Patents by Inventor Bernhard Gehl

Bernhard Gehl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11554952
    Abstract: A method for closing openings in a flexible diaphragm of a MEMS element. The method includes: providing at least one opening in the flexible diaphragm, situating sealing material in the area of the at least one opening, melting-on at least the applied sealing material in the area of the at least one opening, and subsequently cooling the melted-on material to close the at least one opening.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: January 17, 2023
    Assignee: Robert Bosch GmbH
    Inventors: Bernhard Gehl, Christoph Hermes, Juergen Butz
  • Publication number: 20210229983
    Abstract: A method for closing openings in a flexible diaphragm of a MEMS element. The method includes: providing at least one opening in the flexible diaphragm, situating sealing material in the area of the at least one opening, melting-on at least the applied sealing material in the area of the at least one opening, and subsequently cooling the melted-on material to close the at least one opening.
    Type: Application
    Filed: December 20, 2018
    Publication date: July 29, 2021
    Inventors: Bernhard Gehl, Christoph Hermes, Juergen BUTZ
  • Patent number: 11012789
    Abstract: A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: May 18, 2021
    Assignees: Akustica, Inc., Robert Bosch GmbH
    Inventors: Christoph Hermes, Bernhard Gehl, Arnim Hoechst, Daniel Meisel, Andrew Doller, Yujie Zhang, Gokhan Hatipoglu
  • Patent number: 10981777
    Abstract: A MEMS transducer system includes a MEMS transducer device for sensing at least one of pressure signal or acoustic signal. The MEMS transducer device includes first and second diaphragms. Formed between the diaphragms are a spacer, plate capacitor elements, and electrode elements. The plate capacitor elements are coupled to the diaphragms via the spacer. An optional member may be disposed within the spacer. The distal ends of the electrode elements are coupled to a structure such as insulator element. An optional oxides may be formed within the plate capacitor elements. Pressure sensing electrode formed between the diaphragms may be coupled to the insulator element.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: April 20, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Andrew Doller, Gokhan Hatipoglu, Yujie Zhang, Bernhard Gehl, Daniel Christoph Meisel
  • Patent number: 10934160
    Abstract: A system includes a pressure sensor combined with a MEMS microphone. The pressure sensor and the MEMS microphone arranged side by side are formed on a same substrate.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: March 2, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Andrew Doller, Gokhan Hatipoglu, Yujie Zhang, Bernhard Gehl, Daniel Christoph Meisel
  • Patent number: 10793430
    Abstract: A method for producing thin MEMS wafers including: (A) providing an SOI wafer having an upper silicon layer, a first SiO2 layer and a lower silicon layer, the first SiO2 layer being situated between the upper silicon layer and the lower silicon layer, (B) producing a second SiO2 layer on the upper silicon layer, (C) producing a MEMS structure on the second SiO2 layer, (D) introducing clearances into the lower silicon layer down to the first SiO2 layer, (E) etching the first SiO2 layer and thus removing the lower silicon layer.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: October 6, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Sebastien Loiseau, Arnim Hoechst, Bernhard Gehl, Eugene Moliere Tanguep Njiokep, Sandra Altmannshofer
  • Patent number: 10555090
    Abstract: A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: February 4, 2020
    Assignees: Akustica, Inc., Robert Bosch GmbH
    Inventors: Jochen Reinmuth, Vijaye Rajaraman, Daniel Meisel, Bernhard Gehl
  • Patent number: 10555088
    Abstract: A microphone system includes first diaphragm element, second diaphragm element spaced apart from the first diaphragm element and connected to the first diaphragm element via a spacer. Disposed between the diaphragm elements is a plate capacitor element.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: February 4, 2020
    Assignees: Akustica, Inc., Robert Bosch GmbH
    Inventors: Daniel Meisel, Bernhard Gehl, Yujie Zhang, Andrew Doller, Gokhan Hatipoglu
  • Publication number: 20190389721
    Abstract: A MEMS transducer system includes a MEMS transducer device for sensing at least one of pressure signal or acoustic signal. The MEMS transducer device includes first and second diaphragms. Formed between the diaphragms are a spacer, plate capacitor elements, and electrode elements. The plate capacitor elements are coupled to the diaphragms via the spacer. An optional member may be disposed within the spacer. The distal ends of the electrode elements are coupled to a structure such as insulator element. An optional oxides may be formed within the plate capacitor elements. Pressure sensing electrode formed between the diaphragms may be coupled to the insulator element.
    Type: Application
    Filed: November 27, 2017
    Publication date: December 26, 2019
    Inventors: Andrew Doller, Gokhan Hatipoglu, Yujie Zhang, Bernhard Gehl, Daniel Christoph Meisel
  • Publication number: 20190352176
    Abstract: A system includes a pressure sensor combined with a MEMS microphone. The pressure sensor and the MEMS microphone arranged side by side are formed on a same substrate.
    Type: Application
    Filed: November 17, 2017
    Publication date: November 21, 2019
    Inventors: Andrew Doller, Gokham Hatipoglu, Yujie Zhang, Bernhard Gehl, Daniel Christoph Meisel
  • Patent number: 10349188
    Abstract: A Microelectromechanical system (MEMS) microphone comprises a base unit and a driving system disposed on the base unit. The driving system comprises a first diaphragm, a second diaphragm spaced apart from the first diaphragm, and a comb finger counter electrode assembly comprising a moving electrode member, the counter electrode assembly is mechanically coupled to the first and second diaphragms. The driving system further comprises a side wall mechanically coupled the first diaphragm to the second diaphragm defining a sealed electrode region and the sealed electrode region having an encapsulated gas pressure and the comb finger counter electrode assembly is disposed within the sealed electrode region.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: July 9, 2019
    Assignees: Akustica, Inc., Robert Bosch GmbH
    Inventors: Daniel C. Meisel, Bernhard Gehl, Yujie Zhang, Andrew Doller, Gokhan Hatipoglu
  • Publication number: 20190116429
    Abstract: A Microelectromechanical system (MEMS) microphone comprises a base unit and a driving system disposed on the base unit. The driving system comprises a first diaphragm, a second diaphragm spaced apart from the first diaphragm, and a comb finger counter electrode assembly comprising a moving electrode member, the counter electrode assembly is mechanically coupled to the first and second diaphragms. The driving system further comprises a side wall mechanically coupled the first diaphragm to the second diaphragm defining a sealed electrode region and the sealed electrode region having an encapsulated gas pressure and the comb finger counter electrode assembly is disposed within the sealed electrode region.
    Type: Application
    Filed: October 18, 2017
    Publication date: April 18, 2019
    Inventors: Daniel C. Meisel, Bernhard Gehl, Yujie Zhang, Andy Doller, Gokhan Hatipoglu
  • Publication number: 20190098418
    Abstract: A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.
    Type: Application
    Filed: June 28, 2018
    Publication date: March 28, 2019
    Inventors: Christoph Hermes, Bernhard Gehl, Arnim Hoechst, Daniel Meisel, Andrew Doller, Yujie Zhang, Gokhan Hatipoglu
  • Publication number: 20190092631
    Abstract: A method for producing thin MEMS wafers including: (A) providing an SOI wafer having an upper silicon layer, a first SiO2 layer and a lower silicon layer, the first SiO2 layer being situated between the upper silicon layer and the lower silicon layer, (B) producing a second SiO2 layer on the upper silicon layer, (C) producing a MEMS structure on the second SiO2 layer, (D) introducing clearances into the lower silicon layer down to the first SiO2 layer, (E) etching the first SiO2 layer and thus removing the lower silicon layer.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 28, 2019
    Inventors: Sebastien Loiseau, Arnim Hoechst, Bernhard Gehl, Eugene Moliere Tanguep Njiokep, Sandra Altmannshofer
  • Patent number: 10183857
    Abstract: In one embodiment, a MEMS sensor includes a first fixed electrode in a first layer, a cavity defined above the first fixed electrode, a membrane extending over the cavity, a first movable electrode defined in the membrane and located substantially directly above the first fixed electrode, and a second movable electrode defined at least partially within the membrane and located at least partially directly above the cavity.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: January 22, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Andrew Graham, Ando Feyh, Bernhard Gehl
  • Publication number: 20180352341
    Abstract: A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.
    Type: Application
    Filed: June 5, 2018
    Publication date: December 6, 2018
    Inventors: Jochen Reinmuth, Vijaye Rajaraman, Daniel Meisel, Bernhard Gehl
  • Publication number: 20180146296
    Abstract: A microphone system includes first diaphragm element, second diaphragm element spaced apart from the first diaphragm element and connected to the first diaphragm element via a spacer. Disposed between the diaphragm elements is a plate capacitor element.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 24, 2018
    Inventors: Daniel Meisel, Bernhard Gehl, Yujie Zhang, Andrew Doller, Gokhan Hatipoglu
  • Patent number: 9758369
    Abstract: A manufacturing method for a MEMS element, by which both a microphone including a microphone capacitor and a pressure sensor including a measuring capacitor are implemented in the MEMS structure. The components of the microphone and pressure sensor are formed in parallel but independently in the layers of the MEMS structure. The pressure sensor diaphragm is structured from a first layer, which functions as a base layer for the microphone diaphragm. The fixed counter-electrode of the measuring capacitor is structured from an electrically conductive second layer which functions as a diaphragm layer of the microphone. The fixed pressure sensor counter-element is structured from third and fourth layers. The third layer functions in the area of the microphone structure as a sacrificial layer, the thickness of which in the area of the microphone structure determines the electrode distance of the microphone capacitor. The microphone counter-element is structured from the fourth layer.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: September 12, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Florian Schoen, Bernhard Gehl
  • Patent number: 9725300
    Abstract: Measures for reducing parasitic capacitances in the layer structure of capacitive MEMS sensor elements, in which parasitic capacitances between bond pads for electrically contacting measuring capacitor electrodes and an electrically conductive layer lying underneath are reduced by these measures. The sensor structure having the measuring capacitor electrodes and bond pads of such MEMS components are in a layer structure on a semiconductor substrate. The carrier layer directly underneath the bond pad structure is uninterrupted in the bond pad region, and the layer structure includes at least one insulation layer by which at least one of the bond pads is electrically insulated from an electrically conductive layer lying underneath. At least one layer under the carrier layer is structured in the region of this bond pad, so that hollow spaces are situated in the layer structure underneath this bond pad, by which the parasitic capacitance between this bond pad and the conductive layer lying underneath is reduced.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: August 8, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Heiko Stahl, Arnim Hoechst, Bernhard Gehl, Rolf Scheben, Benedikt Stein
  • Publication number: 20160304336
    Abstract: A manufacturing method for a MEMS element, by which both a microphone including a microphone capacitor and a pressure sensor including a measuring capacitor are implemented in the MEMS structure. The components of the microphone and pressure sensor are formed in parallel but independently in the layers of the MEMS structure. The pressure sensor diaphragm is structured from a first layer, which functions as a base layer for the microphone diaphragm. The fixed counter-electrode of the measuring capacitor is structured from an electrically conductive second layer which functions as a diaphragm layer of the microphone. The fixed pressure sensor counter-element is structured from third and fourth layers. The third layer functions in the area of the microphone structure as a sacrificial layer, the thickness of which in the area of the microphone structure determines the electrode distance of the microphone capacitor. The microphone counter-element is structured from the fourth layer.
    Type: Application
    Filed: April 14, 2016
    Publication date: October 20, 2016
    Inventors: Florian Schoen, Bernhard Gehl