Abstract: A light fixture, e.g., as an artificial skylight, in which light within a region defined by x, y color coordinates (0.37, 0.34), (0.35, 0.38), (0.15, 0.20), and (0.20, 0.14) exits a first light engine, and light within a region defined by coordinates (0.29, 0.32), (0.32, 0.29), (0.41, 0.36), (0.48, 0.39), (0.48, 0.43), (0.40, 0.41), and (0.35, 0.38) exits a second light engine. Also, light fixtures in which a second light engine comprises a sidewall, and light exiting a first light engine passes through space defined by the sidewall; light fixtures in which first and second light engines are able to output light providing different CS values at a luminance; light fixtures in which light incident on a surface of the fixture and cumulative light exiting the fixture have different color points; light fixtures in which light distribution characteristics of light engines differ; and/or other features. The invention also relates to corresponding methods.

Abstract: A solid state lighting device includes at least one electrically activated solid state light emitter configured to stimulate emissions of first through third lumiphoric materials having peak wavelengths in ranges of from 485 nm to 530 nm, from 575 nm to 595 nm, and from 605 nm to 640 nm, respectively (or subranges thereof defined herein), with the third peak having a full width half maximum value of less than 60 nm. The resulting device generates aggregated emissions having a suitably high color rendering index (e.g., CRI Ra) value (e.g., at least 70), and also having a spectral power distribution with a Melanopic/Photopic ratio within a specified target range as a function of correlated color temperature, thereby providing increased perceived brightness.

Abstract: A light fixture, e.g., as an artificial skylight, in which light within a region defined by x, y color coordinates (0.37, 0.34), (0.35, 0.38), (0.15, 0.20), and (0.20, 0.14) exits a first light engine, and light within a region defined by coordinates (0.29, 0.32), (0.32, 0.29), (0.41, 0.36), (0.48, 0.39), (0.48, 0.43), (0.40, 0.41), and (0.35, 0.38) exits a second light engine. Also, light fixtures in which a second light engine comprises a sidewall, and light exiting a first light engine passes through space defined by the sidewall; light fixtures in which first and second light engines are able to output light providing different CS values at a luminance; light fixtures wherein light incident on a surface of the fixture and cumulative light exiting the fixture have different color points; light fixtures wherein light distribution characteristics of light engines differ; and/or other features. The invention also relates to corresponding methods.

Abstract: A solid state lighting device includes at least one electrically activated solid state light emitter configured to stimulate emissions of first through third lumiphoric materials having peak wavelengths in ranges of from 485 nm to 530 nm, from 575 nm to 595 nm, and from 605 nm to 640 nm, respectively (or subranges thereof defined herein), with the third peak having a full width half maximum value of less than 60 nm. The resulting device generates aggregated emissions having a suitably high color rendering index (e.g., CRI Ra) value (e.g., at least 70), and also having a spectral power distribution with a Melanopic/Photopic ratio within a specified target range as a function of correlated color temperature, thereby providing increased perceived brightness.

Abstract: A luminaire includes a first waveguide having a first primary light emitting surface directed in a first direction and a first secondary light emitting surface directed in a second direction. A second waveguide having a second primary light emitting surface directed in the second direction and a second secondary light emitting surface directed in the first direction. A first plurality of LEDs are optically coupled to the first waveguide and a second plurality of LEDs are optically coupled to the second waveguide. The first and second waveguides are independently operable. The first and second plurality of LEDs may comprise LED groups where each of the LED groups are independently controllable. The light emission pattern and light properties of the emitted light are controllable.

Abstract: Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional (e.g. Lambertian) pattern of the LEDs to a more omni-directional pattern.

Abstract: A light emitting device or array comprising a submount having a top surface, a bottom surface and a plurality of edges, with input and output terminals disposed on the top surface. A plurality of attach pads and traces are also disposed on the top surface and electrically connected between the input and output terminals. A plurality of LEDs are also included, each of which is mounted to one of the attach pads. The attach pads cover more of the top surface than the LEDs and spread heat from the LEDs to the top surface of the submount. A plurality of lenses are also included each of which is molded over a respective one of the attach pads and covers the LED mounted to the particular attach pad. The arrays are shaped and arranged so that they can be easily attached to similar arrays in a tiling fashion, with the desired number of arrays included to meet the desired lighting requirements. Methods for fabricating the arrays from a single submount or submounts panel are also disclosed.

Abstract: A low profile lighting module. Devices according to this disclosure can produce a uniform light intensity output profile, limiting the perceived appearance of individual point sources, from direct lighting modules comprising several light emitting diodes. Individual lighting device components are disclosed that can contribute to this uniform profile, including: primary optics, secondary optics, and contoured housing elements. These components can interact with and control emitted light, thus adjusting its pattern. These components can alter the direction of emitted light, providing a more uniform light intensity over a wider range of viewing angle.

Abstract: A wire-bond free semiconductor device with two electrodes both of which are accessible from the bottom side of the device. The device is fabricated with two electrodes that are electrically connected to the oppositely doped epitaxial layers, each of these electrodes having leads with bottom-side access points. This structure allows the device to be biased with an external voltage/current source, obviating the need for wire-bonds or other such connection mechanisms that must be formed at the packaging level. Thus, features that are traditionally added to the device at the packaging level (e.g., phosphor layers or encapsulants) may be included in the wafer level fabrication process. Additionally, the bottom-side electrodes are thick enough to provide primary structural support to the device, eliminating the need to leave the growth substrate as part of the finished device.

Abstract: Emitter packages are disclosed having a thixotropic agent or material, with the encapsulant exhibiting significant reduction of thixotropic agent scattering. The packages exhibit a corresponding reduction or elimination of encapsulant clouding and increased package emission efficiency. This allows for the thixotropic agents to be included in the encapsulant to alter certain properties (e.g. mechanical or thermal) while not significantly altering the optical properties of the encapsulant. One embodiment of a light emitting diode (LED) package according to the present invention comprises an LED chip with an encapsulant over the LED chip. The encapsulant has an encapsulant refractive index and also has a thixotropic material with a refractive index that is substantially the same as the encapsulant refractive index.

Abstract: A light fixture, e.g., as an artificial skylight, in which light within a region defined by x, y color coordinates (0.37, 0.34), (0.35, 0.38), (0.15, 0.20), and (0.20, 0.14) exits a first light engine, and light within a region defined by coordinates (0.29, 0.32), (0.32, 0.29), (0.41, 0.36), (0.48, 0.39), (0.48, 0.43), (0.40, 0.41), and (0.35, 0.38) exits a second light engine. Also, light fixtures in which a second light engine comprises a sidewall, and light exiting a first light engine passes through space defined by the sidewall; light fixtures in which first and second light engines are able to output light providing different CS values at a luminance; light fixtures in which light incident on a surface of the fixture and cumulative light exiting the fixture have different color points; light fixtures in which light distribution characteristics of light engines differ; and/or other features. Also, methods.

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio.

Abstract: The invention relates to a method for producing a trim element for vehicles which has a genuine carbon appearance, comprising a carbon fiber layer which is arranged on an exposed side of the trim element and is visible from the outside, and which is made of a fiber structure composed of prefabricated carbon fibers with interstices, with the method comprising at least the process step of wet impregnating the prefabricated carbon fiber layer with an aqueous polymer dispersion based on polyurethane, acrylate or polyvinyl acetate or a mixture thereof, so that the polymer dispersion penetrates at least partially into the carbon fiber layer, increasing the suitability thereof for penetration of a coating into the interstices of the fiber structure of the carbon layer.

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.

Abstract: A luminaire includes a first waveguide having a first primary light emitting surface directed in a first direction and a first secondary light emitting surface directed in a second direction. A second waveguide having a second primary light emitting surface directed in the second direction and a second secondary light emitting surface directed in the first direction. A first plurality of LEDs are optically coupled to the first waveguide and a second plurality of LEDs are optically coupled to the second waveguide. The first and second waveguides are independently operable. The first and second plurality of LEDs may comprise LED groups where each of the LED groups are independently controllable.

Abstract: An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

Abstract: The present disclosure is directed to LED components, and systems using such components, having a light emission profile that may be controlled independently of the lens shape by varying the position and/or orientation of LED chips with respect to one or both of an overlying lens and the surface of the component. For example, the optical centers of the LED emitting surface and the lens, which are normally aligned, may be offset from each other to generate a controlled and predictable emission profile. The LED chips may be positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The use of offset emitters allows for LED components with shifted or tilted emission patterns, without causing output at high angles of the components. This is beneficial as it allows a lighting system to have tilted emission from the LED component and primary optics.

Abstract: A stabilized quantum dot structure for use in a light emitting diode (LED) comprises, according to one embodiment, a luminescent particle comprising one or more semiconductors, a buffer layer overlying the luminescent particle, where the buffer layer comprises an amorphous material, and a barrier layer overlying the buffer layer, where the barrier layer comprises oxygen, nitrogen and/or carbon. According to another embodiment, the stabilized quantum dot structure includes a luminescent particle comprising one or more semiconductors, and a treated buffer layer comprising amorphous silica overlying the luminescent particle, where the stabilized quantum dot structure exhibits a quantum yield of at least about 0.7 when exposed to a blue light flux of about 30 W/cm2 at a temperature of 80-85° C. and relative humidity of 5% for 500 hours.

Abstract: A lighting apparatus including an LED light emitter having an axis. The apparatus comprising a first lens over the emitter a second lens spaced over the first lens. The first lens is configured to direct LED-emitted light primarily toward a preferential radial side with respect to the emitter axis. The first lens may be an asymmetric primary lens. The first lens may have a centerline which is offset from the emitter axis toward the preferential radial side. Alternatively or in addition, the first lens may have an outer surface configured to direct LED-emitted light primarily toward the preferential radial side. The second lens may be asymmetric and be configured to further direct the light primarily toward the preferential radial side. The secondary lens may include inner and outer surfaces each shaped to direct received light primarily toward the preferential side.

Abstract: A wire-bond free semiconductor device with two electrodes both of which are accessible from the bottom side of the device. The device is fabricated with two electrodes that are electrically connected to the oppositely doped epitaxial layers, each of these electrodes having leads with bottom-side access points. This structure allows the device to be biased with an external voltage/current source, obviating the need for wire-bonds or other such connection mechanisms that must be formed at the packaging level. Thus, features that are traditionally added to the device at the packaging level (e.g., phosphor layers or encapsulants) may be included in the wafer level fabrication process. Additionally, the bottom-side electrodes are thick enough to provide primary structural support to the device, eliminating the need to leave the growth substrate as part of the finished device.