality of conductors disposed within the recess for contact with the terminals of the modular plug; and an electrical pathway between the conductors and a corresponding set of circuit board leads. The connector assembly also includes at least one other recess for receiving a light source sub-assembly. Each light source sub-assembly provides one or more light sources (e.g., light-emitting diodes) adapted to permit viewing of status indications during operation. Each light source sub-assembly is constructed to substantially reduce electromagnetic coupling between the light source and the connector's signal paths. The light source sub-assembly further simplifies the manufacturing of the connector assembly.

Abstract: An advanced multi-connector electronic assembly incorporating different noise shield elements which reduce noise interference and increase performance. In one embodiment, the connector assembly comprises a plurality of connectors with associated electronic components arranged in two parallel rows, one disposed atop the other. The assembly utilizes a substrate shield which mitigates noise transmission through the bottom surface of the assembly, as well as an external “wrap-around shield to mitigate noise transmission through the remaining external surfaces. In a second embodiment, the connector assembly further includes a top-to-bottom shield interposed between the top and bottom rows of connectors to reduce noise transmission between the rows of connectors, and a plurality of front-to-back shield elements disposed between the electronic components of respective top and bottom row connectors to limit transmission between the electronic components. A method of manufacturing the assembly is also disclosed.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

Abstract: An advanced multi-connector electronic assembly incorporating different noise shield elements which reduce noise interference and increase performance. In one embodiment, the connector assembly comprises a plurality of connectors with associated electronic components arranged in two parallel rows, one disposed atop the other. The assembly utilizes a substrate shield which mitigates noise transmission through the bottom surface of the assembly, as well as an external “wrap-around shield to mitigate noise transmission through the remaining external surfaces. In a second embodiment, the connector assembly further includes a top-to-bottom shield interposed between the top and bottom rows of connectors to reduce noise transmission between the rows of connectors, and a plurality of front-to-back shield elements disposed between the electronic components of respective top and bottom row connectors to limit transmission between the electronic components. A method of manufacturing the assembly is also disclosed.

Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.

Abstract: A device for electrically interconnecting and packaging electronic components and method for manufacturing the device. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices.

Abstract: A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices.