Patents by Inventor Bert S. Hewitt

Bert S. Hewitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package and packaging method
    Patent number: 4953001
    Abstract: A semiconductor device package is provided to enclose a microstrip transmission line having a ground plane separated from a strip conductor by a dielectric and a semiconductor device having an electrode contact thereof bonded to the strip conductor by a conductive interconnect, such package having a bottom portion and a top portion hermetically sealed together along a conductive surface, such strip conductor being spaced between the conductive surface and the conductive interconnect. A method of packaging a semiconductor device and a microstrip transmission line having a ground plane separated from a strip conductor by a dielectric with such strip conductor bonded to an electrode contact of the semiconductor device, such method comprising the step of hermetically sealing a top portion of the package to a bottom portion of the package along a conductive surface, the strip conductor being between the semiconductor device and the conductive surface.
    Type: Grant
    Filed: November 7, 1986
    Date of Patent: August 28, 1990
    Assignee: Raytheon Company
    Inventors: Joseph A. Kaiser, Jr., Bert S. Hewitt