Patents by Inventor Ayako FUSE

Ayako FUSE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10829587
    Abstract: An epoxy resin composition produces a cured product having improved elastic modulus and improved nominal strain at compressive fracture. The epoxy resin composition is a fiber-reinforced composite material having excellent compression strength and interlayer toughness. The epoxy resin composition contains at least the following constituent components [A], [B] and [C]. [A] A specific ortho type epoxy resin. [B] At least one component selected from the group consisting of: thermoplastic resins that are compatible with the epoxy resin [A]; and core-shell type polymers. [C] An amine curing agent.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: November 10, 2020
    Assignee: Toray Industries, Inc.
    Inventors: Maki Nagano, Ayako Fuse, Nobuyuki Tomioka
  • Publication number: 20180265625
    Abstract: An epoxy resin composition produces a cured product having improved elastic modulus and improved nominal strain at compressive fracture. The epoxy resin composition is a fiber-reinforced composite material having excellent compression strength and interlayer toughness. The epoxy resin composition contains at least the following constituent components [A], [B] and [C]. [A] A specific ortho type epoxy resin. [B] At least one component selected from the group consisting of: thermoplastic resins that are compatible with the epoxy resin [A]; and core-shell type polymers. [C] An amine curing agent.
    Type: Application
    Filed: July 21, 2016
    Publication date: September 20, 2018
    Applicant: Toray Industries, Inc.
    Inventors: Maki NAGANO, Ayako FUSE, Nobuyuki TOMIOKA
  • Patent number: 9963589
    Abstract: An epoxy resin composition comprising the following constituents [A], [B], and [C]: [A] an epoxy resin having a structure represented by a formula (1); in which a ring Z represents a condensed polycyclic aromatic hydrocarbon ring, R1 and R2 represent a substituent, R3 represents a hydrogen atom or a methyl group, k is an integer of 0 to 4, m is an integer of 0 or more, and n is an integer of 1 or more; [B] at least one resin selected from the group consisting of the following [Bx], [By] and [Bz]; [Bx] a bisphenol type epoxy resin; [By] an amine type epoxy resin; and [Bz] a thermoplastic resin; [C] a polyamine curing agent. Provided is an epoxy resin composition which provides a cured product having excellent heat resistance, toughness and elastic modulus.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: May 8, 2018
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Maki Nagano, Ayako Fuse, Nobuyuki Tomioka
  • Publication number: 20170306117
    Abstract: Provided is an epoxy resin composition with improved heat resistance and resin elongation. Further provided is a fiber-reinforced composite material which uses the epoxy resin composition and thereby excels in compression strength in high-temperature environments and interlaminar toughness. The epoxy resin composition comprises the constituents [A], [B] and [C], 8-40 mass % of [B] is contained in the epoxy resin composition. The number of moles of active hydrogen contained in [C] is 1.05-2.0 times the number of moles of epoxy groups contained in the entire epoxy resin composition, in a cured resin formed by curing the epoxy resin composition and having a degree of curing of at least 90% obtained by DSC (differential scanning catorimetry), [A], [B] and [C] form a monolayer structure, or a phase separation structure of less than 500 nm. The rubber state modulus of elasticity Y (MPa) and glass transition temperature X (° C.) obtained by DMA (dynamic mechanical analysis) of the cured resin satisfy formula (1).
    Type: Application
    Filed: August 27, 2015
    Publication date: October 26, 2017
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ayako FUSE, Nobuyuki TOMIOKA, Shizue KOYANAGI, Nobuyuki ARAI, Shirou HONDA
  • Publication number: 20160130431
    Abstract: An epoxy resin composition comprising the following constituents [A], [B], and [C]: [A] an epoxy resin having a structure represented by a formula (1); in which a ring Z represents a condensed polycyclic aromatic hydrocarbon ring, R1 and R2 represent a substituent, R3 represents a hydrogen atom or a methyl group, k is an integer of 0 to 4, m is an integer of 0 or more, and n is an integer of 1 or more; [B] at least one resin selected from the group consisting of the following [Bx], [By] and [Bz]; [Bx] a bisphenol type epoxy resin; [By] an amine type epoxy resin; and [Bz] a thermoplastic resin; [C] a polyamine curing agent. Provided is an epoxy resin composition which provides a cured product having excellent heat resistance, toughness and elastic modulus.
    Type: Application
    Filed: July 24, 2014
    Publication date: May 12, 2016
    Applicant: TORAY Industries, Inc.
    Inventors: Maki NAGANO, Ayako FUSE, Nobuyuki TOMIOKA