Patents by Inventor Boaz Alperson

Boaz Alperson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9318440
    Abstract: Conductive contact structure of a circuit structures and methods of fabrication thereof are provided. The fabrication includes, for instance, providing at least one contact opening disposed over a semiconductor substrate; forming a carbon-rich contact liner material having a set carbon content conformally within the at least one contact opening disposed over the semiconductor substrate.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: April 19, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Huy Cao, Songkram Srivathanakul, Huang Liu, Garo Jacques Derderian, Boaz Alperson
  • Publication number: 20150357285
    Abstract: Conductive contact structure of a circuit structures and methods of fabrication thereof are provided. The fabrication includes, for instance, providing at least one contact opening disposed over a semiconductor substrate; forming a carbon-rich contact liner material having a set carbon content conformally within the at least one contact opening disposed over the semiconductor substrate.
    Type: Application
    Filed: July 14, 2015
    Publication date: December 10, 2015
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Huy CAO, Songkram SRIVATHANAKUL, Huang LIU, Garo Jacques DERDERIAN, Boaz ALPERSON
  • Patent number: 9130019
    Abstract: Conductive contact structure of a circuit structures and methods of fabrication thereof are provided. The fabrication includes, for instance, providing at least one contact opening disposed over a semiconductor substrate; forming a carbon-rich contact liner material including a carbon-containing species and an elemental carbon disposed therein, the carbon-containing species and the elemental carbon together defining a set carbon content within the carbon-rich contact liner material; and depositing the carbon-rich contact liner material conformally within the at least one contact opening disposed over the semiconductor substrate.
    Type: Grant
    Filed: January 8, 2014
    Date of Patent: September 8, 2015
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Huy Cao, Songkram Srivathanakul, Huang Liu, Garo Jacques Derderian, Boaz Alperson
  • Publication number: 20150194342
    Abstract: Conductive contact structure of a circuit structures and methods of fabrication thereof are provided. The fabrication includes, for instance, providing at least one contact opening disposed over a semiconductor substrate; forming a carbon-rich contact liner material including a carbon-containing species and an elemental carbon disposed therein, the carbon-containing species and the elemental carbon together defining a set carbon content within the carbon-rich contact liner material; and depositing the carbon-rich contact liner material conformally within the at least one contact opening disposed over the semiconductor substrate.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 9, 2015
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Huy CAO, Songkram SRIVATHANAKUL, Huang LIU, Garo Jacques DERDERIAN, Boaz ALPERSON
  • Publication number: 20140216547
    Abstract: Thin film photovoltaic devices including a transparent substrate defining a front surface area; a photovoltaic thin film stack on the transparent substrate; and, a back panel defining a rear surface area are provided. The photovoltaic thin film stack is positioned between the transparent substrate and the back panel. The front surface area can be less than the rear surface area (e.g., about 90% to about 99.9% of the rear surface area). As such, the back panel can extend farther than the transparent substrate along at least one edge of the device. An encapsulant layer defining an encapsulant surface area can be positioned between the photovoltaic thin film stack and the back panel. The encapsulant surface area can be greater than or equal to the front surface area or can be less than or equal to the rear surface area.
    Type: Application
    Filed: February 4, 2013
    Publication date: August 7, 2014
    Applicant: PRIMESTAR SOLAR, INC.
    Inventors: Troy Alan Berens, Max William Reed, Jeffrey Scott Erlbaum, David W. Vernooy, Venkata Sai Rahul Chandra Abbaraju, Boaz Alperson