Abstract: The invention relates to a method in which the "lift-off" technique is used for providing a conductor pattern on a substrate, namely that variation of said technique in which a multilayer mask connected to the surface is used.According to the invention, said technique proves to be particularly suitable to obtain a multilayer conductor pattern the free surface of which of a first conductive sub-layer on the substrate is fully covered by a second conductive sub-layer.

Abstract: A method of manufacturing a device, preferably a semiconductor device, having a pattern of conductors provided on a substrate. According to the invention a pattern of conductors with very fine details can be obtained by providing the pattern in at least two parts and at least two steps, in which in each step an auxiliary layer is provided over the assembly which is patterned so as to correspond with the negative of the part of the pattern of conductors to be provided, after which a conductive layer is provided over the assembly and at least a part of the auxiliary layer with the part of the conductive layer present thereon is then removed.