Patents by Inventor Boguslaw A. Swedek

Boguslaw A. Swedek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10565701
    Abstract: A polishing system includes a polishing station including a platen to support a polishing pad, a support to hold a substrate, an in-line metrology station to measure the substrate before or after polishing of a surface of the substrate in the polishing station, and a controller. The in-line metrology station includes a color line-scan camera, a white light source, a frame supporting the light source and the camera, and a motor to cause relative motion between the camera and the support along a second axis perpendicular to the first axis to cause the light source and the camera to scan across the substrate. The controller is configured to receive a color data from the camera, to generate a 2-dimensional color image from the color data, and to control polishing at the polishing station based on the color image.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: February 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Robert D. Tolles, Boguslaw A. Swedek, Abraham Ravid
  • Patent number: 10556315
    Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: February 11, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Ingemar Carlsson, Doyle E. Bennett, Wen-Chiang Tu, Hassan G. Iravani, Tzu-Yu Liu
  • Publication number: 20190358770
    Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Inventors: Hassan G. Iravani, Kun Xu, Denis Ivanov, Shih-Haur Shen, Boguslaw A. Swedek
  • Publication number: 20190283204
    Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 19, 2019
    Inventors: Boguslaw A. Swedek, Dominic J. Benvegnu, Chih Chung Chou, Nicholas Wiswell, Thomas H. Osterheld, Jeonghoon Oh
  • Patent number: 10391610
    Abstract: An apparatus for chemical mechanical polishing includes a support for a polishing pad having a polishing surface, and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core and a coil wound around a portion of the core. The core includes a back portion, a center post extending from the back portion in a first direction normal to the polishing surface, and an annular rim extending from the back portion in parallel with the center post and surrounding and spaced apart from the center post by a gap. A width of the gap is less than a width of the center post, and a surface area of a top surface of the annular rim is at least two times greater than a surface area of a top surface of the center post.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: August 27, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Hassan G. Iravani, Kun Xu, Denis Ivanov, Shih-Haur Shen, Boguslaw A. Swedek
  • Publication number: 20190252274
    Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Boguslaw A. Swedek
  • Publication number: 20190244374
    Abstract: A system for obtaining a measurement representative of a thickness of a layer on a substrate includes a support to hold a substrate, an optical assembly to capture two color images with light impinging the substrate at different angles of incidence, and a controller. The controller is configured to store a function that provides a value representative of a thickness as a function of position along a predetermined path in a coordinate space of at least four dimensions. For a pixel in the two color images, the controller determines a coordinate in the coordinate space from the color data, determines a position of a point on the predetermined path that is closest to the coordinate, and calculates a value representative of a thickness from the function and the position of the point on the predetermined path.
    Type: Application
    Filed: April 18, 2019
    Publication date: August 8, 2019
    Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek
  • Publication number: 20190134775
    Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.
    Type: Application
    Filed: January 4, 2019
    Publication date: May 9, 2019
    Inventors: Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Ingemar Carlsson, Doyle E. Bennett, Wen-Chiang Tu, Hassan G. Iravani, Tzu-Yu Liu
  • Patent number: 10276460
    Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: April 30, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Boguslaw A. Swedek
  • Patent number: 10207386
    Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: February 19, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Kun Xu, Shih-Haur Shen, Boguslaw A. Swedek, Ingemar Carlsson, Doyle E. Bennett, Wen-Chiang Tu, Hassan G. Iravani, Tzu-Yu Liu
  • Patent number: 10199281
    Abstract: A substrate for use in fabrication of an integrated circuit has a layer with a plurality of conductive interconnects. The substrate includes a semiconductor body, a dielectric layer disposed over the semiconductor body, a plurality of conductive lines of a conductive material disposed in first trenches in the dielectric layer to provide the conductive interconnects, and a closed conductive loop structure of the conductive material disposed in second trenches in the dielectric layer. The closed conductive loop is not electrically connected to any of the conductive lines.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: February 5, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Wei Lu, Zhihong Wang, Wen-Chiang Tu, Zhefu Wang, Hassan G. Iravani, Boguslaw A. Swedek, Fred C. Redeker, William H. McClintock
  • Publication number: 20190035699
    Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.
    Type: Application
    Filed: October 2, 2018
    Publication date: January 31, 2019
    Inventors: Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu, Ingemar Carlsson, Boguslaw A. Swedek, Wen-Chiang Tu
  • Publication number: 20180321026
    Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.
    Type: Application
    Filed: June 29, 2018
    Publication date: November 8, 2018
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek
  • Publication number: 20180304435
    Abstract: A method of polishing a layer on the substrate at a polishing station includes the actions of monitoring the layer during polishing at the polishing station with an in-situ monitoring system to generate a plurality of measured signals for a plurality of different locations on the layer; generating, for each location of the plurality of different locations, an estimated measure of thickness of the location, the generating including processing the plurality of measured signals through a neural network; and at least one of detecting a polishing endpoint or modifying a polishing parameter based on each estimated measure of thickness.
    Type: Application
    Filed: April 13, 2018
    Publication date: October 25, 2018
    Inventors: Kun Xu, Hassan G. Iravani, Denis Ivanov, Boguslaw A. Swedek, Shih-Haur Shen, Harry Q. Lee, Benjamin Cherian
  • Patent number: 10105811
    Abstract: An eddy current monitoring system may include an elongated core. One or more coils may be coupled with the elongated core for producing an oscillating magnetic field that may couple with one or more conductive regions on a wafer. The core may be translated relative to the wafer to provide improved resolution while maintaining sufficient signal strength. An eddy current monitoring system may include a DC-coupled marginal oscillator for producing an oscillating magnetic field at a resonant frequency, where the resonant frequency may change as a result of changes to one or more conductive regions. Eddy current monitoring systems may be used to enable real-time profile control.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: October 23, 2018
    Assignee: Applied Materials, Inc.
    Inventors: G. Laurie Miller, Boguslaw A. Swedek, Manoocher Birang
  • Patent number: 10103073
    Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: October 16, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu, Ingemar Carlsson, Boguslaw A. Swedek, Wen-Chiang Tu
  • Patent number: 10086492
    Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 2, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Benjamin Cherian
  • Publication number: 20180203090
    Abstract: A first resistivity value and a correlation function relating thickness of a conductive layer having the first resistivity value to a signal from an in-situ monitoring system are stored. A second resistivity value for a conductive layer on a substrate is received. A sequence of signal values that depend on thickness of the conductive layer is received from an in-situ electromagnetic induction monitoring system that monitors the substrate during polishing. A sequence of thickness values is generated based on the sequence of signal values and the correlation function. For at least some thickness values of the sequence of thickness values adjusted thickness values are generated that compensate for variation between the first resistivity value and the second resistivity value to generate a sequence of adjusted thickness values. A polishing endpoint is detected or an adjustment for a polishing parameter is determined based on the sequence of adjusted thickness values.
    Type: Application
    Filed: January 10, 2018
    Publication date: July 19, 2018
    Inventors: Kun Xu, Ingemar Carlsson, Shih-Haur Shen, Boguslaw A. Swedek, Tzu-Yu Liu
  • Publication number: 20180203089
    Abstract: A first resistivity value and a correlation function relating thickness of a conductive layer having the first resistivity value to a signal from an in-situ monitoring system are stored. A second resistivity value for a conductive layer on a substrate is received. A sequence of signal values that depend on thickness of the conductive layer is received from an in-situ electromagnetic induction monitoring system that monitors the substrate during polishing. A sequence of thickness values is generated based on the sequence of signal values and the correlation function. For at least some thickness values of the sequence of thickness values adjusted thickness values are generated that compensate for variation between the first resistivity value and the second resistivity value to generate a sequence of adjusted thickness values. A polishing endpoint is detected or an adjustment for a polishing parameter is determined based on the sequence of adjusted thickness values.
    Type: Application
    Filed: January 10, 2018
    Publication date: July 19, 2018
    Inventors: Kun Xu, Ingemar Carlsson, Shih-Haur Shen, Boguslaw A. Swedek, Tzu-Yu Liu
  • Patent number: 10012494
    Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: July 3, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek