Abstract: A receiver system for an on-off key (“OOK”) isolator system may include a pair of receivers. A first receiver may generate a first current signal representing a received OOK signal, and a second receiver may generate a second current signal from a common mode representation of the received OOK signal. The receiver system may include circuitry to compare the first and second current signals and generate an output signal therefrom.

Abstract: A receiver system for an on-off key (“OOK”) isolator system may include a receiver that generates an intermediate current signal based on an OOK input signal. The intermediate current may be provided at a first current level when the input signal has a first OOK state and a second current level when the input signal has a second OOK state. The system also may include an output driver to generate a voltage representation of the intermediate current signal. Performing signal processing in a current domain permits fast transitions between OOK states.

Abstract: An oscillator for a signal isolator system includes a capacitor and an inductor connected in parallel, two pairs of cross-coupled switches and a control switch. The capacitor, the inductor and the cross-coupled switches form an oscillator. The control switch controls operation of the oscillator between an ON state and an OFF state in response to a data signal to be communicated across an isolation barrier. The inductor may be formed from a winding of an isolation transformer, which reduces component count as compared to a system that provides a separate inductor. Other embodiments may include a current-supplying kickstart circuit and a shorting transistor that can speed transition between the ON and OFF states.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer that are connected in series while alternating between the p-type and the n-type thermoelectric elements. The integrated circuit may include first and second substrates each having formed thereon a plurality of thermoelectric legs of a respective type of thermoelectric material. The first and second thermoelectric substrates also may have respective conductors, each coupled to a base of an associated thermoelectric leg and forming a mounting pad for coupling to a thermoelectric leg of the counterpart substrate.

Abstract: An integrated circuit fabricated with a number of layer may include a substrate, a transformer having a first winding, a second winding and a magnetic core. The first winding and the second winding may surround the magnetic core. The transformer may be disposed above a first side of the substrate. A flux conductor may be disposed on a second surface of the substrate opposite to the first surface.

Abstract: An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary.

Abstract: A system may include a plurality of isolators to transfer data signals across an isolation barrier, one of the signals including a clock signal. A delay circuit may be included to receive the clock signal and provide a delayed clock signal that lags the clock signal by an amount representing a delay across the isolation barrier. The delayed clock signal may be delayed by a round trip propagation delay over the isolation barrier. The delayed clock signal may be used as a reference to read data sent over the isolation barrier.

Abstract: An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary.

Abstract: A power converter may include an amplifier that generates an error signal, a modulator that generates a modulated error signal, an isolator that generates an isolated modulated error signal, and a demodulator that generates an isolated error signal, which may be substantially proportional to the difference between the output signal and the reference signal, and a controller that controls a power stage to generate the output signal of the power converter.

Abstract: A laterally coupled isolator includes a pair of isolator traces provided in a common dielectric layer and separated by a distance that defines the isolation strength of the system. Circuit designers can vary the lateral distance to tailor isolation rating to suit individual design needs.

Abstract: A system may include a plurality of isolators to transfer data signals across an isolation barrier, one of the signals including a clock signal. A delay circuit may be included to receive the clock signal and provide a delayed clock signal that lags the clock signal by an amount representing a delay across the isolation barrier. The delayed clock signal may be delayed by a round trip propagation delay over the isolation barrier. The delayed clock signal may be used as a reference to read data sent over the isolation barrier.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements.

Abstract: A system and method for manufacturing of a micro-transformer providing direct electrical isolation between a primary winding and a secondary winding while featuring tight magnetic coupling for a large possible step-up or step-down ratio. The micro-transformer may be implemented in an integrated circuit, and may include a magnetic core. A high stepping ratio, e.g. approximately 50 to 100, may be achieved by connecting multiple symmetric primary windings in parallel and multiple symmetric secondary windings in series, or vice-versa. A plurality of windings may be stacked vertically. The micro-transformer may be of particular utility in wireless sensor networks, thermal and vibrational energy harvesters, power converters, and signal isolators.

Abstract: A system and method for manufacturing of a micro-transformer providing direct electrical isolation between a primary winding and a secondary winding while featuring tight magnetic coupling for a large possible step-up or step-down ratio. The micro-transformer may be implemented in an integrated circuit, and may include a magnetic core. A high stepping ratio, e.g. approximately 50 to 100, may be achieved by connecting multiple symmetric primary windings in parallel and multiple symmetric secondary windings in series, or vice-versa. A plurality of windings may be stacked vertically. The micro-transformer may be of particular utility in wireless sensor networks, thermal and vibrational energy harvesters, power converters, and signal isolators.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements.

Abstract: A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a signal of a first predetermined type is supplied to the primary winding and in response to a second type of edge in the logic signal, a signal of a second predetermined type is supplied to said primary winding, the primary winding and the transmitter being referenced to a first ground; and the secondary winding being referenced to a second ground which is galvanically isolated from the first ground and said secondary winding supplying to a receiver circuit signals received in correspondence to the signals provided to the primary winding, the receiver reconstructing the received logic signal from the received signals.

Abstract: An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary.

Abstract: The invention is directed to a digital isolation system including an isolation barrier, a transmitter circuit receiving an input signal and transmitting a positive pulse upon detecting a first type of edge in the input signal and transmitting a negative pulse upon receipt of a second type of edge in the input signal and a receiver circuit receiving the transmitted signals, removing noise in the received signal and reconstructing the input signal using a differential comparator.

Abstract: An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary.