Abstract: A system comprises a first mechanism configured to hold a first block including a plurality of lenses located on or near a first surface of the first block. The plurality of lenses are configured to receive light to generate a plurality of light spots at or near a second surface of the first block opposite the first surface. The system includes a second mechanism configured to hold a second block including a plurality of waveguides, and to move the second block to bring the plurality of waveguides in alignment with the plurality of lenses using the plurality of light spots as alignment marks.

Abstract: Embodiments are disclosed for providing a silicon photonics collimator for wafer level assembly. An example apparatus includes a silicon photonics (SiP) device and a micro-optical passive element. The SiP device comprises a set of optical waveguides. The micro-optical passive element is mounted on an edge of a cavity etched into a silicon surface of the SiP device. Furthermore, the micro-optical passive element is configured to direct optical signals between the set of optical waveguides and an external optical element.

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Abstract: A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation.

Abstract: A system comprises a first mechanism configured to hold a first block including a plurality of lenses located on or near a first surface of the first block. The plurality of lenses are configured to receive light to generate a plurality of light spots at or near a second surface of the first block opposite the first surface. The system includes a second mechanism configured to hold a second block including a plurality of waveguides, and to move the second block to bring the plurality of waveguides in alignment with the plurality of lenses using the plurality of light spots as alignment marks.

Abstract: Embodiments are disclosed for providing a silicon photonics collimator for wafer level assembly. An example apparatus includes a silicon photonics (SiP) device and a micro-optical passive element. The SiP device comprises a set of optical waveguides. The micro-optical passive element is mounted on an edge of a cavity etched into a silicon surface of the SiP device. Furthermore, the micro-optical passive element is configured to direct optical signals between the set of optical waveguides and an external optical element.

Abstract: An optical device includes a chip, a set of waveguides on the chip and configured to carry first optical signals modulated with data during a data transmission stage, and an alignment waveguide on the chip. The alignment waveguide is configured to receive a second optical signal during an alignment stage that aligns the set of waveguides with a collimator including a set of lenses. The alignment waveguide is configured to output the second optical signal from the chip. The second optical signal output from the chip is indicative of a quality of alignment between the set of waveguides and the collimator.

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Abstract: A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation.

Abstract: One embodiment includes an optical connection apparatus, including an optical cable, and a fiber-attach-latch connector terminating the optical cable, and comprising a connector housing including a latch element, the connector housing being configured to be reversibly inserted into a connector receptable of an optical module having an optical transceiver, and a connector boot connected to the connector housing and disposed around a part of the optical cable, wherein at least part of the connector housing is formed from radio-frequency (RF) electromagnetic (EM) radiation absorbing material configured to absorb RF EM interference generated by the optical module.

Abstract: A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: One embodiment includes an optical connection apparatus, including an optical cable, and a fiber-attach-latch connector terminating the optical cable, and comprising a connector housing including a latch element, the connector housing being configured to be reversibly inserted into a connector receptable of an optical module having an optical transceiver, and a connector boot connected to the connector housing and disposed around a part of the optical cable, wherein at least part of the connector housing is formed from radio-frequency (RF) electromagnetic (EM) radiation absorbing material configured to absorb RF EM interference generated by the optical module.

Abstract: An apparatus includes, an Integrated Circuit (IC), first electrical connections and second electrical connections. The IC is mounted on a substrate and is configured to exchange one or more communication signals with one or more electro-optical transducers, and to exchange one or more control signals with external circuitry. The first electrical connections extend from the IC on a plane parallel to the substrate, and are configured to conduct the communication signals. The second electrical connections extend from the IC on one or more planes not parallel to the substrate, and are configured to conduct the control signals.

Abstract: Optical apparatus connecting a Silicon Photonics (SiP) device, which comprises multiple optical waveguides to an array of collimating lenses, configured to collimate light of the multiple optical waveguides into collimated beams. The optical apparatus includes a deflection element, distinct from the SiP device, including a light deflection surface which deflects light from the waveguides by an angle greater than 30 degrees, to the array of collimating lenses.

Abstract: An apparatus includes, an Integrated Circuit (IC), first electrical connections and second electrical connections. The IC is mounted on a substrate and is configured to exchange one or more communication signals with one or more electro-optical transducers, and to exchange one or more control signals with external circuitry. The first electrical connections extend from the IC on a plane parallel to the substrate, and are configured to conduct the communication signals. The second electrical connections extend from the IC on one or more planes not parallel to the substrate, and are configured to conduct the control signals.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.

Abstract: In various embodiments, an illumination apparatus includes an air gap between a sub-assembly and a waveguide attached thereto at a plurality of discrete attachment points, as well as a bare-die light-emitting diode encapsulated by the waveguide.