Patents by Inventor Bo Wen

Bo Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11342108
    Abstract: Techniques regarding one or more NFC antennas that can comprise vertically stacked coils of electrically conductive material are provided. For example, one or more embodiments described herein can comprise an apparatus, which can comprise can a first substrate layer that can comprise a first coil of electrically conductive material that can be wound in a first direction. The apparatus can also comprise a second substrate layer that can comprise a second coil of electrically conductive material that can be wound in a second direction opposite the first direction. The first substrate layer can be stacked onto the second substrate layer. Also, the first coil of electrically conductive material can be operably coupled to the second coil of electrically conductive material through an interconnection via to form an NFC antenna.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: May 24, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bo Wen, Bing Dang, Rajeev Narayanan
  • Patent number: 11331076
    Abstract: A probe generates a shear wave inside a target tissue, and allows the sear wave to pass through regions of interest sending a tracking pulse to the regions of interest through which the shear wave passes. A receiving circuit and beam-forming unit receive echo information of the tracking pulse. A elasticity related result calculation unit calculates shear wave parameters according to the echo information of the tracking pulse, so as to obtain a corresponding elastic measurement result of the regions of interest and a corresponding relationship between the elastic measurement result and statistical variables and generates graphic marks.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 17, 2022
    Assignee: Shenzhen Mindray Bio-Medical Electronics Co., Ltd.
    Inventors: Shuangshuang Li, Bo Wen
  • Patent number: 11296201
    Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: April 5, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Bo-Wen Hsieh, Yi-Chun Lo, Wen-Jia Hsieh
  • Publication number: 20220103184
    Abstract: A data processing system and method are provided. The data processing system includes: a data acquisition unit, configured to acquire a plurality pieces of data related to a target object; and a data processing unit, configured to receive the plurality pieces of data and set a plurality of adjacent regions in a two-dimensional spatial representation of the plurality pieces of data according to a tolerable compression error. The plurality of regions include an adjacent first region and second region, respectively covering a plurality pieces of data. The data processing unit is configured to forwardly expand the second region to obtain the expanded second region overlapping the first region, calculate a compression error of data covered by the expanded second region, reset the first region and compress the data covered by the reset first region. The data processing system can reduce or minimize the data compression error.
    Type: Application
    Filed: April 23, 2019
    Publication date: March 31, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: Peng ZHANG, Bo WEN, Shun Jie FAN
  • Publication number: 20220073020
    Abstract: The present disclosure provides an on-board cabinet, an autonomous driving device, and a vehicle. The on-board cabinet includes a cabinet body, at least one shock absorbing assembly, and at least one carrier plate. The cabinet body includes an interior providing a space for accommodating, and the shock absorbing assembly and the carrier plate are disposed inside the cabinet body. The shock absorbing assembly includes an adjusting plate and an elastic element, the adjusting plate is vertically disposed inside the cabinet body by the elastic element, and the carrier plate is movably disposed on the adjusting plate.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 10, 2022
    Inventors: Bo WEN, Haifeng WANG, Xiaolei YUAN, Ruifang JIA, Yajia WANG, Ming SUN, Jianan HAO
  • Patent number: 11267482
    Abstract: In an approach to predicting physiological and behavioral states utilizing models representing relationships between driver health states and vehicle dynamics data, one or more computer processors capture one or more vehicle motion parameters. The one or more computer processors to capture one or more physiological parameters; identify contextual data associated with the one or more captured vehicle motion parameters and the one or more captured physiological parameters; predict one or more driving behavior parameters by utilizing one or more physical models fed with the one or more vehicle motion parameters and the identified contextual data; predict one or more driver health parameters by utilizing a model trained with the one or more captured physiological parameters and the identified contextual data; generate a risk assessment based on the one or more predicted driving behavior parameters and the one or more predicted driver health parameters.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: March 8, 2022
    Assignee: International Business Machines Corporation
    Inventors: Julien Monteil, Yassine Lassoued, Sergio Cabrero Barros, Rodrigo Hernan Ordonez-Hurtado, Martin Mevissen, Sergiy Zhuk, Nigel Hinds, Bo Wen, Jeffrey Rogers
  • Patent number: 11222862
    Abstract: Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 ?m to about 100 ?m, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: January 11, 2022
    Assignee: International Business Machines Corporation
    Inventors: Qianwen Chen, Bing Dang, Russell Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah, John Knickerbocker
  • Patent number: 11171374
    Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: November 9, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Qianwen Chen, Bing Dang, John Knickerbocker, Bo Wen
  • Publication number: 20210341999
    Abstract: A head mounted display, including at least one display, an image capture device, a light beam generator, and an optical compensation element, is provided. The display has an open area and generates at least one image light beam. The image capture device is disposed by overlapping with the display corresponding to the open area. The image capture device is configured to capture a target area image through the open area. The light beam generator is configured to project at least one light beam to a target area. The target area reflects the light beam to generate at least one reflection light beam. The optical compensation element is configured to convert a transmission direction of the image light beam and enable the reflection light beam to be directly transmitted to the image capture device.
    Type: Application
    Filed: November 24, 2020
    Publication date: November 4, 2021
    Applicant: HTC Corporation
    Inventors: Bo-Wen Xiao, Fu-Cheng Fan
  • Publication number: 20210318661
    Abstract: A processor controller includes: a deep neutral network, for extracting, based upon feature information of process control data, from a process control data storage device, process control data available to a production device to be controlled, the feature information of the process control data including at least production device feature parameters and a production device load; and an enhanced neural network, for performing, based upon a process control prediction model, process control prediction by using real-time process control data of said production device. In an embodiment, the process control prediction model is trained by using the extracted available process control data. The process controller further includes a process control decision unit, for determining an operation control instruction for the production device based upon the result of process control prediction.
    Type: Application
    Filed: August 14, 2018
    Publication date: October 14, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Zhu NIU, Bo WEN, Shun Jie FAN
  • Publication number: 20210302726
    Abstract: A head mounted display includes a tube, a first light beam generator, a second light beam generator, an image capturer and a controller. The first light beam generator is disposed outside the tube and projects a plurality of first light beams to a first range of a target area. The second light beam generator is disposed inside the tube and projects a second light beam to a second range of the target area. The image capturer captures an image on the target area to generate image information. The controller receives the image information and performs an eye-tracking operation according to the image information. The second range is a center range of the target area, and the first range is a surrounding range of the target area.
    Type: Application
    Filed: March 31, 2020
    Publication date: September 30, 2021
    Applicant: HTC Corporation
    Inventors: Bao-Jen Shih, Bo-Wen Xiao, Fu-Cheng Fan
  • Publication number: 20210305387
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate stack structure formed over a substrate. The gate stack structure includes a gate electrode structure having a first portion and a second portion and a first conductive layer below the gate electrode structure. In addition, the first portion of the gate electrode structure is located over the second portion of the gate electrode structure, and a width of a top surface of the first portion of the gate electrode structure is greater than a width of a bottom surface of the second portion of the gate electrode structure.
    Type: Application
    Filed: June 14, 2021
    Publication date: September 30, 2021
    Inventors: Bo-Wen HSIEH, Wen-Jia HSIEH, Yi-Chun LO, Mi-Hua LIN
  • Publication number: 20210280681
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes etching a dummy gate to form a gate trench to expose a channel portion of a first fin and a first isolation structure; depositing a gate dielectric layer and first and second work function layers, wherein the second work function layer has a first portion directly over the channel portion of the first fin and a second portion directly over the first isolation structure; etching the second portion of the second work function layer, wherein the first portion of the second work function layer remains; depositing a third work function layer over and in contact with the first portion of the second work function layer and the first work function layer; and filling the gate trench with a gate metal.
    Type: Application
    Filed: May 21, 2021
    Publication date: September 9, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Bo-Wen HSIEH, Wen-Hsin CHAN
  • Patent number: 11100325
    Abstract: A method, system and computer program product for improving photographic results by composition analysis using deep-learning neural networks, by: detecting one or more objects in a camera view; classifying the objects to make one or more composition recommendations; and displaying the composition recommendations in the camera view, wherein the camera view is aligned with one of the composition recommendations to take a picture.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: August 24, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Chen Hui Xu, Zhe Yan, Bo Wen Wei
  • Patent number: 11101513
    Abstract: Techniques regarding a thin film battery, which can comprise one or more sealing layers, and a method of manufacturing thereof are provided. For example, one or more embodiments described herein can regard an apparatus that can comprise a thin film battery cell encapsulated in a multi-layer stack comprising an adhesive layer located between a first substrate layer and a second substrate layer. The apparatus can also comprise a metal sealing layer at least partially surrounding the multi-layer stack.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: August 24, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Qianwen Chen, Bing Dang, Bo Wen, Marlon Agno, John Knickerbocker
  • Publication number: 20210232106
    Abstract: The present disclosure provides a method and an apparatus for adjusting a process control prediction model, and a process controller. In an embodiment, the method includes: determining, based on controlled variable data in process control data obtained through real-time monitoring, whether a prediction performance of the process control prediction model is lower than a reference performance; and when the prediction performance is determined to be lower than the reference performance, using manipulated variable data in the process control data monitored to adjust the process control prediction model. By way of the method, a re-test does not need to be executed to re-identify a model so as to eliminate a mismatch of the process control prediction model, thereby eliminating an influence of fluctuation introduced by addition of an excitation signal during the re-testing.
    Type: Application
    Filed: July 13, 2018
    Publication date: July 29, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Bo WEN, Zhu NIU, Shun Jie FAN
  • Patent number: 11055240
    Abstract: A data processing method comprises: if detecting that a number of image data to be transferred is greater than zero wherein the number of image data is a product of a number of input image data and a number of output image data, and a first available storage space of a FIFO memory is greater than or equal to a storage space occupied by an N number of input image data, transferring the N input image data in a first memory to the first FIFO memory; if detecting that a number of weight data to be transferred is greater than zero wherein the number of weight data is a product of the number of input image data and the number of output image data, and a second available storage space of a second FIFO memory is greater than or equal to a storage space occupied by an M number of weight data, transferring the M weight data in a second memory to the second FIFO memory; when the number of input image data cached in the first FIFO memory and the number of weight data cached in the second FIFO memory are greater than or e
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: July 6, 2021
    Assignee: Shenzhen Intellifusion Technologies Co., Ltd.
    Inventors: Bo Wen, Qingxin Cao, Wei Li
  • Patent number: 11043690
    Abstract: Systems and/or techniques associated with a sandwich-parallel micro-battery are provided. In one example, a device comprises a first battery and a second battery. The first battery comprises a first surface and a second surface. The second surface is smaller than the first surface. The second battery comprises a third surface and a fourth surface. The fourth surface is smaller than the third surface. Furthermore, the fourth surface is mechanically coupled to the second surface of the first battery. The third surface of the second battery and the first surface of the first battery comprise a conductive contact that electrically couples the first battery and the second battery.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: June 22, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jae-Woong Nah, Paul S. Andry, Eric Peter Lewandowski, Bucknell C. Webb, Adinath Shantinath Narasgond, Bo Wen
  • Patent number: 11038035
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate stack structure formed over a substrate. The gate stack structure includes a gate electrode structure having a first portion and a second portion and a first conductive layer below the gate electrode structure. In addition, the first portion of the gate electrode structure is located over the second portion of the gate electrode structure, and a width of a top surface of the first portion of the gate electrode structure is greater than a width of a bottom surface of the second portion of the gate electrode structure.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: June 15, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Wen Hsieh, Wen-Jia Hsieh, Yi-Chun Lo, Mi-Hua Lin
  • Publication number: 20210153982
    Abstract: A monolithic dental implant formed from an additive manufacturing method can include a non-porous portion and a porous structure. The porous structure can increase osseointegration of the dental implant and increase the secondary stability.
    Type: Application
    Filed: November 25, 2020
    Publication date: May 27, 2021
    Inventors: James D. Wernle, Esther Moran, Elnaz Ajami, Hai Bo Wen, Cong Fu