Abstract: A device is provided that comprises a metallic substrate defining a plurality of openings, the openings having a first area. The openings form one or more heat dissipating elements having a second area. The device comprises a plurality of sites on a surface of the one or more heat dissipating elements. Each site is configured to receive a light emitting element. The device comprises a plurality of conductor elements having a third area. The conductor elements are physically separated from the one or more heat dissipating elements by the openings. The conductor elements are configured to enable electrical connections to the light emitting elements and are electrically isolated from the one or more heat dissipating elements.

Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.

Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.

Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.

Abstract: A device is provided that comprises a metallic substrate defining a plurality of openings, the openings having a first area. The openings form one or more heat dissipating elements having a second area. The device comprises a plurality of sites on a surface of the one or more heat dissipating elements. Each site is configured to receive a light emitting element. The device comprises a plurality of conductor elements having a third area. The conductor elements are physically separated from the one or more heat dissipating elements by the openings. The conductor elements are configured to enable electrical connections to the light emitting elements and are electrically isolated from the one or more heat dissipating elements.

Abstract: An electronic device is described. The electronic device includes a body having a first surface and a second surface opposite the first surface. The first surface of the body is a first surface of the electronic the device. The electronic device also has a second surface opposite the first surface. A metal pattern is disposed on the second surface of the electronic device. The metal pattern includes a first electrode, a second electrode, and at least two thermal pads. The at least two thermal pads are electrically isolated from the first electrode and the second electrode, are located along opposite sides of the second surface of the electronic device, and have substantially identical shapes.

Abstract: A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.

Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.

Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.

Abstract: Cathode and anode electrodes are located on the bottom surface of an LED submount along a center line of the bottom surface. Two thermal pads are located on either side of the electrodes along opposite sides of the bottom surface. This configuration results in less stress on solder bonding the electrodes to a circuit board. Further, since the heat conducted by the two thermal pads is not choked by the electrodes, the heat spreads more uniformly into the circuit board. Further, since the metal design is symmetrical in that the outer thermal pads are identical, the molten solder will have the same shape over both thermal pads, causing the LED die and submount to be not tilted with respect to the surface of the circuit board. Other configurations are described that also improve the thermal and electrical characteristics of the LED die.

Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.

Abstract: A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.

Abstract: A method renews data in a flash memory which is organized in memory units and whose memory units which have been written to are error-protected using ECC words. The memory units which have been written to are test-read in regularly activated test-reading cycles, and either individual memory units which have been written to or all memory units which have been written to are renewed on the basis of the ECC error states which have occurred in a test-reading cycle.

Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

Abstract: A method renews data in a flash memory which is organized in memory units and whose memory units which have been written to are error-protected using ECC words. The memory units which have been written to are test-read in regularly activated test-reading cycles, and either individual memory units which have been written to or all memory units which have been written to are renewed on the basis of the ECC error states which have occurred in a test-reading cycle.

Abstract: Data bits are programmed in cells of a flash memory which is divided into a multiplicity of separately erasable physical blocks, which are in turn split into individual physical pages to which the data bits can be written. The data bits are held in multilevel cells that store one lower bit and one upper bit per cell. The four states of which are distinguished by three voltage threshold values. The lower states are associated with the lower bit and the upper states are associated with the upper bit. The pages are distinguished by lower pages allocated to the lower bits, and upper pages allocated to the upper bits. Lower and upper pages which contain the same cells are combined by a pairing table to form paired pages. Reliable storage of data bits is achieved by programming paired pages with the same data bits and listing them as reliable paired pages in management data for the flash memory.

Abstract: An apparatus and a method for correcting data errors in a data block. The data block contains original data which are supplemented by such a security syndrome that the data block effects a correction of at most t data errors, wherein a parallel-operating quick corrector is used. The quick corrector is only designed for a correction of a subset t1 of the set of the at most t data errors, and the quick corrector includes a test encoder, which sets a first test state flag P1 which, in the event of a complete correction of a processed data block, outputs this data block and secondly activates a series-operating post-corrector for at most t data errors. The output signal of the post-corrector is output as an alternative.

Abstract: The invention relates to an adjustment method, especially for adjusting optical or fiber optical components. According to an embodiment of the invention, a first adjustment process is carried out in which, after a cooling process, the regions of the actuator in which the tensile stresses or compressive strains are frozen following the cooling process are brought to a critical temperature in relation to the operational temperature range of the actuator, at least until the flow processes of the material at said critical temperature are largely completed. A second adjustment process is then carried out.