Abstract: A sensor element includes a sensor chip and a diaphragm base joined to a surface of the sensor chip. The sensor chip includes a first diaphragm for measuring differential pressure between a first pressure and a second pressure and a second diaphragm for measuring absolute pressure or gage pressure of the second pressure. The diaphragm base includes a third diaphragm to directly receive a fluid that is a measurement target and has the first pressure, and a fourth diaphragm to directly receive a fluid that is a measurement target and having the second pressure. The sensor element has a liquid amount adjustment chamber to make an amount of a first pressure transmission medium filled in a first pressure introduction path and an amount of a second pressure transmission medium filled in a second pressure introduction path to be equal to each other.

Abstract: A sensor chip of a sensor element includes a diaphragm for measuring a differential pressure between a first pressure and a second pressure, a diaphragm for measuring an absolute pressure or a gauge pressure of the second pressure, a first pressure introduction path that transmits the first pressure to the diaphragm for measuring a differential pressure, and a second pressure introduction path that transmits the second pressure to the diaphragms. When the transmission of the first pressure or the second pressure to the diaphragms is indicated by an equivalent circuit, a path for transmitting the first pressure and a path for transmitting the second pressure are symmetrically formed.

Abstract: A pressure sensor includes a sensor diaphragm, a pressure-chamber defining member joined to a sensor diaphragm, the pressure-chamber defining member including a recess and a through hole that is open in the recess, the recess having an opening closed by the sensor diaphragm, a connecting pipe having a first end portion inserted into the through hole while being exposed to the recess and bonded to the hole with an adhesive, and a pressure transmission medium filled in the recess and the connecting pipe. A space is disposed around the first end portion of the connecting pipe, and the adhesive is not disposed at the first end portion of the connecting pipe.

Abstract: A chip that constitutes a pressure-sensitive sensor and an enclosure are provided. The enclosure is formed with a sensor placement chamber in which the chip is placed. In the sensor placement chamber in which the chip is housed, a first pipe connecting a first communication channel on the side of the sensor placement chamber to a first pressure introduction portion and a second pipe connecting a second communication channel on the side of the sensor placement chamber to the second pressure introduction portion are provided. A side surface of the first pipe and a side surface of the second pipe are disposed out of contact with an inner wall of the sensor placement chamber.

Abstract: A sensor element includes a first diaphragm for measuring differential pressure between first pressure and second pressure and a second diaphragm for measuring absolute pressure or gage pressure of the second pressure. The sensor element has a first pressure introduction path (through holes, a groove, and a depression) through which the first pressure is transmitted to the first diaphragm. The sensor element has a second pressure introduction path (through holes, grooves, and depressions) through which the second pressure is transmitted to the first and second diaphragms. The sensor element has a liquid amount adjustment chamber (depression) configured to make an amount of a first pressure transmission medium filled in the first pressure introduction path and an amount of a second pressure transmission medium filled in the second pressure introduction path to be equal to each other.

Abstract: A sensor element includes diaphragms that are respectively displaced by receiving pressures, and a plurality of pressure inlet passages (a first pressure inlet passage made up of through-holes, a groove, and recessed portions, and a second pressure inlet passage made up of a through-hole, a groove, and a recessed portion) that respectively transmit same or different pressures to the diaphragms. Each of the plurality of pressure inlet passages is filled with a pressure transmission medium capable of transmitting a pressure. A pressure is applied through part or all of the plurality of pressure inlet passages to each of the diaphragms.

Abstract: A sensor chip of a sensor element includes a diaphragm for measuring a differential pressure between a first pressure and a second pressure, a diaphragm for measuring an absolute pressure or a gauge pressure of the second pressure, a first pressure introduction path that transmits the first pressure to the diaphragm for measuring a differential pressure, and a second pressure introduction path that transmits the second pressure to the diaphragms. When the transmission of the first pressure or the second pressure to the diaphragms is indicated by an equivalent circuit, a path for transmitting the first pressure and a path for transmitting the second pressure are symmetrically formed.

Abstract: A pressure sensor includes a sensor diaphragm, a pressure-chamber defining member joined to a sensor diaphragm, the pressure-chamber defining member including a recess and a through hole that is open in the recess, the recess having an opening closed by the sensor diaphragm, a connecting pipe having a first end portion inserted into the through hole while being exposed to the recess and bonded to the hole with an adhesive, and a pressure transmission medium filled in the recess and the connecting pipe. A space is disposed around the first end portion of the connecting pipe, and the adhesive is not disposed at the first end portion of the connecting pipe.

Abstract: A differential pressure sensor chip (2) includes: first and second pressure introduction holes (21_1 and 21_2); first and second diaphragms (23_1 and 23_2) formed to cover the first and second pressure introduction holes; first and second depressions (24_1 and 24_2) each in a form of a depression respectively provided to face the first and second pressure introduction holes with the first and second diaphragms interposed therebetween; a first communication channel (25) that makes a chamber between the first depression and the first diaphragm and a chamber between the second depression and the second diaphragm communicate to each other; a pressure-transmission-material introduction passage (26) an end of which is an opening and another end of which is joined to the first communication channel; a pressure transmission material (27) that fills the first communication channel, the two chambers, and the pressure-transmission-material introduction passage; and a sealing member (7) formed of a metal formed to seal a

Abstract: A bottom surface of a sensor chip (or a lower surface of a first retaining member) that introduces the pressure of a measured fluid is joined to a bottom surface of a sensor chamber (or to an inner wall surface of a base body) to allow an enclosing chamber (formed by a pressure receiving chamber and a pressure guiding passage) between a pressure receiving diaphragm and the bottom surface of the sensor chip to communicate with a pressure guiding hole in the first retaining member. The sensor chamber is made open to the atmosphere. Thus, a wire bonding portion of a sensor diaphragm from which wires extend is positioned outside the enclosing chamber, and electrode pins and an enclosed liquid in the enclosing chamber are separated from each other.

Abstract: A bottom surface of a sensor chip (or a lower surface of a first retaining member) that introduces the pressure of a measured fluid is joined to a bottom surface of a sensor chamber (or to an inner wall surface of a base body) to allow an enclosing chamber (formed by a pressure receiving chamber and a pressure guiding passage) between a pressure receiving diaphragm and the bottom surface of the sensor chip to communicate with a pressure guiding hole in the first retaining member. The sensor chamber is made open to the atmosphere. Thus, a wire bonding portion of a sensor diaphragm from which wires extend is positioned outside the enclosing chamber, and electrode pins and an enclosed liquid in the enclosing chamber are separated from each other.

Abstract: A differential pressure sensor has a sensor chip that is, between a first inner wall surface and a second inner wall surface of a sensor chamber, joined by a first adhesive agent layer between one face of the sensor chip and the first inner wall surface of the sensor chamber and joined through a second adhesive agent layer between other face of the sensor chip and the second inner wall surface of the sensor chamber. The first adhesive agent layer is an adhesive agent layer that has a Young's modulus that is smaller than the Young's modulus of a material that structures a sensor diaphragm. The second adhesive agent layer is an adhesive agent layer that has a Young's modulus that is smaller than the Young's modulus of the material that structures the sensor diaphragm and larger than the Young's modulus of the first adhesive agent layer.

Abstract: A differential pressure sensor has a sensor chip that is, between a first inner wall surface and a second inner wall surface of a sensor chamber, joined by a first adhesive agent layer between one face of the sensor chip and the first inner wall surface of the sensor chamber and joined through a second adhesive agent layer between other face of the sensor chip and the second inner wall surface of the sensor chamber. The first adhesive agent layer is an adhesive agent layer that has a Young's modulus that is smaller than the Young's modulus of a material that structures a sensor diaphragm. The second adhesive agent layer is an adhesive agent layer that has a Young's modulus that is smaller than the Young's modulus of the material that structures the sensor diaphragm and larger than the Young's modulus of the first adhesive agent layer.