Patents by Inventor Bok-Hyung Lee

Bok-Hyung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6296988
    Abstract: A method for forming a metal wiring pattern of a semiconductor device. A metal film is first deposited on a semiconductor substrate, then a photoresist pattern is formed on the metal film. The metal film is etched using the photoresist pattern as a mask, then a portion of the photoresist pattern is removed through an under-ashing process. Thereby, the photoresist pattern does not harden and is readily removable. Next, polymer impurity layer formed during the etching act is removed through a chemical wet cleaning process.
    Type: Grant
    Filed: March 4, 1999
    Date of Patent: October 2, 2001
    Assignees: ANAM Semiconductor, Inc., Amkor Technology, Inc.
    Inventor: Bok-Hyung Lee