Patents by Inventor Austin H. Lesea

Austin H. Lesea has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10573598
    Abstract: An example integrated circuit (IC) package includes: a processing system and a programmable IC disposed on a substrate, the processing system coupled to the programmable IC through interconnect of the substrate; the processing system including components coupled to a ring interconnect, the components including a processor and an interface controller. The programmable IC includes: an interface endpoint coupled to the interface controller through the interconnect; and at least one peripheral coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 25, 2020
    Assignee: XILINX, INC.
    Inventors: Austin H. Lesea, Sundararajarao Mohan, Stephen M. Trimberger
  • Patent number: 10476598
    Abstract: Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations, an apparatus includes a package substrate and f first interposer mounted on the package substrate. The apparatus also includes a logic circuit and an optical interface circuit connected to the logic circuit via the first interposer. One of the optical interface circuit or the logic circuit is mounted on the first interposer. The optical interface circuit includes a driver circuit configured to receive electronic data signals from the logic circuit. The optical interface circuit also includes an optical transmitter circuit coupled to the driver circuit and configured to output optical data signals encoding the electronic data signals.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: November 12, 2019
    Assignee: XILINX, INC.
    Inventors: Austin H. Lesea, Stephen M. Trimberger
  • Patent number: 10282326
    Abstract: An integrated circuit is provided for obtaining interrupt performance metrics. The integrated circuit includes a microprocessor executing an interrupt service routing monitoring framework that includes an interrupt handler and an application programming interface. The interrupt handler executes in response to a trigger condition and obtains timing data that includes at least one sample of a value of a timing logic according to a sampling schedule. The API exposes interrupt configuration functionality for registering the interrupt handler with a supervisory program and for configuring the interrupt handler to obtain the timing data.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: May 7, 2019
    Assignee: XILINX, INC.
    Inventors: Yi-Hua E. Yang, Patrick Lysaght, Austin H. Lesea, Graham F. Schelle, Paul R. Schumacher
  • Publication number: 20190096813
    Abstract: An example integrated circuit (IC) package includes: a processing system and a programmable IC disposed on a substrate, the processing system coupled to the programmable IC through interconnect of the substrate; the processing system including components coupled to a ring interconnect, the components including a processor and an interface controller. The programmable IC includes: an interface endpoint coupled to the interface controller through the interconnect; and at least one peripheral coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.
    Type: Application
    Filed: September 28, 2017
    Publication date: March 28, 2019
    Applicant: Xilinx, Inc.
    Inventors: Austin H. Lesea, Sundararajarao Mohan, Stephen M. Trimberger
  • Patent number: 10147666
    Abstract: A method and apparatus are provided that includes an electronic device, a chip package and a method for cooling a chip package in an electronic device. In one example, the chip package includes an interposer or package substrate having a first IC die and a second IC die mounted thereon. The second IC die has a maximum safe operating temperature that is greater than a maximum safe operating temperature of the first IC die. An indicia is disposed on the chip package. The indicia designates an installation orientation of the interposer or package substrate which positions the first IC die upstream of the second IC die relative to a direction of cooling fluid flow.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: December 4, 2018
    Assignee: XILINX, INC.
    Inventors: Stephen M. Trimberger, Austin H. Lesea
  • Patent number: 10054806
    Abstract: Systems and methods therefor relating generally to electro-absorption modulation are disclosed. In a system thereof, a waveguide is for propagating an optical signal. A segmented electro-absorption modulator (“SEAM”) includes: a segmented anode having at least two anode segments spaced apart from one another alongside a first side of the waveguide; and a segmented cathode having at least two cathode segments spaced apart from one another alongside a second side of the waveguide corresponding to the at least two anode segments.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: August 21, 2018
    Assignee: XILINX, INC.
    Inventors: Sen Lin, Kun-Yung Chang, Austin H. Lesea
  • Patent number: 10042131
    Abstract: Embodiments herein describe techniques for testing or aligning optical components in a photonic chip using a grating coupler. In one embodiment, the photonic chip may include an edge coupler and a grating coupler for optically coupling the photonic chip to external fiber optic cables. The edge coupler may be disposed on a side or edge of the photonic chip while the grating coupler is located on a top or side of the photonic chip. During fabrication, the edge coupler may be inaccessible. Instead of using the edge coupler to test the photonic chip, a testing apparatus can use the grating coupler along with a splitter to transfer optical test signals between an optical component in the photonic chip (e.g., a modulator or detector) and a test probe optically coupled to the grating coupler.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: August 7, 2018
    Assignee: XILINX, INC.
    Inventor: Austin H. Lesea
  • Patent number: 10038503
    Abstract: In an adaptation module relating generally to adaptive optical channel compensation, an analysis module is coupled to receive a first data signal and a second data signal and coupled to provide first information and second information. A comparison module is coupled to compare the first information and the second information to provide third information. An adjustment module is coupled to receive the third information to provide fourth information to compensate for distortion in the second data signal with reference to the first data signal. The second data signal is associated with a conversion of the first data signal to an optical signal for communication via an optical channel.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: July 31, 2018
    Assignee: XILINX, INC.
    Inventors: Austin H. Lesea, Stephen M. Trimberger
  • Patent number: 10038647
    Abstract: A circuit for routing data between die of an integrated circuit is described. The circuit comprises differential transmitter and receiver pairs of different integrated circuit die that are coupled together by differential transmission lines. A separate differential transmitter associated with the first die of the integrated circuit and a separate differential receiver associated with the second die of the integrated circuit are configured to transmit data day way of the differential transmission lines associated with the differential transmitter and receiver pairs.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: July 31, 2018
    Assignee: XILINX, INC.
    Inventor: Austin H. Lesea
  • Patent number: 10014949
    Abstract: Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations an optical communication device includes an optical data port configured to support an optical fiber in a fixed position. The optical communication device may further include a plurality of optical communication circuits, each oriented to communicate optical signals at a respective position of a cross section of the optical fiber connected to the optical data port and a control circuit, responsive to optical signals communicated on the optical fiber connected to the optical data port and configured to determine ones of the plurality of optical communication circuits that are misaligned with the optical fiber and disable the determined ones of the plurality of optical communication circuits.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: July 3, 2018
    Assignee: XILINX, INC.
    Inventors: Stephen M. Trimberger, Austin H. Lesea
  • Publication number: 20180129082
    Abstract: Systems and methods therefor relating generally to electro-absorption modulation are disclosed. In a system thereof, a waveguide is for propagating an optical signal. A segmented electro-absorption modulator (“SEAM”) includes: a segmented anode having at least two anode segments spaced apart from one another alongside a first side of the waveguide; and a segmented cathode having at least two cathode segments spaced apart from one another alongside a second side of the waveguide corresponding to the at least two anode segments.
    Type: Application
    Filed: November 8, 2016
    Publication date: May 10, 2018
    Applicant: Xilinx, Inc.
    Inventors: Sen Lin, Kun-Yung Chang, Austin H. Lesea
  • Patent number: 9941880
    Abstract: A system includes an integrated circuit (IC) chip with connections to plurality of external pins. An integrated voltage regulator circuit is configured to provide an internal supply voltage to the IC chip. Isolation circuitry is configured to inhibit tampering of the internal supply voltage through the external pins. An analog to digital converter (ADC) circuit is configured to monitor parameters of the internal supply voltage. Security circuitry is configured to detect, using the monitored parameters, indications of tampering and to generate an error signal in response to detecting an indication of tampering.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: April 10, 2018
    Assignee: XILINX, INC.
    Inventors: Austin H. Lesea, Stephen M. Trimberger
  • Patent number: 9933639
    Abstract: Systems, and related methods, relating generally to electro-absorption modulation are described. In a system therefor, there is a waveguide. A photodetector is configured with respect to the waveguide for detecting luminous intensity of an optical signal. An electro-absorption modulator is configured with respect to the waveguide for electro-absorption modulation of the optical signal. An integrated heating element is located alongside and spaced apart from both the photodetector and the electro-absorption modulator. the integrated heating element is configured for controllably heating the photodetector and the electro-absorption modulator.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: April 3, 2018
    Assignee: XILINX, INC.
    Inventors: Sen Lin, Kun-Yung Chang, Austin H. Lesea
  • Patent number: 9935733
    Abstract: A method of enabling a communication channel between a first communication circuit and a second communication circuit is described. The method comprises establishing a communication link according to a communication protocol between the first communication circuit and the second communication circuit, wherein the communication protocol enables the transmission of data between the first communication circuit and the second communication circuit at a standardized data rate; determining a standardized data rate for which the communication link between the first communication circuit and the second communication circuit fails to meet a predetermined quality threshold; and establishing a communication link according to the communication protocol at a non-standardized data rate below the determined standardized data rate.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: April 3, 2018
    Assignee: XILINX, INC.
    Inventor: Austin H. Lesea
  • Patent number: 9847323
    Abstract: In an example, an IC package includes a package substrate including a plurality of bumps configured for coupling to a printed circuit board, the package substrate including a core disposed between a plurality of top-side conductive layers and a plurality of bottom-side conductive layers. The IC package further includes an IC die coupled to the package substrate and disposed on top of the plurality of top-side conductive layers. The IC die further includes a voltage regulator IC die disposed on the package substrate adjacent to the IC die, the voltage regulator IC die being coupled to the IC die using two of four top-most layers of the plurality of top-side conductive layers nearest the IC die.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: December 19, 2017
    Assignee: XILINX, INC.
    Inventor: Austin H. Lesea
  • Patent number: 9804207
    Abstract: An integrated circuit (IC) is located on an IC chip and includes an integrated voltage regulator circuit that provides an internal supply voltage to the IC. A test mode signal can be received from an external pin of the IC chip. In response to the test mode signal, the IC can enter a test mode where the internal supply voltage is provided to components of the IC. Also in the test mode, voltage characteristics of the internal supply voltage are measured to produce an analog held value. The measurements occur in an analog domain and over a plurality of sample-and-hold windows. Upon completion of a measurement window, the analog held is converted to a digital value. The digital value is then stored in a memory circuit. The digital value is provided from the memory circuit to a reader device external to the IC.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: October 31, 2017
    Assignee: XILINX, INC.
    Inventor: Austin H. Lesea
  • Patent number: 9525423
    Abstract: A device comprises a semiconductor substrate, a programmable logic device on the semiconductor substrate, a power distribution network comprising at least one voltage regulator on the semiconductor substrate, and a power management bus for communication between the at least one voltage regulator and the programmable logic device. The programmable logic device comprises a processing module configured to perform a diagnostic analysis of the power distribution network.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: December 20, 2016
    Assignee: XILINX, INC.
    Inventor: Austin H. Lesea
  • Patent number: 9520949
    Abstract: Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations an optical transmitter includes an optical data port configured to engage an optical fiber. The optical transmitter also includes a plurality of lasers coupled to the optical data port and configured and arranged to transmit respective optical signals over the optical fiber via the optical data port when selected. A control circuit of the optical transmitter is configured to receive an input data signal and encode the input data signal for transmission over the optical fiber by selecting one or more of the plurality of lasers at a time. The control circuit is configured to select one or more of the plurality of lasers at a time according to one of a frequency modulation encoding algorithm or an amplitude modulation encoding algorithm.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: December 13, 2016
    Assignee: XILINX, INC.
    Inventors: Stephen M. Trimberger, Austin H. Lesea
  • Patent number: 9444618
    Abstract: Circuits and methods are disclosed for defending against attacks on ring oscillator-based physically unclonable functions (RO PUFs). A control circuit that is coupled to the RO PUF is configured to detect out-of-tolerance operation of the RO PUF. In response to detecting out-of-tolerance operation of the RO PUF, the control circuit disables the RO PUF, and in response to detecting in-tolerance operation, the control circuit enables the RO PUF.
    Type: Grant
    Filed: April 22, 2013
    Date of Patent: September 13, 2016
    Assignee: XILINX, INC.
    Inventors: Stephen M. Trimberger, Austin H Lesea
  • Patent number: 9432121
    Abstract: Various apparatuses, circuits, systems, and methods for optical communication are disclosed. In some implementations, an apparatus includes a package substrate and f first interposer mounted on the package substrate. The apparatus also includes a logic circuit and an optical interface circuit connected to the logic circuit via the first interposer. One of the optical interface circuit or the logic circuit is mounted on the first interposer. The optical interface circuit includes a driver circuit configured to receive electronic data signals from the logic circuit. The optical interface circuit also includes an optical transmitter circuit coupled to the driver circuit and configured to output optical data signals encoding the electronic data signals.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: August 30, 2016
    Assignee: XILINX, INC.
    Inventors: Austin H. Lesea, Stephen M. Trimberger