Patents by Inventor BangHong Hu

BangHong Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075710
    Abstract: This application provides a housing, a terminal device, and a housing manufacturing method. The housing includes a magnesium-based metal matrix. A first aluminum-based metal layer and a second aluminum-based metal layer are respectively disposed on two sides of the magnesium-based metal matrix, a first transition layer is disposed between the magnesium-based metal matrix and the first aluminum-based metal layer, an appearance layer is disposed on a surface of a side that is of the first aluminum-based metal layer and that is away from the first transition layer, a second transition layer is disposed between the magnesium-based metal matrix and the second aluminum-based metal layer, and an electrical connection layer is disposed on a surface of a side that is of the second aluminum-based metal layer and that is away from the second transition layer.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Inventors: Dawei Ji, Ming Cai, Banghong Hu
  • Publication number: 20240011130
    Abstract: This application provides an aluminum alloy, an electronic device, and an aluminum alloy preparation method. The aluminum alloy, based on mass percentage, includes the following components: silicon: 8.0%-10.0%, magnesium: 0.001%-0.2%, manganese: 0.001%-0.09%, iron: 0.7%-1.3%, and strontium: 0.001%-0.05%, with a balance of aluminum and inevitable impurities, where the inevitable impurities account for ?0.15%. The aluminum alloy has characteristics of a high heat conductivity, good molding performance, favorable corrosion resistance, and favorable mechanical properties without heat treatment.
    Type: Application
    Filed: September 21, 2023
    Publication date: January 11, 2024
    Inventors: Li FAN, Hua WANG, Banghong HU, Li PANG, Han YAN, Xiaojun YANG
  • Publication number: 20230288647
    Abstract: Embodiments of this application provide an optical fiber ferrule, where n rows of optical fiber holes are symmetrically distributed on a mating end face of the ferrule, n>=3, and n is an odd number. Based on the layout design of optical fiber holes on the optical fiber ferrule, this application provides an optical fiber connector that includes a plurality of rows of optical fiber holes and that is compatible with one row and a relatively small number of rows of optical fiber holes, so that an optical fiber connector with a large number of cores can be forward compatible with an optical fiber connector with a small number of cores, thereby improving expandability and compatibility of the optical fiber ferrule.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 14, 2023
    Inventors: Hualiang SHI, Banghong HU, Wei FANG, Chungang LI, Yiguo QI, Juanjuan CAO
  • Patent number: 11619786
    Abstract: Embodiments of this application provide an optical fiber ferrule, where n rows of optical fiber holes are symmetrically distributed on a mating end face of the ferrule, n>=3, and n is an odd number. Based on the layout design of optical fiber holes on the optical fiber ferrule, this application provides an optical fiber connector that includes a plurality of rows of optical fiber holes and that is compatible with one row and a relatively small number of rows of optical fiber holes, so that an optical fiber connector with a large number of cores can be forward compatible with an optical fiber connector with a small number of cores, thereby improving expandability and compatibility of the optical fiber ferrule.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: April 4, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hualiang Shi, Banghong Hu, Wei Fang, Chungang Li, Yiguo Qi, Juanjuan Cao
  • Patent number: 11567382
    Abstract: A terminal is provided, and the terminal includes a housing, a front screen, a circuit board, and a power supply. The front screen is disposed on the housing, both the circuit board and the power supply are disposed inside the housing, and the power supply is connected to the circuit board. The front screen includes a toughened glass, a color changing layer, and a display screen that are sequentially stacked. The color changing layer is connected to the circuit board, and can change a color when receiving power supply. The color changing layer is disposed in the front screen, and may change a color when receiving the power supply from the circuit board. The color changing layer is configured to change only a color and cannot display a complex image, and power consumption of the color changing layer is far less than that of the display screen.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: January 31, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhongzhi Tang, Zhen He, Ming Cai, Heshuai Si, Banghong Hu
  • Publication number: 20220004034
    Abstract: A terminal is provided, and the terminal includes a housing, a front screen, a circuit board, and a power supply. The front screen is disposed on the housing, both the circuit board and the power supply are disposed inside the housing, and the power supply is connected to the circuit board. The front screen includes a toughened glass, a color changing layer, and a display screen that are sequentially stacked. The color changing layer is connected to the circuit board, and can change a color when receiving power supply. The color changing layer is disposed in the front screen, and may change a color when receiving the power supply from the circuit board. The color changing layer is configured only to change a color and cannot display a complex image, and power consumption of the color changing layer is far less than that of the display screen.
    Type: Application
    Filed: September 17, 2021
    Publication date: January 6, 2022
    Inventors: Zhongzhi TANG, Zhen HE, Ming CAI, Heshuai SI, Banghong HU
  • Publication number: 20210317032
    Abstract: Aluminosilicate microcrystalline glass, and a manufacturing method and a product thereof, where in addition to a glass phase, the aluminosilicate microcrystalline glass includes principal crystalline phases: a magnesium aluminate (MgAl2O4) crystal including a volume percentage of 5% to 30%, a lithium disilicate (Li2Si2O5) crystal including a volume percentage of 10% to 30%, and a quartz and quartz solid solution including a volume percentage of 5% to 30%. Residues are other inevitable impurities. The inevitable impurities include intermediate products generated when the MgAl2O4 crystal, the Li2Si2O5 crystal, or the quartz and quartz solid solution is being generated, other impurities that are inevitable in a glass production process, and the like.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Inventors: Kaiwen Huang, Banghong Hu, Wangchun Lyu, Heshuai Si, Zhongzhi Tang
  • Patent number: 11139583
    Abstract: A dielectric lens, where the dielectric lens is a cylindrical lens or an ellipsoidal lens whose cross-sectional profile is a quasi-ellipse, and the dielectric lens is formed by piling a plurality of units. Dielectric constant distribution of the units in the dielectric lens enables a non-plane wave in a minor axis direction of the quasi-ellipse to be converted into a plane wave through the dielectric lens. The units of the dielectric lens are prepared through extrusion, injection, molding, computer numerical control (CNC) machining, or a three dimensional (3D) printing process technology, and the units may be assembled through gluing, welding, structural clamping, or a coupling printed through 3D printing. When the dielectric lens is applied to a multi-beam antenna, a system capacity of a communications system can be increased. In addition, a thickness of the lens is reduced using the multi-beam antenna.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: October 5, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Banghong Hu, Liangyuan Li, Zuoxing Dai, Lei Li, Yuanhong Zhang, Runxiao Zhang, Yaojiang Zhang
  • Publication number: 20210107045
    Abstract: An anti-fingerprint terminal housing includes a housing substrate, where the housing substrate includes a first surface and a second surface that are oppositely disposed, the first surface faces the exterior of the terminal housing, and the second surface faces the interior of the terminal housing, the first surface is provided with a plurality of spaced convexes or concaves formed by the housing substrate, a distance between boundaries of any two adjacent convexes or concaves on a same side is in a range of 1-900 nanometers (nm), and the height of the convex or the depth of the concave is in a range of 1-400 nm.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Inventors: Hongsheng Yang, Banghong Hu, Yungang Li, Lulu Pan, Rong Ma, Wangchun Lyu, Heshuai Si
  • Publication number: 20210018701
    Abstract: Embodiments of this application provide an optical fiber ferrule, where n rows of optical fiber holes are symmetrically distributed on a mating end face of the ferrule, n>=3, and n is an odd number. Based on the layout design of optical fiber holes on the optical fiber ferrule, this application provides an optical fiber connector that includes a plurality of rows of optical fiber holes and that is compatible with one row and a relatively small number of rows of optical fiber holes, so that an optical fiber connector with a large number of cores can be forward compatible with an optical fiber connector with a small number of cores, thereby improving expandability and compatibility of the optical fiber ferrule.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 21, 2021
    Inventors: Hualiang SHI, Banghong HU, Wei FANG, Chungang LI, Yiguo QI, Juanjuan CAO
  • Patent number: 10815551
    Abstract: An aluminum alloy material includes zinc whose mass percentage is from 4.5% to 12.0%, magnesium whose mass percentage is from 0.7% to 3.0%, copper whose mass percentage is less than or equal to 0.6%, titanium whose mass percentage is from 0.001% to 0.5%, boron whose mass percentage is from 0.00011% to 0.2%, manganese whose mass percentage is less than or equal to 0.01%, chromium whose mass percentage is less than or equal to 0.2%, zirconium whose mass percentage is less than or equal to 0.2%, silicon whose mass percentage is less than or equal to 0.3%, ferrum whose mass percentage is less than or equal to 0.3%, aluminum, and other inevitable impurities.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: October 27, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongxiang Wang, Banghong Hu
  • Publication number: 20190203324
    Abstract: Embodiments of the present disclosure provide a die casting aluminum alloy, including constituents with the following mass percentages: silicon: 4.0% to 10.0%; magnesium: 0.2% to 1.0%; copper: ?0.1%; manganese: ?0.1%; zinc: ?0.1%; ferrum: ?1.3%; titanium: ?0.2%; inevitable impurities: ?0.15%; and the rest: aluminum. The die casting aluminum alloy has a high heat-conducting property, good formability, high corrosion resistance, and a good mechanical property. This can resolve a prior-art problem that forming and heat dissipation requirements of a communications product with a complex structure, high heat flux density, and large power cannot be met at the same time because it is difficult for a die casting aluminum alloy to have both a high heat-conducting property and good formability. The embodiments of the present disclosure further provide a production method of the die casting aluminum alloy and a communications product.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 4, 2019
    Inventors: Xiaorui LIU, Naier MENG, Banghong HU
  • Patent number: 10337085
    Abstract: Embodiments of the present invention provide a die casting aluminum alloy, including the following components in percentage by mass: 11.0% to 14.0% of silicon; 0.1% to 0.9% of manganese; 0.1% to 1.0% of magnesium; 0.3% to 1.4% of iron; less than or equal to 0.2% of copper; and aluminum and inevitable impurities. The die casting aluminum alloy has good formability, heat conductivity, and corrosion resistance, and certain mechanical properties, which can avoid problems of a low yield of die-casting fittings, burn-in caused by severe heat emission of a product, corrosion in a coastal environment, assembly difficulties caused by insufficient mechanical properties, severe deformation in a wind load condition, and the like, so as to satisfy requirements of global delivery of complex communications products.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: July 2, 2019
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Wenwen Yuan, Banghong Hu, Naier Meng
  • Publication number: 20190148836
    Abstract: A dielectric lens, where the dielectric lens is a cylindrical lens or an ellipsoidal lens whose cross-sectional profile is a quasi-ellipse, and the dielectric lens is formed by piling a plurality of units. Dielectric constant distribution of the units in the dielectric lens enables a non-plane wave in a minor axis direction of the quasi-ellipse to be converted into a plane wave through the dielectric lens. The units of the dielectric lens are prepared through extrusion, injection, molding, computer numerical control (CNC) machining, or a three dimensional (3D) printing process technology, and the units may be assembled through gluing, welding, structural clamping, or a coupling printed through 3D printing. When the dielectric lens is applied to a multi-beam antenna, a system capacity of a communications system can be increased. In addition, a thickness of the lens is reduced using the multi-beam antenna.
    Type: Application
    Filed: January 11, 2019
    Publication date: May 16, 2019
    Inventors: Banghong Hu, Liangyuan Li, Zuoxing Dai, Lei Li, Yuanhong Zhang, Runxiao Zhang, Yaojiang Zhang
  • Patent number: 10143110
    Abstract: Embodiments of the present disclosure provide a middle frame member including: a middle frame substrate body; a first metal layer, attached to a first area of the middle frame substrate body, where a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area includes all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the entire first metal and the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; and a passivated insulation layer, attached to a surface of the first metal layer.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: November 27, 2018
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ming Cai, Banghong Hu, Longyu Li
  • Publication number: 20180320253
    Abstract: An aluminum alloy material includes zinc whose mass percentage is from 4.5% to 12.0%, magnesium whose mass percentage is from 0.7% to 3.0%, copper whose mass percentage is less than or equal to 0.6%, titanium whose mass percentage is from 0.001% to 0.5%, boron whose mass percentage is from 0.00011% to 0.2%, manganese whose mass percentage is less than or equal to 0.01%, chromium whose mass percentage is less than or equal to 0.2%, zirconium whose mass percentage is less than or equal to 0.2%, silicon whose mass percentage is less than or equal to 0.3%, ferrum whose mass percentage is less than or equal to 0.3%, aluminum, and other inevitable impurities.
    Type: Application
    Filed: June 8, 2018
    Publication date: November 8, 2018
    Inventors: Yongxiang Wang, Banghong Hu
  • Publication number: 20180255664
    Abstract: Embodiments of the present disclosure provide a middle frame member including: a middle frame substrate body; a first metal layer, attached to a first area of the middle frame substrate body, where a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area includes all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the entire first metal and the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer; and a passivated insulation layer, attached to a surface of the first metal layer.
    Type: Application
    Filed: May 4, 2018
    Publication date: September 6, 2018
    Inventors: Ming CAI, Banghong HU, Longyu LI
  • Publication number: 20150354032
    Abstract: Embodiments of the present invention provide a die casting aluminum alloy, including the following components in percentage by mass: 11.0% to 14.0% of silicon; 0.1% to 0.9% of manganese; 0.1% to 1.0% of magnesium; 0.3% to 1.4% of iron; less than or equal to 0.2% of copper; and aluminum and inevitable impurities. The die casting aluminum alloy has good formability, heat conductivity, and corrosion resistance, and certain mechanical properties, which can avoid problems of a low yield of die-casting fittings, burn-in caused by severe heat emission of a product, corrosion in a coastal environment, assembly difficulties caused by insufficient mechanical properties, severe deformation in a wind load condition, and the like, so as to satisfy requirements of global delivery of complex communications products.
    Type: Application
    Filed: June 4, 2015
    Publication date: December 10, 2015
    Inventors: Wenwen YUAN, Banghong HU, Naier MENG
  • Publication number: 20130255877
    Abstract: Systems and methods of applying a decorating film to a substrate that reduce the occurrence of wrinkling of the decorating film during application of the film to the substrate and ensure a more uniform transfer of a pattern or image on the decorating film to the substrate. The same systems and methods can be used to apply a decorating film that laminates to a substrate. Systems of and methods for cooling a decorating chamber and removing the used decorating film from the substrate after a transfer of an image or pattern from the decorating film to the substrate.
    Type: Application
    Filed: February 7, 2013
    Publication date: October 3, 2013
    Applicant: FLEXTRONICS AP, LLC
    Inventors: Spring Wu, Banghong Hu, Oliver Ren, Charles Raymon Hill
  • Publication number: 20050163646
    Abstract: The invention relates to a method of forming an article from an alloy, such as a tin-containing alloy or titanium-containing alloy. Elemental metal powders of metal constituents of the alloy are injected into a pre-heated die and pressure is applied to form a green part. The green part is then alloyed at a predetermined temperature for a pre-determined time period to form the article. The invention also relates to an article formed by such a method.
    Type: Application
    Filed: October 31, 2001
    Publication date: July 28, 2005
    Inventors: Qingfa Li, Banghong Hu, Chee Mun Choy, Suxia Zhang