Patents by Inventor Bora YEON

Bora YEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive composition
    Patent number: 11466184
    Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Jang, Sera Kim, Ji Ho Han, Kwang Joo Lee, Bora Yeon, Kwang Su Seo
  • Back grinding tape
    Patent number: 11424153
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 23, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Seon Yoon, Sera Kim, Kwang Joo Lee, Bora Yeon, Sang Hwan Kim, Eun Yeong Kim
  • NON-CONDUCTIVE FILM AND MANUFACTURING METHOD OF SEMICONDUCTOR LAMINATE
    Publication number: 20210388244
    Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 16, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Eun Yeong KIM, You Jin KYUNG, Kwang Joo LEE, Ji Ho HAN, Bora YEON, Mi JANG
  • ADHESIVE COMPOSITION
    Publication number: 20210155831
    Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.
    Type: Application
    Filed: June 17, 2019
    Publication date: May 27, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Mi JANG, Sera KIM, Ji Ho HAN, Kwang Joo LEE, Bora YEON, Kwang Su SEO
  • BACK GRINDING TAPE
    Publication number: 20210035847
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Application
    Filed: June 4, 2019
    Publication date: February 4, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Mi Seon YOON, Sera KIM, Kwang Joo LEE, Bora YEON, Sang Hwan KIM, Eun Yeong KIM
  • BACK GRINDING TAPE
    Publication number: 20200369925
    Abstract: The present invention relates to a back grinding tape including a polymer substrate and an adhesive layer, wherein the adhesive layer includes a (meth)acrylate resin containing 30 to 60% by weight of a repeating unit derived from a monomer or an oligomer having a glass transition temperature of 0° C. or higher, and wherein the adhesive layer has a glass transition temperature of ?20° C. to 10° C., and a method of grinding wafers using the back grinding tape.
    Type: Application
    Filed: January 11, 2019
    Publication date: November 26, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Mi Seon YOON, Se Ra KIM, Kwang Joo LEE, Bora YEON, Sung Chan PARK, Eun Yeong KIM
  • Flexible piezoelectric composite and piezoelectric device including the same
    Patent number: 10147869
    Abstract: Provided is a flexible piezoelectric composite. The flexible piezoelectric composite includes a matrix having first and second polymers, wherein Young's modulus of the first polymer and Young's modulus of the second polymer are different from each other; and a conductive nanostructure disposed in the matrix. In addition, a piezoelectric device including the flexible piezoelectric composite is provided.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: December 4, 2018
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hye Jin Kim, Bora Yeon
  • FLEXIBLE PIEZOELECTRIC COMPOSITE AND PIEZOELECTRIC DEVICE INCLUDING THE SAME
    Publication number: 20170263848
    Abstract: Provided is a flexible piezoelectric composite. The flexible piezoelectric composite includes a matrix having first and second polymers, wherein Young's modulus of the first polymer and Young's modulus of the second polymer are different from each other; and a conductive nanostructure disposed in the matrix. In addition, a piezoelectric device including the flexible piezoelectric composite is provided.
    Type: Application
    Filed: August 18, 2016
    Publication date: September 14, 2017
    Inventors: Hye Jin KIM, Bora YEON
  • Method and apparatus for recovering gene sequence using probe map
    Patent number: 8645078
    Abstract: A method of recovering a nucleic acid sequence using a probe map includes: aligning a probe onto a target sequence based on a result in which the probe is hybridized to the target sequence; determining a representative value representing each aligned position of the probe; and recovering a base sequence of the target sequence by using a probe map to which the determined representative values and base sequence information of the probe are mapped.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: February 4, 2014
    Assignees: Samsung Electronics Co., Ltd., SNU R&DB Foundation
    Inventors: Tae-jin Ahn, Soyeon Ahn, Sung-ho Won, Su-hyeon Kim, Taesung Park, Sung-young Lee, Seung-yeoun Lee, Bora Yeon, Young-ho Park
  • METHOD AND APPARATUS FOR RECOVERING GENE SEQUENCE USING PROBE MAP
    Publication number: 20120173157
    Abstract: A method of recovering a nucleic acid sequence using a probe map includes: aligning a probe onto a target sequence based on a result in which the probe is hybridized to the target sequence; determining a representative value representing each aligned position of the probe; and recovering a base sequence of the target sequence by using a probe map to which the determined representative values and base sequence information of the probe are mapped.
    Type: Application
    Filed: November 23, 2011
    Publication date: July 5, 2012
    Applicants: SNU R&DB FOUNDATION, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-jin AHN, Soyeon AHN, Sung-ho WON, Su-hyeon KIM, Taesung PARK, Sung-young LEE, Seung-yeoun LEE, Bora YEON, Young-ho PARK