Abstract: A semiconductor device with a stacked power converter is described. In some examples, a semiconductor device includes: a first integrated circuit (IC) die having bond pads and solder bumps, the bond pads configured for wire-bonding; and a second IC die mounted on the first IC die, the second IC die having an active side and a backside opposite the active side, the second IC die including bond pads on the active side configured for wire-bonding, and solder bumps disposed on a backside opposite the active side; where the solder bumps of the first IC die are electrically and mechanically coupled to the solder bumps of the second IC die to form bump bonds.

Abstract: A configurable multiplier circuit for multiplying both real and complex numbers is included in a PLD. In one embodiment, the circuit includes two adder trees. Multiplexers are used such that a conventional multiplier component is not required. The circuit is programmable to operate in one of two modes. In a first mode, the circuit multiplies the four parts of two complex numbers and outputs two values, the real portion of the product and the imaginary portion of the product. In a second mode, each of two portions of the circuit multiplies two pairs of real numbers and outputs the products.

Abstract: Described is a programmable logic device (PLD) with columns of DSP slices that can be cascaded to create DSP circuits of varying size and complexity. Each slice includes a mode port that receives mode control signals for dynamically altering the function and connectivity of related slices. Such alterations can occur with or without reconfiguring the PLD.

Abstract: A semiconductor assembly with an integrated circuit (IC) and a companion device. An exemplary semiconductor assembly includes a printed circuit board (PCB) and first and second ICs. The PCB has first contacts on a top surface and second contacts on a bottom surface. The first contacts are vertically aligned with the second contacts and are electrically coupled by vias in the PCB. The first IC has first terminals respectively coupled to the first contacts of the PCB, the first terminals including first input/output (IO) terminals. The second IC includes at least one die, and second terminals coupled to at least a portion of the second contacts of the PCB. The second terminals include second IO terminals of the companion die, and are respectively coupled to those of the second contacts that are vertically aligned with those of the first contacts respectively coupled to the first IO terminals.

Abstract: Method and apparatus for communicating data between vertically stacked integrated circuits is described. In some examples, a method of configuring an integrated circuit which is a first die includes obtaining configuration data at configuration resources of the integrated circuit from a non-volatile memory on a second die through an integration tile of the integrated circuit, the second die being vertically stacked on the first die; storing the configuration data in at least one register as the configuration data is obtained by the configuration resources; and loading the configuration data from the at least one register to a configuration memory of the integrated circuit to configure programmable resources of the integrated circuit.

Abstract: An embodiment of a method to form a hybrid integrated circuit device is described. This embodiment of the method comprises: forming a first die using a first lithography, where the first die is on a substrate; and forming a second die using a second lithography, where the second die is on the first die. The first lithography used to form the first die is a larger lithography than the second lithography used to form the second die. The first die is an IO die.

Abstract: Method and apparatus for inter-IC communication are described. In some examples, an integrated circuit (IC) includes core circuitry configured to process input data and provide output data; input/output (IO) circuitry configured to receive the input data, and transmit the output data; a control circuit configured to provide a selection signal; and an inter-IC communication port coupled between the core circuitry and the IO circuitry and configured to pass the input data and the output data, the inter-IC communication port having a memory interface and a memory controller, the inter-IC communication port configured to selectively couple either the memory interface or the memory controller between the core circuitry and the IO circuitry responsive to the selection signal.

Abstract: A semiconductor device with a stacked power converter is described. In some examples, a semiconductor device includes: a first integrated circuit (IC) die having bond pads and solder bumps, the bond pads configured for wire-bonding; and a second IC die mounted on the first IC die, the second IC die having an active side and a backside opposite the active side, the second IC die including bond pads on the active side configured for wire-bonding, and solder bumps disposed on a backside opposite the active side; where the solder bumps of the first IC die are electrically and mechanically coupled to the solder bumps of the second IC die to form bump bonds.

Abstract: An integrated circuit die is described that includes an array of tiles arranged in columns. The integrated circuit die includes interface tiles having at least one row of through die vias. The integrated circuit die includes metal layers that include horizontal wiring tracks and metal layers that include vertical wiring tracks. At least some of the metal layers having vertical wiring segments include horizontal wiring segments. Each horizontal wiring segment is coupled to a first wiring segment of a horizontal wiring track that is interrupted by the at least one row of through die vias and is coupled to a second wiring segment of the horizontal wiring track that is interrupted by the at least one row of through die vias. Each horizontal wiring segment extends between the at least one row of through die vias and at least one row of through die vias in an adjoining interface tile.

Abstract: A programmable device with contact via programming to reduce leakage current and a method for reducing standby power for such programmable device are described. Configuration memory cells are identified responsive to instantiation of a user design in a test platform of the programmable device. The programmable device is via programmed during manufacturing thereof to not couple for programmability a first portion of the configuration memory cells and to form a first portion of the user design associated with the first portion of the configuration memory cells as hard-wired and to couple for programmability a second portion of the configuration memory cells for subsequent instantiation of a second portion of the user design in the programmable device.

Abstract: A method and system are disclosed. The system includes a trusted loader. The method includes downloading an IP core from a vendor to a target device. The IP core is received in an encrypted form at the target device, which can be, for example, a programmable logic device.

Abstract: An embodiment of a method to form a hybrid integrated circuit device is described. This embodiment of the method comprises: forming a first die using a first lithography, where the first die is on a substrate; and forming a second die using a second lithography, where the second die is on the first die. The first lithography used to form the first die is a larger lithography than the second lithography used to form the second die. The first die is an IO die.

Abstract: A software model (620) of a stacked integrated circuit system (600) includes a first integrated circuit die (602) connected to a second integrated circuit die (604) through an interchip communication interface (606). A software model of the first integrated circuit die includes an integrated circuit resource (614) and an internal interface (150). A software model of the second integrated circuit die includes a stacked resource (618). The software model of the internal interface is configurable to connect the stacked resource of the second integrated circuit die to the integrated circuit resource through the interchip communication interface.

Abstract: Formation of a hybrid integrated circuit device is described. A design for the integrated circuit is obtained and separated into at least two portions responsive to component sizes. A first die is formed for a first portion of the hybrid integrated circuit device using at least in part a first minimum dimension lithography. A second die is formed for a second portion of the device using at least in part a second minimum dimension lithography, where the second die has the second minimum dimension lithography as a smallest lithography used for the forming of the second die. The first die and the second die are attached to one another via coupling interconnects respectively thereof to provide the hybrid integrated circuit device.

Abstract: A digital signal processing circuit including: a multiplier circuit; a plurality of multiplexers coupled to the multiplier circuit and controlled by a first opcode; and an arithmetic logic unit coupled to plurality of multiplexers and controlled by a second opcode.

Abstract: An integrated circuit having a digital signal processing (DSP) circuit is disclosed. The DSP circuit includes: a plurality of multiplexers receiving a first set, second set, and third set of input data bits, where the plurality of multiplexers are coupled to a first opcode register; a bitwise adder coupled to the plurality of multiplexers for generating a sum set of bits and a carry set of bits from bitwise adding together the first, second, and third set of input data bits; and a second adder coupled to the bitwise adder for adding together the sum set of bits and carry set of bits to produce a summation set of bits and a plurality of carry-out bits, where the second adder is coupled to a second opcode register.

Abstract: A digital signal processing block having: 1) a first digital signal processing element including: a first multiplexer of a first plurality of multiplexers, the first multiplexer selecting between a first data input and a first zero constant input; and a first arithmetic unit coupled to the first plurality of multiplexers, the first arithmetic logic unit configured for addition; and 2) a second digital signal processing element including: a second multiplexer of a second plurality of multiplexers, the second multiplexer selecting between a second data input and a second zero constant input; and a second arithmetic unit coupled to the second plurality of multiplexers and to a third multiplexer of the first plurality of multiplexers, the second arithmetic unit configured for addition.

Abstract: A method for detecting a pattern from an arithmetic logic unit (ALU) in an integrated circuit. The method includes the steps of: generating an output from an ALU; bitwise comparing the ALU output to a pattern to produce a first output; inverting the pattern and comparing the ALU output with the inverted pattern to produce a second output; bitwise masking the first and second outputs using a mask of a plurality of masks to produce third and fourth output bits; combining the third and fourth output bits to produce first and a second output comparison bits; and storing the first and second output comparison bits in a memory.

Abstract: An integrated circuit (IC) for convergent rounding including: an adder circuit configured to produce a summation; a comparison circuit configured to bitwise compare the summation with an input pattern, bitwise mask the comparison using a mask, and combine the masked comparison to produce a comparison bit; and rounding circuitry for rounding the summation based at least in part on the comparison bit.

Abstract: A physical floorplan for a digital signal processing (DSP) block including; an interconnect column having a plurality of programmable interconnect elements; a first DSP element having a plurality of first columns, a first output register column of the plurality of first columns positioned adjacent to the interconnect column; and a second DSP element, having a plurality of second columns a second output register column of the plurality of second columns positioned adjacent to the interconnect column.