Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Abstract: A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.

Abstract: A circuit board assembly has a circuit board coupled to a support plane and defining a space between the circuit board and the support member. A circuit board component mounts to the circuit board and is oriented within the space defined by the circuit board and the support plane. A heat pipe assembly, located within the defined space, has a relatively high thermal conductivity, compared to other thermally conductive materials, and transfers heat from the circuit board component to the support plane or carrier tray associated with the circuit board. The heat pipe assembly has an input portion that contacts the circuit board component and an output portion that contacts the support plane. The heat pipe assembly also has a compliant portion having a lower stiffness relative to the stiffness of either the input portion or the output portion.

Abstract: A surface mount adaptor allows for removable attachment of debugging connectors to a circuit board and provides high density access to the circuit board under test at a single location. A circuit board testing assembly has a support member having debugging connectors coupled to a first surface of the support member, the debugging connectors being configured to attach to a circuit board testing device. The circuit board testing assembly also has a support member connector coupled to a second surface of the support member and in electrical communication with the debugging connectors. The support member is configured to removably attach to a circuit board connector surface mounted to a first surface of a circuit board. Removable attachment of the debugging connectors from the circuit board provides an availability of space on the top side of the circuit board for additional circuit board components and traces.

Abstract: A CERDIP housing is provided with a heat pipe that passes through the closure seal lid whereby the heat pipe terminates within the housing cavity at the hot end thereof. A quantity of working fluid, such as fluorinated octane, is contained within the package cavity. The heat pipe communicates with cooling fins that produce a cold end thereof. Heat from the semiconductor device inside the housing boils the working fluid and is cooled thereby. The fluid vapor passes along the heat pipe and is condensed at the cold end to be converted back to liquid. As a result the semiconductor device is in direct communication with the heat pipe working fluid.