Abstract: Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

Abstract: Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

Abstract: Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

Abstract: Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

Abstract: The invention relates to the electrolytic plating of tin and lead metals and particularly to tin-lead alloys by dissolving divalent tin or lead compounds in an excess of a lower alkyl sulfonic acid or acid salt. The electrolytic bath comprises such additives as benzal acetone, benzaldehyde or derivatives thereof, aromatic pyridines; surfactants such as betaines, alkylene oxides polymers, imidazolinium compounds and quaternary ammonium salts and formaldehyde.

Abstract: A process and bath for electroplating tin, lead and tin-lead alloys. Improved brightness, solderability and broader current density ranges are achieved by the use in the baths of a soluble alkylene oxide condensate to provide a cloud point of the bath above about 90.degree. F., a soluble bismuth compound, an aromatic aldehyde and acetaldehyde. Tin and lead are supplied to the bath as salts of alkyl or alkylol sulfonic acids with sufficient free alkyl or alkylol sulfonic acid to provide a bath pH of less than 3.

Abstract: A bath for the electrodeposition of bright tin-lead alloys which comprises an aqueous acidic bath containing at least one soluble tin compound and one soluble lead compound to which there has been added:A. a lower alkylene oxide condensation product, andB. an effective amount of at least one pyridine or quinoline compound having the structure ##STR1## wherein the substituents R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each is a hydrogen or halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (C.sub.n H.sub.2n --CO.sub.2 H in which n has a value from 0 to 6 or a carbamide radical or R.sub.4 and R.sub.5 combined form a divalent radical to provide a compound having the structure ##STR2## in which R.sub.6 is nothing or a hydroxyl radical; Z is nothing, 0.sup.- or a quaternary ammonium forming hydrocarbon radical provided that when Z is nothing, at least one of the substituents R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.

Abstract: The method of preventing or inhibiting diffusion of a base metal into an electrodeposited gold layer on said base metal which comprises electrodepositing a barrier layer on the base metal comprising a tungsten-cobalt alloy or a tungsten-nickel alloy and subsequently electrodepositing gold on the alloy barrier layer. The invention also includes the use of chelating agents in tungsten-cobalt and tungsten-nickel plating baths.