Patents by Inventor Benjamin Sonnenreich

Benjamin Sonnenreich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding Tool With Improved Finish
    Publication number: 20080314963
    Abstract: A bonding tool includes a body portion terminating at a tip portion. The tip portion is formed from a material, wherein a grain structure of the material is exposed for at least a portion of the tip portion.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 25, 2008
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Harel Itzhaky, Giyora Gur, Benjamin Sonnenreich, Ziv Atzmon
  • Bonding tool with polymer coating
    Patent number: 7077304
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: July 18, 2006
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon
  • Bonding tool with polymer coating
    Publication number: 20050077339
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Application
    Filed: December 3, 2004
    Publication date: April 14, 2005
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon
  • Bonding tool with polymer coating
    Publication number: 20040164129
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Application
    Filed: February 25, 2004
    Publication date: August 26, 2004
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon
  • Bonding tool with polymer coating
    Patent number: 6729527
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: May 4, 2004
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon
  • Ultra fine pitch capillary
    Patent number: 6715658
    Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cylindrical section, ii) a working face with a first annular chamfer formed at an outside portion of an end of the working tip and, iii) a second annular chamfer formed at an inside portion of the end of the working tip. The first and second annular chamfer adjacent one another and a substantially cylindrical axial passage coupled to an upper portion of the second annular chamfer. The bonding tool is formed from a material containing at least 80% ZrO2 by weight.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: April 6, 2004
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Gil Perlberg, Ziv Atsmon, Benjamin Sonnenreich, Arie Bahalui
  • Ultra fine pitch capillary
    Publication number: 20030015567
    Abstract: A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cylindrical section, ii) a working face with a first annular chamfer formed at an outside portion of an end of the working tip and, iii) a second annular chamfer formed at an inside portion of the end of the working tip. The first and second annular chamfer adjacent one another and a substantially cylindrical axial passage coupled to an upper portion of the second annular chamfer.
    Type: Application
    Filed: July 17, 2001
    Publication date: January 23, 2003
    Inventors: Gil Perlberg, Ziv Atsmon, Benjamin Sonnenreich, Arie Bahalul
  • Bonding tool with polymer coating
    Publication number: 20020100790
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon