Patents by Inventor Babar A. Khan

Babar A. Khan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10535662
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: January 14, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Publication number: 20190387745
    Abstract: The present invention provides methods for the prevention, control, disruption and treatment of bacterial biofilms with lysin, particularly lysin having capability to kill Staphlococcal bacteria, including drug resistant Staphylococcus aureus, particularly the lysin PlySs2. The invention also provides compositions and methods for use in treatment or modulation of bacterial biofilm(s) and biofilm formation.
    Type: Application
    Filed: April 22, 2019
    Publication date: December 26, 2019
    Inventors: Raymond SCHUCH, Robert C. NOWINSKI, Michael WITTEKIND, Babar KHAN, Jimmy ROTOLO
  • Publication number: 20190279987
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Application
    Filed: May 15, 2019
    Publication date: September 12, 2019
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Patent number: 10361207
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: July 23, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Publication number: 20190206871
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Application
    Filed: March 7, 2019
    Publication date: July 4, 2019
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Patent number: 10269806
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: April 23, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Patent number: 10192161
    Abstract: Resistive processing unit including: a plurality of transistors each having a lithium-doped region, wherein the plurality of transistors are arranged in an array to provide resistance; at least one first transmission line electrically connected to a source region of each transistor in at least one column of the array; at least one second transmission line electrically connected to a drain region of each transistor in at least one row of the array; and at least one third transmission line electrically connected to a gate region of the plurality of transistors in at least one row of the array; wherein application of an electrical voltage to the at least one first transmission line, the at least one second transmission line or the at least one third transmission line mobilizes lithium ions in the lithium region, thereby affecting a channel resistance of at least one transistor in the plurality of transistors.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: January 29, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Babar Khan, Arvind Kumar, Yun Seog Lee, Ning Li, Devendra Sadana, Joel Pereira De Souza
  • Publication number: 20180337185
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are provided. The method includes forming deep trench capacitor structures in a silicon on insulator (SOI) wafer. The method further includes forming a plurality of composite fin structures from a semiconductor material of the SOI wafer and conductive material of the deep trench capacitor structures. The method further includes forming a liner over the deep trench capacitor structures including the conductive material of the deep trench capacitor structures. The method further includes forming replacement gate structures with the liner over the deep trench capacitor structures protecting the conductive material during deposition and etching processes.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 22, 2018
    Inventors: Ricardo A. DONATON, Babar A. KHAN, Xinhui WANG, Deepal WEHELLA-GAMAGE
  • Publication number: 20180287054
    Abstract: Methods of forming the MRAM generally include forming an array of MTJ having sub-lithographic dimensions. The array can be formed by providing a substrate including a MTJ material stack including a reference ferromagnetic layer, a tunnel barrier layer, and a free ferromagnetic layer on an opposite side of the tunnel barrier layer. A hardmask layer is deposited onto the MTJ material stack. A first sidewall spacer is formed on the hardmask layer in a first direction. A second sidewall spacer is formed over the first sidewall in a second direction, wherein the first direction is orthogonal to the second direction. The second sidewall spacer intersects the first sidewall spacer. The first sidewall spacer is processed using the second sidewall spacer as mask to form a pattern of oxide pillars having sub-lithographic dimensions. The pattern of oxide pillars are transferred into the MTJ stack to form the array.
    Type: Application
    Filed: November 16, 2017
    Publication date: October 4, 2018
    Inventors: Anthony J. Annunziata, Babar A. Khan, Chandrasekara Kothandaraman, John R. Sporre
  • Publication number: 20180286866
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Application
    Filed: June 1, 2018
    Publication date: October 4, 2018
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Patent number: 10050039
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: August 14, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Publication number: 20180225405
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Application
    Filed: March 29, 2018
    Publication date: August 9, 2018
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Patent number: 10042968
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: August 7, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kevin K. Chan, Sivananda K. Kanakasabapathy, Babar A. Khan, Masaharu Kobayashi, Effendi Leobandung, Theodorus E. Standaert, Xinhui Wang
  • Patent number: 10037998
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are provided. The method includes forming deep trench capacitor structures in a silicon on insulator (SOI) wafer. The method further includes forming a plurality of composite fin structures from a semiconductor material of the SOI wafer and conductive material of the deep trench capacitor structures. The method further includes forming a liner over the deep trench capacitor structures including the conductive material of the deep trench capacitor structures. The method further includes forming replacement gate structures with the liner over the deep trench capacitor structures protecting the conductive material during deposition and etching processes.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: July 31, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ricardo A. Donaton, Babar A. Khan, Xinhui Wang, Deepal Wehella-Gamage
  • Patent number: 9911914
    Abstract: Methods of forming the MRAM generally include forming an array of MTJ having sub-lithographic dimensions. The array can be formed by providing a substrate including a MTJ material stack including a reference ferromagnetic layer, a tunnel barrier layer, and a free ferromagnetic layer on an opposite side of the tunnel barrier layer. A hardmask layer is deposited onto the MTJ material stack. A first sidewall spacer is formed on the hardmask layer in a first direction. A second sidewall spacer is formed over the first sidewall in a second direction, wherein the first direction is orthogonal to the second direction. The second sidewall spacer intersects the first sidewall spacer. The first sidewall spacer is processed using the second sidewall spacer as mask to form a pattern of oxide pillars having sub-lithographic dimensions. The pattern of oxide pillars are transferred into the MTJ stack to form the array.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: March 6, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Anthony J. Annunziata, Babar A. Khan, Chandrasekara Kothandaraman, John R. Sporre
  • Patent number: 9741722
    Abstract: Trench capacitors can be formed between lengthwise sidewalls of semiconductor fins, and source and drain regions of access transistors are formed in the semiconductor fins. A dummy gate structure is formed between end walls of a neighboring pair of semiconductor fins, and limits the lateral extent of raised source and drain regions that are formed by selective epitaxy. The dummy gate structure prevents electrical shorts between neighboring semiconductor fins. Gate spacers can be formed around gate structures and the dummy gate structures. The dummy gate structures can be replaced with dummy replacement gate structures or dielectric material portions, or can remain the same without substitution of any material. The dummy gate structures may consist of at least one dielectric material, or may include electrically floating conductive material portions.
    Type: Grant
    Filed: October 3, 2015
    Date of Patent: August 22, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John E. Barth, Jr., Kangguo Cheng, Bruce B. Doris, Herbert L. Ho, Ali Khakifirooz, Babar A. Khan, Shom Ponoth, Kern Rim, Kehan Tian, Reinaldo A. Vega
  • Publication number: 20170213835
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are provided. The method includes forming deep trench capacitor structures in a silicon on insulator (SOI) wafer. The method further includes forming a plurality of composite fin structures from a semiconductor material of the SOI wafer and conductive material of the deep trench capacitor structures. The method further includes forming a liner over the deep trench capacitor structures including the conductive material of the deep trench capacitor structures. The method further includes forming replacement gate structures with the liner over the deep trench capacitor structures protecting the conductive material during deposition and etching processes.
    Type: Application
    Filed: April 7, 2017
    Publication date: July 27, 2017
    Inventors: Ricardo A. DONATON, Babar A. KHAN, Xinhui WANG, Deepal WEHELLA-GAMAGE
  • Publication number: 20170178986
    Abstract: A computing device includes a wafer having multiple layers, the wafer including a top layer and sublayers disposed below it, the sublayers including one or more memory devices. The computing device also includes two or more shaped retainer elements shaped to mate with and at least partially surround at least the top of the wafer and in electrical contact with one or more chips disposed on a top of the top layer and a holding device that mates with the retainer elements to provide at least power to the retaining elements. So arranged, the wafer may be cooled.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Babar A. Khan, Arvind Kumar, Kamal K. Sikka
  • Patent number: 9679917
    Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are provided. The method includes forming deep trench capacitor structures in a silicon on insulator (SOI) wafer. The method further includes forming a plurality of composite fin structures from a semiconductor material of the SOI wafer and conductive material of the deep trench capacitor structures. The method further includes forming a liner over the deep trench capacitor structures including the conductive material of the deep trench capacitor structures. The method further includes forming replacement gate structures with the liner over the deep trench capacitor structures protecting the conductive material during deposition and etching processes.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: June 13, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ricardo A. Donaton, Babar A. Khan, Xinhui Wang, Deepal Wehella-Gamage
  • Publication number: 20170127683
    Abstract: The present invention provides methods for the prevention, control, disruption and treatment of bacterial biofilms with lysin, particularly lysin having capability to kill Staphylococcal bacteria, including drug resistant Staphylococcus aureus, particularly the lysin PlySs2. The invention also provides compositions and methods for use in treatment or modulation of bacterial biofilm(s) and biofilm formation.
    Type: Application
    Filed: October 14, 2016
    Publication date: May 11, 2017
    Inventors: Raymond Schuch, Robert C. Nowinski, Michael Wittekind, Babar Khan, Jimmy Rotolo