Patents by Inventor Bae Hyung Kim

Bae Hyung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8974393
    Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: March 10, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung Il Cho, Seung Heun Lee, Bae Hyung Kim, Young Il Kim, Jong Keun Song
  • Patent number: 8975096
    Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: March 10, 2015
    Assignees: Samsung Electronics Co., Ltd., Kyungpook National University Industry-Academic Cooperation Foundation
    Inventors: Young Il Kim, Bae Hyung Kim, Jong Keun Song, Seung Heun Lee, Kyung Il Cho, Yong Rae Roh, Won Seok Lee
  • Publication number: 20140360274
    Abstract: A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module.
    Type: Application
    Filed: June 11, 2014
    Publication date: December 11, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Il CHO, Bae Hyung KIM, Young Il KIM, Jong Keun SONG, Seung Heun LEE
  • Publication number: 20140364742
    Abstract: Disclosed herein is an ultrasonic probe capable of emitting heat generated by a transducer outside the ultrasonic probe using a heat radiation plate. The ultrasonic probe includes a transducer configured to generate an ultrasonic wave, a heat spreader provided on a surface of the transducer, the heat spreader being configured to absorb heat generated by the transducer, at least one heat radiation plate which contacts at least one side of the heat spreader, and at least one board installed on the at least one heat radiation plate so as to transfer heat generated by the at least one board to the at least one heat radiation plate.
    Type: Application
    Filed: June 11, 2014
    Publication date: December 11, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Il CHO, Bae Hyung KIM, Young Il KIM, Jong Keun SONG, Seung Heun LEE
  • Publication number: 20140364741
    Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.
    Type: Application
    Filed: June 11, 2014
    Publication date: December 11, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Il CHO, Jong Keun SONG, Bae Hyung KIM, Young Il KIM, Seung Heun LEE
  • Publication number: 20140013850
    Abstract: A transducer module includes a curved surface frame which is formed from a flexible material in a curved shape and includes a front surface and a rear surface; a transducer which is disposed on the front surface; and a support frame which is mounted on the rear surface and supports the curved surface frame.
    Type: Application
    Filed: July 12, 2013
    Publication date: January 16, 2014
    Inventors: Young Il KIM, Bae Hyung KIM, Jong Keun SONG, Seung Heun LEE, Kyung Il CHO
  • Publication number: 20130341303
    Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
    Type: Application
    Filed: June 25, 2013
    Publication date: December 26, 2013
    Inventors: Young Il KIM, Bae Hyung KIM, Jong Keun SONG, Seung Heun LEE, Kyung Il CHO, Yong Rae ROH, Won Seok LEE
  • Publication number: 20130338506
    Abstract: A method and apparatus for performing three-dimensional (3D) ultrasound volume scanning by using a two-dimensional (2D) transducer array, in which a plurality of transducer elements are two-dimensionally arranged, including applying at least two codes which are orthogonal to each other to at least one one-dimensional (1D) transducer array which is included in the 2D transducer array, the 1D transducer array having transducer elements which are arranged linearly from among the plurality of the transducer elements; obtaining signals which respectively correspond to the codes which are orthogonal to each other from signals which are reflected by a target object and received by the plurality of transducer elements; and generating image data regarding the target object by using the obtained signals.
    Type: Application
    Filed: June 13, 2013
    Publication date: December 19, 2013
    Inventors: Bae-hyung KIM, Dong-wook KIM, Jong-keun SONG, Seung-heun LEE, Kyung-il CHO
  • Publication number: 20130286593
    Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.
    Type: Application
    Filed: April 30, 2013
    Publication date: October 31, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Il CHO, Seung Heun LEE, Bae Hyung KIM, Young Il KIM, Jong Keun SONG
  • Publication number: 20130242705
    Abstract: A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.
    Type: Application
    Filed: January 15, 2013
    Publication date: September 19, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-Il KIM, Dong Wook KIM, Bae Hyung KIM, Jong Keun SONG, Seung Heun LEE, Kyung II CHO
  • Publication number: 20120316437
    Abstract: An apparatus for driving a two-dimensional transducer array, a medical imaging system and a method of driving a two-dimensional transducer array are provided. An apparatus for driving a two-dimensional (2D) transducer array including one or more transducers includes one or more drivers configured to respectively drive the transducers, each of the drivers including a register, a comparator, a pulse frequency setter, a multi-pulse controller, a transmission signal generator, a signal transceiver, a transmission and reception switch, and a reception signal amplifier, and a driving controller configured to control the drivers.
    Type: Application
    Filed: June 8, 2012
    Publication date: December 13, 2012
    Applicants: Industry-University Cooperation Foundation Hanyang University, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-keun Song, Oh-kyong Kwon, Kyung-il Cho, Dong-wook Kim, Bae-hyung Kim
  • Publication number: 20120277590
    Abstract: A beamforming method includes generating a control signal for implementing a delay time for each of a plurality of transducers of each of a plurality of two-dimensional (2D) transducer-arrays, transmitting the control signal to a plurality of driving units respectively corresponding to the plurality of 2D transducer-arrays via an interposer that electrically connects the plurality of 2D transducer-arrays to each other, and driving each 2D transducer-array of the plurality of 2D transducer-arrays with a corresponding driving unit of the plurality of driving units according to the control signal transmitted via the interposer.
    Type: Application
    Filed: April 25, 2012
    Publication date: November 1, 2012
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong-keun Song, Kyung-il Cho, Dong-wook Kim, Bae-hyung Kim
  • Publication number: 20120179043
    Abstract: A diagnosis system, a medical image system, and a method of displaying a diagnosis image are provided. The diagnosis system includes a probe including a plurality of sub-arrays, each of the sub-arrays including at least one line of array transducers, the array transducers being configured to transmit and receive signals to and from a subject being diagnosed, and a hybrid beamformer configured to perform analog beamforming in a direction in which the sub-arrays are arranged, and perform digital beamforming in a direction perpendicular to the direction in which the sub-arrays are arranged.
    Type: Application
    Filed: January 6, 2012
    Publication date: July 12, 2012
    Applicants: Industry-University Cooperation Foundation Sogang University, Samsung Electronics Co., Ltd.
    Inventors: Bae-hyung KIM, Jin-ho CHANG, Tai-kyong SONG, Kyung-il CHO, Dong-wook KIM, Jong-keun SONG, Yang-mo YOO
  • Patent number: 5793841
    Abstract: An apparatus and a method for receiving dual highway data in an electronic switching system. First and second highway data are latched in response to an input latch clock signal and any one thereof waits for the output at a rising edge of the input latch clock signal. A parity bit of the first or second highway data is checked and the checked result is outputted for a first half period of a reference clock signal. The reference clock signal has half a period of the input latch clock signal. If a selected one of the first and second highway data has a parity error in accordance with the checked result, it is replaced by the other highway data for a latter half period of the reference clock signal while it waits for the output at the rising edge of the input latch clock signal. The replaced highway data is outputted at the rising edge of the input latch clock signal.
    Type: Grant
    Filed: April 18, 1996
    Date of Patent: August 11, 1998
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Jung Soo Jung, Bae Hyung Kim