Patents by Inventor Bang Ning Hsu

Bang Ning Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210391279
    Abstract: A semiconductor device includes a semiconductor substrate; and a multilevel wiring structure on the semiconductor substrate, the multilevel wiring structure including at least an intermediate metal layer over the semiconductor substrate and an uppermost metal layer over the intermediate metal layer, and the multilevel wiring structure being divided into a main circuit portion and a scribe portion surrounding the main circuit portion; wherein the scribe portion of the multilevel wiring layer includes at least a metal pad exposed in the intermediate metal layer.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 16, 2021
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Shigeru Sugioka, Keizo Kawakita, Hidenori Yamaguchi, Bang Ning Hsu