Abstract: Technologies for reducing the impact of inductors on electrical traces are disclosed. In an illustrative embodiment, conductive ink is applied in a silk screen layer on top of a solder mask of a circuit board. The conductive ink forms shield regions under and near where inductors are placed and/or where a power plane is routed. The conductive shield regions may be coupled to a ground plane in the circuit board. The conductive shield regions can partially shield traces under and near the inductor, reducing the noise induced on nearby traces. The conductive shield regions can allow traces for high-speed input/output signals to be routed closer to the inductor, reducing the size, number of layers, and/or cost of the circuit board. In some embodiments, the conductive shield regions can shield emissions from the power plane, reducing interference on antennas of a device.

Abstract: Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

Abstract: Medical systems for depositing fibrin on a medical device ex vivo are disclosed herein. According to some embodiments, the present technology includes a medical system comprising a vascular implant and a package defining a reservoir configured to receive the vascular implant and a volume of blood. The package can include an electrode disposed within the reservoir. The medical system can further include a current generator configured to be electrically coupled to the electrode. Activation of the current generator while the vascular implant and blood are present in the reservoir can cause current to flow through the blood and vascular implant, thereby applying an electrical charge to the vascular implant.

Abstract: A system for treatment of intracranial stenosis can include a catheter having a lumen, and an elongate member extending through the lumen. A distal pressure sensor is coupled to a distal end portion of the elongate member and is configured to obtain blood pressure parameters to characterize blood flow at a treatment site before and after treatment. A stent is disposed within the catheter lumen in a radially constrained configuration. The stent surrounds the elongate member such that the distal end portion of the elongate member is disposed distal to a distal end of the stent. The stent is configured to radially expand into apposition with the blood vessel to increase blood flow at the treatment site when released from the catheter.

Abstract: Devices for treating vascular defects and associated systems and methods are disclosed herein. In some embodiments, an occlusive device for treating an aneurysm includes an anchor structure extending circumferentially around an opening. A plurality of spiral struts are coupled to the anchor structure and extend over the opening, and a plurality of protrusions extend away from the spiral struts. The spiral struts and the protrusions can both be arranged within a common plane when the occlusive device is in an expanded configuration. When the occlusive device is deployed within the aneurysm and in the expanded configuration, the spiral struts can span the neck of the aneurysm, and the anchor structure can engage the wall of the aneurysm near the neck.

Abstract: A printed circuit board includes a ground plane, a power plane having a first main surface and a second main surface opposite to the first main surface, wherein the second main surface faces the ground plane and a shielding structure partially covering the power plane. The shielding structure includes a metal structure covering a peripheral area of the first main surface from a direction facing the first main surface and a plurality of vias electrically and mechanically coupling the metal structure to the ground plane.

Abstract: In one embodiment, an AC ionic blower apparatus includes a housing defining a hole through the housing, a first electrode formed around the hole, a second electrode formed around the hole, and a dielectric material between the first electrode and the second electrode. The center of the second electrode is offset from the center of the first electrode.

Abstract: The speaker coil in a dynamic speaker in a mobile computing device can be used to generate radio frequency (RF) signals having a frequency of about 100 kHz or greater. A speaker amplifier drives the dynamic speaker to produce sound and RF circuitry drives the speaker amplifier to generate the RF signals having a frequency of about 100 kHz or greater. The speaker coil can comprise a tap at an appropriate point between the ends of the coil to cause the coil to operate at resonance over a desired RF frequency band. A low-pass filter can be positioned at the speaker amplifier output to protect the speaker amplifier from RF energy generated by the RF circuitry and a high-pass filter can be positioned at the output of the RF circuitry to protect the RF circuitry from audio energy generated by the speaker amplifier.

Abstract: Electrically conductive compressible gaskets can be employed to ground a heat solution and provide electromagnetic interference (EMI) shielding. A plurality of gaskets may be arranged around the perimeter of an integrated circuit package such as a processor or system on a chip. Each of the gaskets is in contact with a ground plane in the package, and upon contact with a heat sink or cold plate, creates an electrical path that grounds the heat sink or cold plate and thereby minimizes the emission of spurious radio signals. Other embodiments may be described and/or claimed.

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.