Patents by Inventor Babak Radi

Babak Radi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10383254
    Abstract: An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: August 13, 2019
    Assignee: WISTRON NEWEB CORP.
    Inventors: Hung-Ming Chang, Yi-Yun Chang, Shih-Hong Chen, Babak Radi, Sheng-Hung Tsai
  • Publication number: 20190045664
    Abstract: An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.
    Type: Application
    Filed: December 27, 2017
    Publication date: February 7, 2019
    Inventors: Hung-Ming CHANG, Yi-Yun CHANG, Shih-Hong CHEN, Babak RADI, Sheng-Hung TSAI
  • Patent number: 10087527
    Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: October 2, 2018
    Assignee: Wistron NeWeb Corp.
    Inventors: Babak Radi, Shih-Hong Chen, Yu-Fu Kuo, Chun-Lin Chen, Jing-Wen Chen
  • Patent number: 9997839
    Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.
    Type: Grant
    Filed: August 2, 2015
    Date of Patent: June 12, 2018
    Assignee: Wistron NeWeb Corp.
    Inventors: Babak Radi, Yuan-Chin Hsu, Yu-Fu Kuo, Tzu-Min Wu, Tzu-Wen Chuang, Shih-Hong Chen
  • Patent number: 9790609
    Abstract: A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: October 17, 2017
    Assignee: Wistron NeWeb Corp.
    Inventors: Tzu-Wen Chuang, Babak Radi, Shih-Hong Chen, Chun-Lin Chen
  • Patent number: 9657404
    Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: May 23, 2017
    Assignee: Wistron NeWeb Corp.
    Inventors: Babak Radi, Shih-Hong Chen, Yu-Fu Kuo, Tzu-Wen Chuang
  • Patent number: 9595754
    Abstract: A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: March 14, 2017
    Assignee: Wistron NeWeb Corp.
    Inventors: Babak Radi, Yong-Jyun Lu, Ming-Chi Chiu, Chien-Min Hsu, Shih-Hong Chen
  • Patent number: 9462699
    Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: October 4, 2016
    Assignee: Wistron NeWeb Corp.
    Inventors: Babak Radi, Yu-Fu Kuo
  • Patent number: 9385084
    Abstract: A metal pattern structure having a positioning layer thereon is provided. The positioning layer is located within a predetermined region of the metal pattern structure and located directly on the surface of a metal layer of the metal pattern structure.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: July 5, 2016
    Assignee: Wistron NeWeb Corp.
    Inventors: Babak Radi, Tzu-Wen Chuang, Shih-Hong Chen
  • Publication number: 20160192482
    Abstract: A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 30, 2016
    Inventors: Babak RADI, Yong-Jyun LU, Ming-Chi CHIU, Chien-Min HSU, Shih-Hong CHEN
  • Publication number: 20160141239
    Abstract: A metal pattern structure having a positioning layer thereon is provided. The positioning layer is located within a predetermined region of the metal pattern structure and located directly on the surface of a metal layer of the metal pattern structure.
    Type: Application
    Filed: August 13, 2015
    Publication date: May 19, 2016
    Inventors: Babak Radi, Tzu-Wen Chuang, Shih-Hong Chen
  • Publication number: 20160073508
    Abstract: A method for forming a metal pattern on a substrate having at least one metal component is provided. By performing the surface passivation treatment on the at least metal component, the surface of the at least metal component becomes an anti-plating surface via an anti-plating coating. Hence, the metal pattern can be selectively formed in the following electroless plating processes.
    Type: Application
    Filed: August 6, 2015
    Publication date: March 10, 2016
    Inventors: Tzu-Wen Chuang, Babak Radi, Shih-Hong Chen, Jing-Wen Chen
  • Publication number: 20160072192
    Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.
    Type: Application
    Filed: August 2, 2015
    Publication date: March 10, 2016
    Inventors: Babak Radi, Yuan-Chin Hsu, Yu-Fu Kuo, Tzu-Min Wu, Tzu-Wen Chuang, Shih-Hong Chen
  • Publication number: 20160014907
    Abstract: A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.
    Type: Application
    Filed: May 22, 2015
    Publication date: January 14, 2016
    Inventors: Tzu-Wen Chuang, Babak Radi, Shih-Hong Chen, Chun-Lin Chen
  • Publication number: 20150376809
    Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.
    Type: Application
    Filed: June 27, 2014
    Publication date: December 31, 2015
    Inventors: Babak Radi, Shih-Hong Chen, Yu-Fu Kuo, Tzu-Wen Chuang
  • Publication number: 20150366072
    Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.
    Type: Application
    Filed: June 16, 2014
    Publication date: December 17, 2015
    Inventors: Babak Radi, Yu-Fu Kuo
  • Publication number: 20150315708
    Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.
    Type: Application
    Filed: April 30, 2014
    Publication date: November 5, 2015
    Applicant: Wistron NeWeb Corp.
    Inventors: Babak Radi, Shih-Hong Chen, Yu-Fu Kuo, Chun-Lin Chen, Jing-Wen Chen