Patents by Inventor Bert J. Offrein
Bert J. Offrein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10243323Abstract: Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip also includes a deflector arranged on top of the lens element and configured for deflecting light collimated through the latter toward the optical waveguide. The lens element includes electrical conductors connected to the electro-optical component. The electrical conductors of the lens element may for instance include one or more through vias, one or more bottom electrical lines on a bottom side of the lens element (facing the electro-optical component), and at least one top electrical line.Type: GrantFiled: September 12, 2017Date of Patent: March 26, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles Jean Ghislain Caer, Antonio La Porta, Bert J. Offrein
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Publication number: 20180013262Abstract: Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip also includes a deflector arranged on top of the lens element and configured for deflecting light collimated through the latter toward the optical waveguide. The lens element includes electrical conductors connected to the electro-optical component. The electrical conductors of the lens element may for instance include one or more through vias, one or more bottom electrical lines on a bottom side of the lens element (facing the electro-optical component), and at least one top electrical line.Type: ApplicationFiled: September 12, 2017Publication date: January 11, 2018Inventors: Charles Jean Ghislain Caer, Antonio La Porta, Bert J. Offrein
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Patent number: 9793682Abstract: Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip also includes a deflector arranged on top of the lens element and configured for deflecting light collimated through the latter toward the optical waveguide. The lens element includes electrical conductors connected to the electro-optical component. The electrical conductors of the lens element may for instance include one or more through vias, one or more bottom electrical lines on a bottom side of the lens element (facing the electro-optical component), and at least one top electrical line.Type: GrantFiled: November 18, 2015Date of Patent: October 17, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles Jean Ghislain Caer, Antonio La Porta, Bert J. Offrein
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Patent number: 9791642Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.Type: GrantFiled: February 20, 2017Date of Patent: October 17, 2017Assignee: International Business Machines CorporationInventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
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Publication number: 20170160472Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.Type: ApplicationFiled: February 20, 2017Publication date: June 8, 2017Inventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
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Patent number: 9671577Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.Type: GrantFiled: September 9, 2015Date of Patent: June 6, 2017Assignee: International Business Machines CorporationInventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
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Patent number: 9658414Abstract: An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.Type: GrantFiled: December 22, 2015Date of Patent: May 23, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jens Hofrichter, Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Publication number: 20170141533Abstract: Embodiments include a silicon photonic chip having a substrate, an optical waveguide on a surface of the substrate and a cavity. The cavity includes an electro-optical component, configured for emitting light perpendicular to said surface and a lens element arranged on top of the electro-optical component. The lens is configured for collimating light emitted by the electro-optical component. The chip also includes a deflector arranged on top of the lens element and configured for deflecting light collimated through the latter toward the optical waveguide. The lens element includes electrical conductors connected to the electro-optical component. The electrical conductors of the lens element may for instance include one or more through vias, one or more bottom electrical lines on a bottom side of the lens element (facing the electro-optical component), and at least one top electrical line.Type: ApplicationFiled: November 18, 2015Publication date: May 18, 2017Inventors: Charles Jean Ghislain Caer, Antonio La Porta, Bert J. Offrein
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Publication number: 20170068049Abstract: A chip packaging includes a first part comprising a support; and a core polymer layer transversally structured so as to exhibit distinct residual portions comprising: first waveguide cores each having a first height and disposed within said inner region; and one or more first alignment structures disposed within said outer region. A second part of the packaging comprises: second waveguide cores, each having a same second height; and one or more second alignment structures complementarily shaped with respect to the one or more first alignment structures, and wherein, the first part structured such that said inner region is recessed with respect to the outer region, to enable: the second waveguide cores to contact the first waveguide cores; and the one or more second alignment structures to respectively receive, at least partly, the one or more first alignment structures. The invention is further directed to related passive alignment methods.Type: ApplicationFiled: September 9, 2015Publication date: March 9, 2017Inventors: Roger F. Dangel, Daniel S. Jubin, Antonio La Porta, Bert J. Offrein
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Patent number: 9389362Abstract: Embodiments include a method for interconnecting components of an optical circuit. The method includes arranging the components on a support layer and embedding them within a material, such that portions of the material that is between the components contact the support layer. The obtained components are positioned with a certain inaccuracy with respect to ideal nominal positions thereof. Next, the support layer is removed to reveal one side of the components, on which side the components are level with said portions of said material. Positions of the components are identified and a set of optical polymer waveguides are adaptively fabricated, on the one side, so as for each of the fabricated polymer waveguides to optically connect subsets of two or more of the components, according to the identified positions of the components. The present invention is further directed to related optical circuits or electro-optical circuits of interconnected components.Type: GrantFiled: November 16, 2015Date of Patent: July 12, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Antonio La Porta, Bert J. Offrein, Jonas R. Weiss
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Patent number: 9329348Abstract: An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.Type: GrantFiled: September 4, 2013Date of Patent: May 3, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jens Hofrichter, Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Publication number: 20160116689Abstract: An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.Type: ApplicationFiled: December 22, 2015Publication date: April 28, 2016Inventors: Jens Hofrichter, Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Patent number: 9274293Abstract: An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.Type: GrantFiled: October 1, 2013Date of Patent: March 1, 2016Assignee: International Business Machines CorporationInventors: Jens Hofrichter, Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Patent number: 9250393Abstract: Embodiments include methods for connecting a stack of waveguide layers to a face of a ferrule presenting a mechanical alignment structure. The method includes bringing a ferrule in an alignment position and dispersing glue in cavities of mechanical alignment structure for each waveguide layer. The method also includes sliding the waveguide layer into the cavities, inserting a comb-like tool in the ferrule so that the tool presses the waveguide layer into the cavities, glue curing the ferrule, and adding a cover to the ferrule. The mechanical alignment structure comprises mechanical alignment slots arranged in a bidirectional lattice structure.Type: GrantFiled: February 12, 2015Date of Patent: February 2, 2016Assignee: International Business Machines CorporationInventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein
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Patent number: 9179584Abstract: A method of assembling an electro-optical device is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.Type: GrantFiled: August 8, 2012Date of Patent: November 3, 2015Assignee: International Business Machines CorporationInventors: Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Patent number: 9170380Abstract: A ferrule for a multilayer waveguide connector includes a face having mechanical alignment slots arranged in a bidirectional lattice structure, the mechanical alignment slots including first slots disposed in a first direction, the first slots configured to respectively receive one end of waveguide layers, and second slots disposed in a second direction different from the first direction, the second slots configured to respectively receive protrusions transverse from a main surface of the waveguide layers.Type: GrantFiled: February 12, 2015Date of Patent: October 27, 2015Assignee: International Business Machines CorporationInventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein
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Patent number: 9122027Abstract: A method for aligning optical components comprised in an optical component assembly and optical waveguides comprised in an optical waveguide assembly according to a common optical axis and by using an adapter includes providing the optical component assembly with a first alignment structure comprising a cavity designed according to the position of the optical components within the optical component assembly; providing an adapter presenting a base surface comprising a first step structure; providing the optical waveguide assembly with a second alignment structure comprising a distinct step structure designed according to the position of the waveguides within the waveguides assembly; and positioning the optical component assembly, the optical waveguide assembly and the adapter, so that a sidewall of the cavity and the distinct step structure are put in contact with a sidewall of the first step structure.Type: GrantFiled: September 4, 2013Date of Patent: September 1, 2015Assignee: International Business Machines CorporationInventors: Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Patent number: 9122028Abstract: A method for aligning optical components comprised in an optical component assembly and optical waveguides comprised in an optical waveguide assembly according to a common optical axis and by using an adapter includes providing the optical component assembly with a first alignment structure comprising a cavity designed according to the position of the optical components within the optical component assembly; providing an adapter presenting a base surface comprising a first step structure; providing the optical waveguide assembly with a second alignment structure comprising a distinct step structure designed according to the position of the waveguides within the waveguides assembly; and positioning the optical component assembly, the optical waveguide assembly and the adapter, so that a sidewall of the cavity and the distinct step structure are put in contact with a sidewall of the first step structure.Type: GrantFiled: October 1, 2013Date of Patent: September 1, 2015Assignee: International Business Machines CorporationInventors: Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Publication number: 20150219862Abstract: A ferrule for a multilayer waveguide connector includes a face having mechanical alignment slots arranged in a bidirectional lattice structure, the mechanical alignment slots including first slots disposed in a first direction, the first slots configured to respectively receive one end of waveguide layers, and second slots disposed in a second direction different from the first direction, the second slots configured to respectively receive protrusions transverse from a main surface of the waveguide layers.Type: ApplicationFiled: February 12, 2015Publication date: August 6, 2015Inventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein
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Publication number: 20150219859Abstract: A ferrule for a multilayer waveguide connector includes a face having mechanical alignment slots arranged in a bidirectional lattice structure, the mechanical alignment slots including first slots disposed in a first direction, the first slots configured to respectively receive one end of waveguide layers, and second slots disposed in a second direction different from the first direction, the second slots configured to respectively receive protrusions transverse from a main surface of the waveguide layers.Type: ApplicationFiled: February 12, 2015Publication date: August 6, 2015Inventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein