Patents by Inventor Bernhard A. Ziegner

Bernhard A. Ziegner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6828875
    Abstract: A spatial power divider/combiner that comprises: a housing containing a first channel forming three sides of a rectangular input waveguide and a second channel forming three sides of a rectangular output waveguide; a board coupled to the housing, wherein the underside of the board forms the fourth side of the input and output waveguides; a series of slots etched on the underside of the board located in the input waveguide to divide an input signal; a series of slots etched on the underside of the board located in the output waveguide to recombine the divided signal; and a series of microstrip lines printed on the top side of the board to couple the input waveguide and the output waveguide. Additionally, the divider/combiner can comprise a series of active devices, such as MMIC power amplifier, to provide a spatial power amplifier.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: December 7, 2004
    Assignee: MIA-Com, Inc.
    Inventors: Eswarappa Channabasappa, Thongchai Hongsmatip, Noyan Kinayman, Richard Alan Anderson, Bernhard A. Ziegner
  • Publication number: 20040108903
    Abstract: A spatial power divider/combiner that comprises: a housing containing a first channel forming three sides of a rectangular input waveguide and a second channel forming three sides of a rectangular output waveguide; a board coupled to the housing, wherein the underside of the board forms the fourth side of the input and output waveguides; a series of slots etched on the underside of the board located in the input waveguide to divide an input signal; a series of slots etched on the underside of the board located in the output waveguide to recombine the divided signal; and a series of microstrip lines printed on the top side of the board to couple the input waveguide and the output waveguide. Additionally, the divider/combiner can comprise a series of active devices, such as MMIC power amplifier, to provide a spatial power amplifier.
    Type: Application
    Filed: December 9, 2002
    Publication date: June 10, 2004
    Inventors: Eswarappa Channabasappa, Thongchai Hongsmatip, Noyan Kinayman, Richard Alan Anderson, Bernhard A. Ziegner
  • Patent number: 6271792
    Abstract: An antenna has a relatively thick primary dielectric between a ground plane and a conducting radiating element being fed by a conducting transmission line, first and second thin dielectrics on opposite sides of the primary dielectric, the relatively thick primary dielectric having a relatively lower dielectric constant than that of at least the second thin dielectric to increase the bandwidth transmission capability of the transmission line for a given impedance, the second thin dielectric couples substantially less power than is coupled with the primary dielectric and the second thin dielectric is of relatively higher dielectric constant promoting surface wave coupling and reduction of wave losses.
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: August 7, 2001
    Assignee: The Whitaker Corp.
    Inventors: Robert John Sletten, Eric Andrew Soshea, Walter Leo Storkus, Bernhard A. Ziegner
  • Patent number: 4768079
    Abstract: A two-terminal field effect transistor device which is capable of operation as an oscillator including a field effect transistor connected in a two-terminal manner. The transistor has the usual drain source and gate electrodes and oscillating instability is provided by means of an inductance means of value so as to provide this circuit instability to enable circuit oscillations. The two-terminal arrangement is enabled by means of essentially interconnecting the gate and drain electrodes by way of said inductance means.
    Type: Grant
    Filed: October 13, 1987
    Date of Patent: August 30, 1988
    Assignee: M/A Com, Inc.
    Inventors: Pramode Kandpal, Jean C. Collinet, Bernhard A. Ziegner, James A. Bowen
  • Patent number: 4611186
    Abstract: Electrical coupling to the ground plane of an MIC is accomplished by forming a gap adjacent an edge of the ground plane and causing a virtual short to appear across the gap. A two part, one-half wavelength transmission line transformer is used to provide the virtual short. The transformer is defined by the conductive members surrounding the MIC and is open at the end corresponding to the gap and shorted at the other end. The impedances of the two parts of the transformer are chosen to maximize the bandwidth of the virtual short.
    Type: Grant
    Filed: July 29, 1985
    Date of Patent: September 9, 1986
    Assignee: Motorola, Inc.
    Inventor: Bernhard A. Ziegner
  • Patent number: 4543544
    Abstract: An apparatus and method is disclosed for allowing faster and higher fidelity signals to be transmitted from a PC board to an IC by maintaining a constant impedance from the PC board to the IC. A leadless chip connector is used with a ground plane mounted co-planar to the conductor. As the conductor and ground planes extend toward the IC they decrease in width and the distance between the conductor and ground plane varies to maintain a constant impedance.
    Type: Grant
    Filed: January 4, 1984
    Date of Patent: September 24, 1985
    Assignee: Motorola, Inc.
    Inventor: Bernhard A. Ziegner
  • Patent number: 4167413
    Abstract: A hybrid integrated circuit package and a method for fabricating the package. The package comprises a ceramic substrate having a blank metallization and feedthroughs screen printed thereon. A ceramic seal ring is joined to the substrate to form the side walls of the package. The substrate metallization is plated with nickel and gold and external leads are brazed to the ends of the feedthroughs. As such the package is suitable for use with a large number of different integrated circuits. The package can be adapted for use with a particular integrated circuit function by selectively patterning the blank substrate metallization. This is accomplished by laminating a preformed piece of dry film photoresist material to the package bottom. This piece of photoresist is then exposed through a photographic mask using a collimated light source.
    Type: Grant
    Filed: November 14, 1977
    Date of Patent: September 11, 1979
    Assignee: Motorola, Inc.
    Inventors: Allen E. Christ, Dennis R. Sprague, Bernhard A. Ziegner
  • Patent number: 4023198
    Abstract: A semiconductor packaging configuration is described in which a heat sink is bonded to a semiconductor chip or die and a conductor is bonded to the die and a metalized ceramic insulating body for achieving optimum heat transfer. Additionally, electrical matching and/or reduction of parasitic elements is achieved by a low pass matching filter comprising the capacitance of the chip or die, the capacitance of the metalized ceramic body and the inductance of the electrical conductor. This provides a significant improvement in power handling capabilities of a semiconductor chip or die operating at elevated temperatures and gigahertz frequencies. The electrical conductor geometry and its bonds provide a reduction of the thermal resistance of the package and also provides the inductance which forms part of the low pass matching filter.
    Type: Grant
    Filed: May 17, 1976
    Date of Patent: May 10, 1977
    Assignee: Motorola, Inc.
    Inventors: Hugh R. Malone, Michael L. Matson, Bernhard A. Ziegner